The present invention relates to a curable petroleum resin, a preparation method therefor, and use thereof, wherein the curable petroleum resin comprises a repeating unit derived from a petroleum resin monomer, a repeating unit derived from a silane monomer and a repeating unit derived from a cyclic anhydride monomer, and wherein the curable petroleum resin is used as an additive for a reactive polyolefin-based adhesive composition to increase the adhesive strength to a polyolefin-based substrate used for various parts.

Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C).

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(In the formula, R.sup.51 is a C1-9 saturated hydrocarbyl group. R.sup.52 is a C10-25 saturated hydrocarbyl group. n.sup.1 and n.sup.2 are numbers that fulfil 0≤n.sup.1<1, 0<n.sup.2≤1, and n.sup.1+n.sup.2=1. m.sup.1 represents an integer from 0 to 3 and m.sup.2 represents an integer from 1 to 3.)

Provided is a photosensitive resin composition that includes: a silicone resin (A) having an epoxy group and/or a phenolic hydroxyl group; an alkyl phenol novolac resin (B) indicated by formula (B); and a photoacid generator (C).

##STR00001##

(In the formula, R.sup.51 is a C1-9 saturated hydrocarbyl group. R.sup.52 is a C10-25 saturated hydrocarbyl group. n.sup.1 and n.sup.2 are numbers that fulfil 0≤n.sup.1<1, 0<n.sup.2≤1, and n.sup.1+n.sup.2=1. m.sup.1 represents an integer from 0 to 3 and m.sup.2 represents an integer from 1 to 3.)

A block copolymer containing a first block having a structure represented by general formula (1) shown below (Rs.sup.01 and Rs.sup.02 each independently represents an organic group, provided that at least one of Rs.sup.01 and Rs.sup.02 has a polar group; and * represents a valence bond). ##STR00001##

A block copolymer containing a first block having a structure represented by general formula (1) shown below (Rs.sup.01 and Rs.sup.02 each independently represents an organic group, provided that at least one of Rs.sup.01 and Rs.sup.02 has a polar group; and * represents a valence bond). ##STR00001##

A hydrophobic or superhydrophobic polymer composite comprising a lattice of poiycyclic aromatic hydrocarbons such as reduced graphene oxide (rGO) modified with at least one siloxane polymer and a method of preparation thereof is disclosed. A method of coating a material comprising immersing a material in a coating solution made from the rGO and siloxane polymer is also disclosed.

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

A wafer laminate has an adhesive layer (2) sandwiched between a support (1) and a wafer (3), with a circuit-forming surface of the wafer facing the adhesive layer. The adhesive layer (2) includes a light-shielding resin layer (2a), an epoxy-containing siloxane skeleton resin layer (2b), and a non-silicone thermoplastic resin layer (2c).

The present invention relates to a poly(arylene sulfide) (PAS) copolymer (P) comprising: at least one block of poly(arylene sulfide) (PAS) having a weight-average molecular weight (Mw) of at least 40,000 g/mol as determined by gel permeation chromatography, and at least one block of polyorganosiloxane (POS) having a weight-average molecular weight (Mw) of at most 5,000 g/mol as determined by gel permeation chromatography, wherein the weight ratio of PAS:POS is from 95:5 to 99.5:0.5.

The present invention provides a resin composition including: (A) a silicone resin containing a constitutional unit shown by the following composition formula (1) and having a weight average molecular weight of 3,000 to 500,000; (B) an epoxy resin-curing agent; and (C) a filler; wherein the mass fraction of the component (C) is 50 to 95% by mass based on the total mass. This can provide a resin composition that can mold a wafer in a lump, has good molding properties particularly to a thin-film wafer having a large diameter, gives low-warping properties, as well as good wafer protection properties, high reliability, and good heat resistance after molding, can perform a molding process favorably, and can be used for wafer level packaging favorably.

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