According to the present invention, a siliceous film forming composition, which is capable of filling trenches having narrow widths and high aspect ratios and forming a thick film, can be provided. A siliceous film forming composition comprising: (a) a block copolymer comprising a linear and/or cyclic block A having a polysilane skeleton comprising 5 or more silicon and a block B having a polysilazane skeleton comprising 20 or more silicon, and (b) a solvent.

A radiation-curable organopolysiloxane composition comprising the components (A), (B) and (C): (A) organopolysiloxane represented by the formula (1), wherein at least one of R.sup.1 is a (meth)acryloyl group-containing organic group, a is an integer of 2 or more, a, b, c and d satisfy an equation, 2≤a+b+c+d≤1,000, and a ratio of the total number of the hydroxyl group and the hydroxyl group-containing organic group to the total number of the (meth)acryloyl group-containing organic group, the hydroxyl group and the hydroxyl group-containing organic group is 0.4 or less; (B) compound having two or more acrylic groups in one molecule in an amount of 0.1 to 50 parts by mass, relative to 100 parts by mass of component (A); and (C) radical polymerization initiator in an amount of 0.1 to 15 parts by mass, relative to 100 parts by mass of component (A).

A radiation-curable organopolysiloxane composition comprising the components (A), (B) and (C): (A) organopolysiloxane represented by the formula (1), wherein at least one of R.sup.1 is a (meth)acryloyl group-containing organic group, a is an integer of 2 or more, a, b, c and d satisfy an equation, 2≤a+b+c+d≤1,000, and a ratio of the total number of the hydroxyl group and the hydroxyl group-containing organic group to the total number of the (meth)acryloyl group-containing organic group, the hydroxyl group and the hydroxyl group-containing organic group is 0.4 or less; (B) compound having two or more acrylic groups in one molecule in an amount of 0.1 to 50 parts by mass, relative to 100 parts by mass of component (A); and (C) radical polymerization initiator in an amount of 0.1 to 15 parts by mass, relative to 100 parts by mass of component (A).

The present invention relates to a composition comprising at least one silicone acrylic copolymer and at least one particular block copolymer. The present invention also relates to a process for treating keratin fibers using a composition comprising at least one silicone acrylic copolymer and at least one particular block copolymer.

The invention pertains to a relates to a copolymer (P1) of poly(aryl ether sulfones) (PAES) and polydimethylsiloxane (PDMS) and to the process for preparing the copolymer (P1) by melt-hydrosilylation.

A thermoset epoxy resin, its preparing composition and making process are disclosed. In particular, the thermoset epoxy resin is glycidyl ether of diphenolic bis-carbamate and formed by curing a one component epoxy composition and has a general structure as shown in formula (1).

A hot melt adhesive composition includes a polyolefin-polydiorganosiloxane block copolymer, a polydiorganosiloxane, and a polyorganosilicate resin. The hot melt adhesive composition is useful in electronic device assembly processes.

A pressure sensitive adhesive article is described comprising a pressure sensitive adhesive in contact with the release layer. The release layer comprises a thermoplastic polymer and a block copolymer additive having the general structure: A[LB]n wherein A is a polyorganosiloxane block, L is a covalent bond or a divalent linking group B is independently a C16-C70 alkyl group, and n is at least 1. In other embodiments, compositions are described comprising a thermoplastic polymer the described block copolymer additive; as well as methods of making a release composition.

A silicone hybrid resin composition contains: (A) 100 parts by mass of a curable organic resin composition containing (A1) one or more curable organic resins selected from an epoxy resin, an acrylic resin, a polyimide resin, a maleimide resin, a polyurethane resin, a phenolic resin, a melamine resin, and silicone-modified resins thereof; and (B) 1 to 300 parts by mass of a curable silicone resin composition having a viscosity at 25° C. of 0.01 to 1,000 Pa.Math.s as measured by a method described in JIS K 7117-1:1999, where the component (B) is a dispersion in the component (A), and the component (A) is a curable organic resin composition that cures by a reaction mechanism that is different from a reaction mechanism of the component (B). The silicone hybrid resin composition can lower a storage modulus and is excellent in adhesiveness to a substrate while maintaining the Tg of an organic resin.

A polyolefin-polydiorganosiloxane block copolymer may be prepared by hydrosilylation reaction.