Provided are use of organosilane, and polyolefin resin and preparation method thereof. The method of preparing the polyolefin resin comprises: conducting olefin polymerization of olefin monomers in the presence of a catalyst, and adding organosilane to a polymerization system before the olefin polymerization and/or during the olefin polymerization, wherein the organosilane is represented by a general formula of R.sup.1.sub.mSiX.sub.n(OR.sup.2).sub.k, wherein R.sup.1 is a C.sub.2-C.sub.20 alkyl, and a terminal of R.sup.1 has an -olefin double bond, a norbornene group, a cycloalkene group, or a dicyclopentadiene group; X is a halogen element; R.sup.2 is a C.sub.1-C.sub.20 straight chain, a C.sub.1-C.sub.20 branched chain, or an isomerized alkyl group; m is an integer from 1-3; n is an integer from 1-3; k is an integer from 0-2; and m, n, and k satisfy the following condition: m+n+k=4. The polyolefin resin obtained by the above method has higher melt strength and mechanical strength.

Disclosed herein is a dielectric composite comprising an organic polymer that has a glass transition temperature greater than or equal to about 250 C.; and a dielectric filler present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25 C. to 300 C., with an applied alternating electric field having a frequency of 10.sup.4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter. Disclosed herein too is a method of manufacturing the dielectric composite and articles that contain the dielectric composite.

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.

A film-forming composition includes a compound including a SiH bond and an orthoester. The compound preferably includes a structural unit that is a structural unit represented by formula (1-1), a structural unit represented by formula (1-2), or a combination thereof. In the formula (1-1) and the formula (1-2), R.sup.1 and R.sup.2 each represent a hydroxy group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; and R.sup.3 represents a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms that bonds to two Si atoms. ##STR00001##

A film-forming composition includes a compound including a SiH bond and an orthoester. The compound preferably includes a structural unit that is a structural unit represented by formula (1-1), a structural unit represented by formula (1-2), or a combination thereof. In the formula (1-1) and the formula (1-2), R.sup.1 and R.sup.2 each represent a hydroxy group, a halogen atom, or a monovalent organic group having 1 to 20 carbon atoms; and R.sup.3 represents a substituted or unsubstituted divalent hydrocarbon group having 1 to 20 carbon atoms that bonds to two Si atoms. ##STR00001##

The present disclosure relates to a protective coating composition for a hard surface, wherein the composition comprises an organic solvent and a polysiloxane having the general formula (I), wherein: R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7 and R.sup.8 are independently an alkyl group having from 1 to 8 carbon atoms; Y and Z are independently a divalent linking group selected from the group consisting of urea, urethane, oxygen atom, sulfur atom and alkylene having from 1 to 8 carbon atoms; A, B, L and M are independently a divalent slinking group selected from the group consisting of alkylene having from 1 to 8 carbon atoms, with the proviso that if the combined linking groups formed by -A-Y-L- and -M-ZB are independently an alkylene, then the alkylene is independently different from ethylene; n is an integer from 5 to 1500; and m and p are independently an integer from 1 to 3. In another aspect, the present disclosure is directed to a method of reducing contamination from a hard surface.

The present disclosures are directed to compositions comprising a polymer having branched silicone substituted by at least one alkylcarboxy group in a free or salt form and cross-linked with an alkyl functional cross-linker, which has the benefits of compatibility with hydrophilic ingredients and particulates in personal care components and the resultant personal care applications.

An organic silicon compound is disclosed which is represented by a formula : (R.sup.1.sub.3SiO).sub.3SiR.sup.2-[SiR.sup.3.sub.2O].sub.y[SiR.sup.3.sub.2].sub.w-R.sup.4-R.sup.5, wherein each of R.sup.1 and R.sup.3 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, R.sup.2 is a divalent hydrocarbon group or an oxygen atom, R.sup.4 is a divalent hydrocarbon group, or a direct bond to a silicon (Si) atom, R.sup.5 is a monovalent group represented by (R.sup.6O).sub.qR.sup.7.sub.(3-q)Si or a monovalent hydrocarbon group having 1 to 20 carbon atoms, and each of R.sup.6 and R.sup.7 is a group independently selected from the group consisting of alkyl groups, alkenyl groups, aryl groups, aralkyl groups and alkoxy groups having 1 to 20 carbon atoms, and q is an integer between 1 and 3, y is an integer between 0 and 200, and w is 0 or 1.

A flame retardant resin composition comprising (A) a silicone resin, (B) a triazine-modified phenol novolak compound, and (C) a filler can be formed in film form. The resin film possesses satisfactory covering or encapsulating performance to large size/thin wafers.