Methods and formulations for modified silicone resins of Formula (I) are presented:

##STR00001##

The R.sup.1, R.sup.2, and R.sup.3 are each independently selected from a group consisting of H, alkyl, alkenyl, alkynyl, and aryl; n ranges from 1 to 10; m ranges from 1 to 200; and p ranges from 2 to 1,000. The elastomeric materials prepared from modified silicone resins display robust mechanical properties following prolonged exposure to high temperatures (e.g., 316 C. or higher).

The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), ##STR00001##
component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

The present invention relates to a resin composition containing components (A), (B), and (C), component (A) being a silicone resin having a weight-average molecular weight of 3,000-500,000 and having constituent units represented by compositional formula (1), ##STR00001##
component (B) being an epoxy resin curing agent, and component (C) being a filler. The present invention is capable of providing a resin film and a resin composition whereby wafers can be molded (wafer molding) in batch fashion, the resin composition having good molding properties with respect to large-diameter thin-film wafers in particular while at the same time imparting low warpage after molding and good wafer-protective ability, the resin composition also facilitating the molding step and being suitable for use in wafer-level packaging.

A hydrophilic silicone polymer composition suitable for use in producing hydrogel polymer films disclosed. In one aspect, a hydrophilic silicone monomer is of the Formula 1:
wA.sub.mB.sub.nw(1)
where A is a divalent block comprising a silicone-containing pendant group. In one embodiment, the silicone-containing pendant group comprises polyalkylene oxide groups. The structure of the polymer can be controlled and tuned to provide a material with excellent wettability and oxygen permeability. The polymers are suitable for use in a variety of applications including in providing a film for forming contact lenses.

A hydrophilic silicone polymer composition suitable for use in producing hydrogel polymer films disclosed. In one aspect, a hydrophilic silicone monomer is of the Formula 1:
wA.sub.mB.sub.nw(1)
where A is a divalent block comprising a silicone-containing pendant group. In one embodiment, the silicone-containing pendant group comprises polyalkylene oxide groups. The structure of the polymer can be controlled and tuned to provide a material with excellent wettability and oxygen permeability. The polymers are suitable for use in a variety of applications including in providing a film for forming contact lenses.

A composition for forming a coating type silicon-containing film, containing one or more silicic acid skeletal structures represented by the formula (1) and one or more silicon skeletal structures represented by the formula (2), wherein the composition contains a coupling between units shown in the formula (2). There can be provided a composition capable of forming a silicon-containing film that has excellent adhesiveness in fine patterning, and can be easily wet etched by a removing liquid which does not cause damage to a semiconductor substrate and a coating type organic film or a CVD film mainly of carbon which is required in the patterning process. ##STR00001##

A composition for forming a coating type silicon-containing film, containing one or more silicic acid skeletal structures represented by the formula (1) and one or more silicon skeletal structures represented by the formula (2), wherein the composition contains a coupling between units shown in the formula (2). There can be provided a composition capable of forming a silicon-containing film that has excellent adhesiveness in fine patterning, and can be easily wet etched by a removing liquid which does not cause damage to a semiconductor substrate and a coating type organic film or a CVD film mainly of carbon which is required in the patterning process. ##STR00001##

Provided are: an organopolysiloxane capable of achieving intended low fuel consumption properties and significantly reducing hysteresis loss in the cured product of a rubber composition during tire production; a rubber compounding agent comprising said organopolysiloxane; a rubber composition obtained by blending said rubber compounding agent; and a tire formed using said rubber composition. The organopolysiloxane, which is represented by average compositional formula (1), is characterized in: containing an organic group with a sulfide group; and the sulfide equivalents being 1,000 g/mol or less.

(A).sub.a(B).sub.b(C)c(R.sup.1).sub.dSiO.sub.(4-2a-b-c-d)/2 (1)

(In the formula, A is a sulfide group-containing divalent organic group, B is a C5 to C10 monovalent hydrocarbon group, C is a hydrolyzable group and/or a hydroxyl group, R.sup.1 is a C1 to C4 monovalent hydrocarbon group, and for a, b, c and d, 0<2a<1, 0<b<1, 0<c<3, 0d<2, and 0<2a+b+c+d<4.)

Provided are: an organopolysiloxane capable of achieving intended low fuel consumption properties and significantly reducing hysteresis loss in the cured product of a rubber composition during tire production; a rubber compounding agent comprising said organopolysiloxane; a rubber composition obtained by blending said rubber compounding agent; and a tire formed using said rubber composition. The organopolysiloxane, which is represented by average compositional formula (1), is characterized in: containing an organic group with a sulfide group; and the sulfide equivalents being 1,000 g/mol or less.

(A).sub.a(B).sub.b(C)c(R.sup.1).sub.dSiO.sub.(4-2a-b-c-d)/2 (1)

(In the formula, A is a sulfide group-containing divalent organic group, B is a C5 to C10 monovalent hydrocarbon group, C is a hydrolyzable group and/or a hydroxyl group, R.sup.1 is a C1 to C4 monovalent hydrocarbon group, and for a, b, c and d, 0<2a<1, 0<b<1, 0<c<3, 0d<2, and 0<2a+b+c+d<4.)

The present application relates to a cured product and the use thereof. When the cured product, for example, is applied to a semiconductor device such as an LED or the like, the decrease in brightness may be minimized even upon the long-term use of the device, and since the cured product has excellent cracking resistance, the device having high long-term reliability may be provided. The cured product has excellent processability, workability, and adhesive properties or the like, and does not cause whitening and surface stickiness, etc. Further, the cured product exhibits excellent heat resistance at high temperature, gas barrier properties, etc. The cured product may be, for example, applied as an encapsulant or an adhesive material of a semiconductor device.