The present disclosures are directed to compositions comprising a polymer having linear or branched silicone substituted by at least one alkylcarboxy group and cross-linked with an alkyl functional cross-linker, which has the benefits of compatibility and structuring of personal care components and the resultant personal care applications.

The present disclosures are directed to compositions comprising a polymer having branched silicone substituted by at least one alkylcarboxy group in a free or salt form and cross-linked with an alkyl functional cross-linker, which has the benefits of compatibility with hydrophilic ingredients and particulates in personal care components and the resultant personal care applications.

Disclosed herein is a dielectric composite comprising an organic polymer that has a glass transition temperature greater than or equal to about 250° C.; and a dielectric filler present in an amount effective to impart to the dielectric composite a dielectric constant that varies by less than 5% over a temperature range of 25 ° C. to 300° C., with an applied alternating electric field having a frequency of 10.sup.4 Hz and a maximum operating electric field strength of at least 250 megavolt per meter. Disclosed herein too is a method of manufacturing the dielectric composite and articles that contain the dielectric composite.

The present invention aims to provide a curable resin composition which has low viscosity as well as properties such as high elongation property, high tensile strength, and hydrogen gas barrier property. A curable resin composition includes the following ingredients (A) to (D): ingredient (A): a vinyl polymer having one or more alkenyl groups in one molecule; ingredient (B): a compound having one or more hydrosilyl groups in one molecule; ingredient (C): a hydrosilylation catalyst; ingredient (D): a polyfunctional vinyl ether compound.

A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.

A polymer comprising polysiloxane, silphenylene, isocyanuric acid, and norbornene skeletons in a backbone and having an epoxy group in a side chain is provided. A photosensitive resin composition comprising the polymer and a photoacid generator is coated to form a film which can be patterned using radiation of widely varying wavelength. The patterned film has high transparency, light resistance, and heat resistance.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

A dual cure (condensation and free radical reaction) adhesive composition is useful for electronics applications.

The invention relates to the use of a polymer for improving the clean-ability of a surface coating or for reducing the dirt pick up of a surface coating, wherein the polymer is a a non-crosslinked polymer having a polymer main chain comprising i) polysiloxane segments comprising repeating units of the formula (I) wherein R 1 independent of each occurrence represents a hydrocarbyl group and n is an integer in the range of 6 to 150, and ii) non-polysiloxane segments having at least one functional group comprising at least one of hydroxyl group, acryloyl group, methacryloyl group, acetyl group, urethane group, and methyl ether group, wherein the number of links between non-polysiloxane segments and polysiloxane segments in the polymer is less than 9.5%, calculated on the average number of silicon atoms per polysiloxane segment, and wherein at least one non-polysiloxane segment is located between two polysiloxane segments.

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Provided are use of organosilane, and polyolefin resin and preparation method thereof. The method of preparing the polyolefin resin comprises: conducting olefin polymerization of olefin monomers in the presence of a catalyst, and adding organosilane to a polymerization system before the olefin polymerization and/or during the olefin polymerization, wherein the organosilane is represented by a general formula of R.sup.1.sub.mSiX.sub.n(OR.sup.2).sub.k, wherein R.sup.1 is a C.sub.2-C.sub.20 alkyl, and a terminal of R.sup.1 has an -olefin double bond, a norbornene group, a cycloalkene group, or a dicyclopentadiene group; X is a halogen element; R.sup.2 is a C.sub.1-C.sub.20 straight chain, a C.sub.1-C.sub.20 branched chain, or an isomerized alkyl group; m is an integer from 1-3; n is an integer from 1-3; k is an integer from 0-2; and m, n, and k satisfy the following condition: m+n+k=4. The polyolefin resin obtained by the above method has higher melt strength and mechanical strength.