A laminate having a semiconductor substrate, a support substrate, and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate, wherein the release layer is a film formed from a releasing agent composition containing an organic resin, a branched-chain polysilane, and a solvent.

An insulation material includes a matrix comprising a reaction product formed from a silicon carbide precursor resin and a silicon dioxide precursor resin. At least one filler, such as hollow glass microspheres and/or carbon fiber is dispersed within the matrix. A rocket motor includes a case, the insulation material within and bonded to the case, and a solid propellant within the case. An insulation precursor includes a silicon carbide precursor resin, a silicon dioxide precursor resin, and the at least one filler. Related methods are also disclosed.

A method for manufacturing a part made of composite material includes forming a ceramic matrix phase in pores of a fibrous preform by pyrolysis of a cross-linked copolymer ceramic precursor, the cross-linked copolymer including a first precursor macromolecular chain of a first ceramic having free carbon, and a second precursor macromolecular chain of a second ceramic having free silicon, the first macromolecular chain being bonded to the second macromolecular chain by cross-linking bridges including a bonding structure of formula *.sup.1—X—*.sup.2; in this formula, X designates boron or aluminium, -*.sup.1 designates the bond to the first macromolecular chain and -*.sup.2 the bond to the second macromolecular chain.

A photosensitive resin composition comprising a polymer containing a silphenylene skeleton and a fluorene skeleton and having a crosslinkable site in the molecule, a phenol compound having a Mw of 300-10,000, a photoacid generator, and a benzotriazole or imidazole compound has improved film properties. Even from a thick film, a fine size pattern can be formed.

This organopolysiloxane composition, when cured at room temperature by moisture in the atmosphere, provides a silicone rubber cured product having good self-adhesiveness to a magnesium alloy. The organopolysiloxane composition contains (A) an organopolysiloxane having a hydroxy group and/or a hydrolysable silyl group at both ends of the molecular chain, (B) an organic silicon compound other than (A) and (C), having at least three hydrolysable groups bonded to a silicon atom per molecule, and/or a partial hydrolysis-condensation product thereof, and (C) a silane coupling agent having a specific molecular structure having a carboxylic acid silyl ester bond. Furthermore, a novel compound, having an alkoxysilyl group and a carboxylic acid silyl ester group per molecule, can have improved adhesiveness/bonding properties with respect to a base material due to the effect of carboxylic acid after hydrolysis thereof.

Si-containing film forming compositions are disclosed comprising a precursor having the formula [—NR—R.sup.4R.sup.5Si—(CH.sub.2).sub.t—SiR.sup.2R.sup.3—].sub.n wherein n=2 to 400; R, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 are independently H, a hydrocarbon group, or an alkylamino group, and provided that at least one of R.sup.2, R.sup.3, R.sup.4, and R.sup.5 is H; and R is independently H, a hydrocarbon group, or a silyl group. Exemplary pre-cursors include, but are not limited to, [—NH—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n, and [—N(SiH.sub.2—CH.sub.2—SiH.sub.3)—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n.

Si-containing film forming compositions are disclosed comprising a precursor having the formula [—NR—R.sup.4R.sup.5Si—(CH.sub.2).sub.t—SiR.sup.2R.sup.3—].sub.n wherein n=2 to 400; R, R.sup.2, R.sup.3, R.sup.4, and R.sup.5 are independently H, a hydrocarbon group, or an alkylamino group, and provided that at least one of R.sup.2, R.sup.3, R.sup.4, and R.sup.5 is H; and R is independently H, a hydrocarbon group, or a silyl group. Exemplary pre-cursors include, but are not limited to, [—NH—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n, and [—N(SiH.sub.2—CH.sub.2—SiH.sub.3)—SiH.sub.2—CH.sub.2—SiH.sub.2—].sub.n.

An example system is used to mix components and dispense a mixture for forming a thiol-ene polymer article. The system includes a first reservoir containing a first component of the thiol-ene polymer including a first polymerizable compound, and a second reservoir containing a second component of the thiol-ene polymer including a second polymerizable compound. The system also includes a mixing vessel having a mixing chamber, a delivery manifold providing a conduit for fluid from the first and second reservoirs to the mixing vessel, and a dispensing manifold providing a conduit for fluid from the mixing vessel. The system also includes a control module programmed to control the operation of the system.

An example system is used to mix components and dispense a mixture for forming a thiol-ene polymer article. The system includes a first reservoir containing a first component of the thiol-ene polymer including a first polymerizable compound, and a second reservoir containing a second component of the thiol-ene polymer including a second polymerizable compound. The system also includes a mixing vessel having a mixing chamber, a delivery manifold providing a conduit for fluid from the first and second reservoirs to the mixing vessel, and a dispensing manifold providing a conduit for fluid from the mixing vessel. The system also includes a control module programmed to control the operation of the system.

A dihaloorganosilane is represented by the formula (I): Each X independently represents Cl, Br, or I. Each Ar.sup.1 independently represents a phenylene group optionally substituted by 1 to 4 alkyl groups selected from methyl or ethyl. Each R.sup.1 independently represents an alkylene group having from 2 to 18 carbon atoms. Each R.sup.2 independently represents methyl or ethyl. Each R.sup.3 independently represents an alkylene group having from 1 to 18 carbon atoms. Each R.sup.4 independently represents an alkylene group having from 2 to 18 carbon atoms, and n is an integer in a range of 0 to 5, inclusive. Ionic organosilanes preparable from the dihaloorganosilanes are represented by the formula (II): Membrane compositions and membranes containing the ionic organosilanes are also disclosed.

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