A curable silicone composition of the present invention contains certain quantities of straight-chain organopolysiloxane which has at least two alkenyl groups and bound to silicon atoms and ≥0 mol % and <5 mol % of aryl groups per molecule, organopolysiloxane resin having at least two alkenyl groups bound to a silicon atom in the molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, only at the end of the molecule, and hydrosilylation reaction catalyst, and (total mols of silicon-atoms-bound) hydrogen atoms/(total mols of silicon-atom-bound alkenyl groups) in the organopolysiloxane in the composition=1-3.

Moisture-curing coating compositions, processes for making the same and uses for the same. The composition includes a Component (A) of one or more linear hydroxyl terminated organopolysiloxanes, a Component (B) of one or more organopolysiloxane resins, a Component (C) of one or more organosilicates, a Component (C) of one or more organosilicates, a Component (D) of one or more alkoxysilanes having at least one tertiary amino group, a Component (E) of one or more alkoxysilanes having at least one primary or secondary amino group and a Component (F) of one or more UV-fluorescent pigments. Where the one or more alkoxysilanes having at least one tertiary amino groups (D) have the following general formula (IV) R.sup.3R.sup.4N—(CR.sup.5.sub.2)—Si(R.sup.2).sub.3-x(OR.sup.1).sub.x.

A curable silicone adhesive composition comprising a heat stable siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.

A condensation curable silicone adhesive composition comprising a condensation curable organopolysiloxane, siloxane-imide crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.

A composition contains an organopolysiloxane having the average chemical structure (I):
[R′R.sub.2SiO—(R.sub.2SiO).sub.m].sub.3—Si—[OSiR.sub.2].sub.n—Y—Si(OR).sub.3  (I)
where: R is independently in each occurrence selected from alkyl, aryl, substituted alkyl and substituted alkyl groups having from one to 8 carbon atoms; R′ is independently in each occurrence selected from R and terminally unsaturated alkylene groups having from 2 to 6 carbon atoms; Y is selected from a group consisting of: X, and X—(R.sub.2SiO).sub.pSiR.sub.2—X; where p has an average value in a range of one to 3; and X is independently in each occurrence selected from alkylene and substituted alkylene groups having from one to 6 carbon atoms; and the average values for subscripts m and n are each greater than zero and independently selected so that the average value for the sum of all of the average m values and the average n value is in a range of 30-200.

A methylpolysiloxane mixture along with uses and methods for operating a solar thermal power station (or CSP plant) utilizing the same. The use for the methylpolysiloxane mixture includes providing a mixture (a) wherein the methylpolysiloxane mixture includes a linear methylpolysiloxanes MD.sub.xM, wherein x is an integer with 0≤x≤100, and wherein the mixtures have a molar M:D ratio of 1:15.5 to 1:30; or (b) wherein the methylpolysiloxane mixture includes a linear methylpolysiloxanes MD.sub.xM, wherein x is an integer with 0≤x≤80 and cyclic dimethylpolysiloxanes D.sub.y where y is an integer≥3, wherein the sum of the fractions of all cyclic dimethylpolysiloxanes D.sub.y is 10-95 wt %, and wherein the mixtures have a molar M:D ratio of 1:10.5 to 1:30. The methylpolysiloxane mixture is used as a heat transfer fluid in a CSP plant with operating temperatures in a range of 300 to 500° C.

Composition of comprising nano metal oxide/hydroxide particles and a polyorganosiloxane having increased refractive index, processes to cure these compositions for making transparent coats, shaped articles by an extrusion or molding process having a refractive index above the refractive index of the polyorganosiloxane. Use of the cured polyorganosiloxane compositions as optical devices, coats, lenses or light guides.

To provide a siloxane polymer containing a silsesquioxane unit and a chain siloxane unit in the main chain and having a reactive group. A siloxane polymer containing a repeating unit represented by Formula (1): ##STR00001## R.sup.0's independently represent C.sub.6-20 aryl or C.sub.5-6 cycloalkyl; R.sup.1 independently represent a hydrogen atom, C.sub.6-20 aryl, C.sub.5-6 cycloalkyl, C.sub.7-40 arylalkyl, or C.sub.1-40 alkyl; R.sup.2, R.sup.4, and R.sup.6 independently represent C.sub.6-20 aryl, C.sub.5-6 cycloalkyl, C.sub.7-40 arylalkyl, or C.sub.1-40 alkyl; R.sup.3 represents a monovalent group having a reactive group; R.sup.5's independently represent C.sub.6-20 aryl, C.sub.5-6 cycloalkyl, C.sub.7-40 arylalkyl, C.sub.1-40 alkyl, or C.sub.1-20 alkoxy; y1, y2, and z are an integer of 0 to 30; g′ is 0 or 1; and, in the case of y1=y2=z=0, at least one terminal is the group represented by Formula (2).

A composition contains a blend of linear and resinous alkenyl functionalized polyorganosiloxanes, a blend of linear and resinous silyl hydride functionalized polyorganosiloxanes, and a hydrosilylation catalyst where the linear silyl hydride functionalized polyorganosiloxanes has a ratio of D/D.sup.H that is greater than 2.0 and less than 14, the molar and the ratio of silyl hydride hydrogens to the sum of terminal alkenyl functionality on the alkenyl functionalized polyorganosiloxane is 1.2-2.2.

A condensation curable silicone adhesive composition comprising a siloxane-imide base polymer, condensation curable organopolysiloxane crosslinker, a condensation catalyst and an additive is shown and described herein. The composition is curable at relatively room temperatures and shows good heat stability.