A resist underlayer film-forming composition including: (A) component: an isopoly or heteropoly acid, or a salt thereof, or a combination thereof; and (B) component: polysiloxan, poly hafnium oxide or zirconium oxide, or a combination thereof, wherein an amount of the (A) component is 0.1 to 85% by mass of a total amount of the (A) component and the (B) component; and polysiloxan is a hydrolysis-condensation product of hydrolyzable silane of Formula (1):
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b)  Formula (1)
and a hydrolyzable silane whose (a+b) is 0 is contained in a proportion of 60 to 85 mol % of a total hydrolyzable silane in Formula (1); the poly hafnium oxide is a hydrolysis-condensation product of hydrolyzable hafnium of Formula (2):
Hf(R.sup.4).sub.4  Formula (2)
and the zirconium oxide is a hydrolysis-condensation product of hydrolyzable zirconium of Formula (3) or Formula (4):
Zr(R.sup.5).sub.4  Formula (3)
ZrO(R.sup.6).sub.2  Formula (4)
or a hydrolysis-condensation product of a combination thereof.

A method for the production of a sol-gel based matrix resulting in a sol-gel based matrix with high stability and high porosity. The sol-gel based material may be used for the production of a composite or sensor suitable for monitoring analytes.

A curable silicone resin composition according to the present invention includes at least the following components: (A) a silicone resin having a hydrogen atom bonded to silicon atom (as SiH group); (B) a silicone resin having a vinyl group bonded to silicon atom (as Si—CH═CH.sub.2 group); and (C) a platinum catalyst, wherein the total amount of silanol (Si—OH) group in the components (A) and (B) is 0.5 to 5.0 mmol/g; and wherein the amount of platinum in the component (C) relative to the total mass of the components (A), (B) and (C) is 0.003 to 3.0 ppm in mass units. A cured product obtained by heating the composition is suitably usable as an encapsulant of an optical semiconductor device.

Provided is a resin composition for imprinting excellent in imprint properties and optical properties such as high refractive index and low haze. The invention relates to a resin composition for imprinting containing: (A) a polysiloxane resin represented by the following formula (1): (R.sup.1SiO.sub.3/2).sub.a(R.sup.2.sub.2SiO.sub.2/2).sub.b(R.sup.3.sub.3SiO.sub.1/2).sub.c(SiO.sub.4/2).sub.d wherein R.sup.1, R.sup.2, and R.sup.3 are each independently a hydrogen atom, a hydroxy group, an alkoxy group, a C1-C12 hydrocarbon group, or a C1-C12 substituent having one or more crosslinkable functional groups, with at least one of R.sup.1, R.sup.2, or R.sup.3 being a C1-C12 substituent having one or more crosslinkable functional groups, and when a plurality of R.sup.1s, R.sup.2s, or R.sup.3s are present, they may be different from one another; and a, b, c, and d are numbers satisfying the following conditions: 0.001≤a≤1.00, 0≤b≤0.999, 0≤c≤0.30, 0≤d≤0.30, and a+b+c+d=1.0; and (B) a fine particulate inorganic oxide, wherein the ratio by weight of the sum of the polysiloxane resin (A) and optionally an alkoxysilane compound and a curable resin to the fine particulate inorganic oxide (B) is 0.2 to 2.5.

The present application relates to cleaning and treatment compositions comprising a material that reduces foam and methods of making and using such material and compositions. Such compositions comprise benefit agents that typically impact the performance of antifoams yet in the present compositions antifoaming properties of antifoams are maintained.

Compositions are provided which comprises an active hydrogen-containing resin, a flexibilizer and at least one curing agent. The cured compositions possess enhanced flexibility while maintaining hardness, and are highly suitable for applications such as coatings, adhesives, sealants, gaskets, industrial rubber goods, and the like.

A curable silicone composition is disclosed. The curable silicone composition comprises: (A) a linear organopolysiloxane having at least two silicon atom-bonded alkenyl groups per molecule, wherein at least 5 mole % of all silicon atom-bonded organic groups are aryl groups; (B) an organopolysiloxane containing siloxane units represented by the general formula R.sup.1.sub.3SiO.sub.1/2 where each R.sup.1 represents an independently selected monovalent hydrocarbon group, and siloxane units represented by the general formula SiO.sub.4/2, wherein the amount of alkenyl groups is at least 6% by weight; (C) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product with little weight reduction, little change in hardness, and little crack generation after thermal aging.

The present disclosure provides hydrosilylation curable compositions comprising resin linear organosiloxane block copolymers comprising, among other things, from about 0.5 to about 5 mole % C.sub.1 to C.sub.30 hydrocarbyl group comprising at least one aliphatic unsaturated bond. Such hydrosilylation curable resin-linear organosiloxane block copolymers have significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, particularly devices having tall structures.

A composition includes a solvent, a catalyst, a polysiloxane including methyl and phenyl pendant groups, and a crosslinker comprising at least one of a phenylene disilyl group and para-disilyl phenylene group. Exemplary crosslinkers include bis silyl benzene, bis alkoxysilane, 1,3 bistriethoxysilyl benzene, and 1,4 bistriethoxysilyl benzene 2,6-bis(triethoxysilyl)-naphthalene, 9,10-bis(triethoxysilyl)-anthracene, and 1,6-bis(trimethoxysilyl)-pyrene.

Disclosed are organomodified polysiloxanes, compositions, in particular fuel compositions, that include these organomodified polysiloxanes, and the use of the organomodified polysiloxanes for the defoaming of fuels.