Patent classifications
C08G77/80
High purity SiOC and SiC, methods compositions and applications
Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Processes and articles utilizing such high purity SiOC and SiC.
FILM-FORMING COMPOSITION
A film-forming composition including one selected from among a hydrolyzable silane compound, a hydrolysate of the compound, and a hydrolysis condensate of the compound, and a solvent, the film-forming composition wherein: the hydrolyzable silane compound contains a hydrolyzable silane having a cyano group in the molecule and being of the following Formula (1):
R.sup.1.sub.aR.sup.2.sub.bSi(R.sup.3).sub.4−(a+b) (1)
(wherein R.sup.1 is a group bonded to a silicon atom and is an organic group containing a cyano group; R.sup.2 is a group bonded to a silicon atom via an Si—C bond, and is each independently a substitutable alkyl group, etc.; R.sup.3 is a group or atom bonded to a silicon atom, and is each independently a hydroxy group, an alkoxy group, an aralkyloxy group, an acyloxy group, or a halogen atom; a is an integer of 1; b is an integer of 0 to 2; and a+b is an integer of 1 to 3).
POLYORGANOSILOXANE RELEASE COATING AND ITS PREPARATION AND USE
Provided is a curable polyorganosiloxane release coating composition comprising: A) a branched aliphatically unsaturated polyorganosiloxane, B) a crosslinker having at least 3 silicon bonded hydrogen atoms per molecule, C) a hydrosilylation reaction catalyst, D) a hydrosilylation reaction inhibitor, and E) an aryl-functional polydiorganosiloxane having a content of aliphatically unsaturated groups. Also provided are a release liner (100) with this coating (101) and the preparation method thereof.
SILICONE RUBBER COMPOSITION, SILICONE RUBBER CROSSLINKED BODY, AND SEALANT
Provided is a silicone rubber composition that allows for both the securing of time for filling materials and an improvement in productivity which is achievable due to a short curing time, and that has excellent reproducibility of curing properties. The silicone rubber composition contains (a) an organopolysiloxane having an alkenyl group, (b) a peroxide cross-linking agent, and (c) a heat stabilizer, wherein (c) includes a compound represented by general formula (1). In formula (1), R.sub.1 represents hydrogen or a methyl group, R.sub.2, R.sub.3, R.sub.4, and R.sub.5, each independently represent a C1-9 alkyl group, and R.sub.6 represents hydrogen or a methyl group.
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POLYSILOCARB BASED SILICON CARBIDE MATERIALS, APPLICATIONS AND DEVICES
Organosilicon chemistry, polymer derived ceramic materials, and methods. Such materials and methods for making polysilocarb (SiOC) and Silicon Carbide (SiC) materials having 3-nines, 4-nines, 6-nines and greater purity. Processes and articles utilizing such high purity SiOC and SiC.
NOVEL ETCHING PATTERN FORMING METHOD IN SEMICONDUCTOR MANUFACTURING PROCESS
The present disclosure relates to a method of forming an etching pattern in a semiconductor manufacturing process. Unlike a conventional method of forming a four-layer structure composed of a photoresist film, an anti-reflective film, a SiON film, and an organic hard mask film on a wafer, as preparation for an etching process, the method according to the present disclosure is an innovative etching pattern forming method capable of implementing the same etching pattern as is formed by the conventional method, using a double-layer structure composed of a photoresist film and a multifunctional organic-inorganic mask film.
METHODS FOR PRODUCING POLYCARBONATE COPOLYMER AND POLYSILOXANE COMPOUND, POLYCARBONATE COPOLYMER, POLYSILOXANE COMPOUND, COMPOSITION, AND MOLDED BODY
A method for producing a polycarbonate copolymer which has siloxane constituent units represented by any of formulae (1-1) to (1-4) and prescribed polycarbonate constituent units, the method having a polymerization step for polymerizing a silane-based compound selected from among a prescribed diaryloxysilane compound, a prescribed dialkoxysilane compound and a prescribed silicon compound, a carbonate compound and a diol compound such as an aromatic diol compound or an alicyclic diol compound in the presence of a transesterification catalyst. The polymerization step is carried out in a molten state under reduced pressure while removing alcohols derived from the carbonate compound.
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FLUOROSILICONE COPOLYMERS
Described herein, inter alia, are fluorosilicone polymers and copolymers; compositions comprising fluorosilicone polymers and copolymers; lenses, such as intraocular lenses, comprising fluorosilicone polymers and copolymers; and processes for making the fluorosilicone polymers and copolymers.
COMPOSITION FOR ACOUSTIC LENS, ACOUSTIC LENS, ACOUSTIC WAVE PROBE, ULTRASOUND PROBE, ACOUSTIC WAVE MEASUREMENT APPARATUS, ULTRASOUND DIAGNOSTIC APPARATUS, PHOTOACOUSTIC WAVE MEASUREMENT APPARATUS AND ULTRASONIC ENDOSCOPE, AND METHOD FOR MANUFACTURING ACOUSTIC WAVE PROBE
A composition for an acoustic lens contains the following components (A) to (C): (A) a polysiloxane having a vinyl group; (B) a polysiloxane having two or more Si—H groups in a molecular chain thereof; and (C) zinc oxide surface-treated with at least one surface treatment agent of an aminosilane compound, a mercaptosilane compound, an isocyanatosilane compound, a thiocyanatosilane compound, an aluminum alkoxide compound, a zirconium alkoxide compound, or a titanium alkoxide compound, provided that the aminosilane compound does not have a Si—N—Si structure.
Temporary adhesive containing phenyl group-containing polysiloxane
An adhesive for separatably attaching a support to a circuit side of a wafer to process a rear surface of the wafer, the adhesive including a component (A) that is cured by a hydrosilylation reaction and a component (B) containing a phenyl group-containing polyorganosiloxane, wherein a ratio in % by mass of the component (A) to the component (B) is 95:5 to 30:70. A separation method including applying the adhesive onto a first body to form an adhesion layer, attaching a second body to the adhesion layer, heating the adhesion layer from a side of the first body to cure the adhesive to form a layered body, processing the layered body, and carrying out separation between the adhesion layer, and the first and second bodies. The processing may be polishing the rear surface of the wafer.