The present invention provides a thermally conductive composition in which the flexibility of the thermally conductive composition is not impaired, and even when cured into a thermally conductive molded body, good bendability, an excellent handling property, and excellent thermal conductivity are exhibited, and provides a molded body of the thermally conductive composition. A thermally conductive composition, in which a thermally conductive filler is contained in a polymer matrix, includes a methyl phenyl silicone, characterized in that the thermally conductive filler has an average particle size of 10 to 100 μm, the content of the thermally conductive filler in the thermally conductive composition is 70% to 90% by volume, and 30% to 80% by volume of the thermally conductive filler has a particle size of 40 μm or more. A thermally conductive molded body is formed of a cured body of the thermally conductive composition.

There is provided a silicon compound represented by General Formula (x). There is also provided a reactive material containing a silicon compound represented by General Formula (x). In General Formula (x), in a case where a plurality of R.sup.1's are present, R.sup.1's are each independently a linear alkyl group having 1 to 10 carbon atoms, a branched alkyl group having 3 to 10 carbon atoms, a cyclic alkyl group having 3 to 10 carbon atoms, a linear alkenyl group having 2 to 10 carbon atoms, a branched alkenyl group having 3 to 10 carbon atoms, or a cyclic alkenyl group having 3 to 10 carbon atoms, where all or part of hydrogen atoms in the alkyl group or the alkenyl group may be substituted with a fluorine atom, in a case where a plurality of R.sup.2's are present, R.sup.2's are each independently a linear alkyl group having 1 to 4 carbon atoms or a branched alkyl group having 3 or 4 carbon atoms, where all or part of hydrogen atoms in the alkyl group may be substituted with a fluorine atom, R.sup.A is an acid unstable group; a is an integer of 1 to 3, b is an integer of 0 to 2, and c is an integer of 1 to 3, where a+b+c=4 is satisfied; and n is an integer of 1 to 5.

##STR00001##

A curable silicone rubber composition of the type referred to in industry as “self-adhesive” or as having “selective adhesion” (hereafter referred to as “curable self-adhesive silicone rubber compositions”). The curable self-adhesive silicone rubber compositions comprise: (A) one or more organopolysiloxanes containing at least 2 alkenyl groups and/or alkynyl groups per molecule and having a viscosity in a range of 1000 mPa.Math.s to 200,000 mPa.Math.s at 25° C.; (B) an organopolysiloxane containing at least 2 or 3 silicon-bonded hydrogen atoms per molecule; (C) at least one hydrosilylation catalyst; (D) at least one reinforcing and optionally one or more non-reinforcing fillers; (E) an adhesion promoter; and (F) an oligomer which has been found to surprisingly provide heat-humidity stabilization.

A UV curable silicone composition has exceptional curability by ultraviolet irradiation. The UV curable silicone composition includes (A) an organopolysiloxane composition selected from the following: (A-1) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with alkenyl groups and/or a branched organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, and an organopolysiloxane containing at least 2 thiol groups in side-chains of the molecular chain, wherein the thiol group content is 1% by mass or more per molecule, (A-2) an organopolysiloxane composition comprising a linear organopolysiloxane in which both ends of the molecular chain are capped with thiol groups, wherein the thiol group content is 1% by mass or more per molecule, and an organopolysiloxane containing at least 2 alkenyl groups in side-chains of the molecular chain and/or a resinous organopolysiloxane containing at least 2 alkenyl groups at the ends of the molecular chain, or (A-3) an organopolysiloxane composition comprising an alkenyl group- and aryl group-containing organopolysiloxane and a multifunctional thiol compound, but furthermore comprising an alkenyl group-containing resinous organopolysiloxane when the multifunctional thiol compound contains only a bifunctional thiol compound, and (B) a silicone-compatible photo-initiator comprising a compound selected from the following: (B-1) an alpha-hydroxyacetophenone, (B-2) a combination of an alpha-hydroxyacetophenone and an alpha-aminoalkylphenone, or (B-3) a combination of an alpha-hydroxyacetophenone and a mono-acylphosphine oxide, wherein the ratio between the thiol groups and alkenyl groups (SH/Vi ratio) included in the organopolysiloxane composition is 0.6 or more.

Hotmelt silicone compositions are provided including: (A) a resinous alkenyl group-containing organopolysiloxane component, in which the silicon atom-bonded organic groups do not include an epoxy group-containing organic group, wherein the resinous alkenyl group-containing organopolysiloxane component includes (A-1) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and free from a (Ar.sub.2SiO.sub.2/2) unit, and (A-2) a resinous alkenyl group-containing organopolysiloxane including at least two alkenyl groups per molecule and at least one (Ar.sub.2SiO.sub.2/2) unit; (B) an organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms per molecule; and (C) a curing catalyst. The resinous alkenyl group-containing organopolysiloxane (A-1) is included in an amount of about 5 mass % or more based on the total mass of all the organopolysiloxane components in the hotmelt silicone composition.

A layer contains a block copolymer in which a microphase-separated structure of the block copolymer has been induced to be perpendicular to a substrate, the process being difficult to perform by means of heating at atmospheric pressure. A method produces this layer. A method produces a semiconductor device in which a vertically phase-separated block copolymer layer is used. The vertically phase-separated block copolymer layer is formed by heating under a pressure below atmospheric pressure and at a temperature at which induced self-assembly can occur. It is preferable that the vertical phase separation includes a lamellar portion. It is preferable that the lamellar portion includes PMMA. It is preferable that the heating temperature is 290° C. or higher. It is preferable to additionally have a layer, which neutralizes the surface energy of the block copolymer, beneath the block copolymer layer.

A curable silicone composition of the present invention contains certain quantities of straight-chain organopolysiloxane which has at least two alkenyl groups and bound to silicon atoms and ≥0 mol % and <5 mol % of aryl groups per molecule, organopolysiloxane resin having at least two alkenyl groups bound to a silicon atom in the molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, organohydrogenpolysiloxane resin which has a network molecular structure with at least two hydrogen atoms bound to a silicon atom per molecule, only at the end of the molecule, and hydrosilylation reaction catalyst, and (total mols of silicon-atoms-bound) hydrogen atoms/(total mols of silicon-atom-bound alkenyl groups) in the organopolysiloxane in the composition=1-3.

The present disclosure relates to silicone-coated mineral wool insulation materials, methods for making them using specific coating methods, and methods for using them. One aspect of the disclosure is a method for making a silicone-coated mineral wool, the method comprising: providing a mineral wool comprising a collection of mineral wool fibers; applying to the mineral wool a solvent-borne coating composition comprising a silicone, the silicone of the coating composition having a number-average molecular weight of at least 25 kDa; and allowing the solvent to evaporate to provide silicone-coated mineral wool.

A curable silicone adhesive composition comprising a heat stable siloxane-imide copolymer is shown and described herein. The composition includes an alkenyl silicone, a silicone hydride based cross linker, hydrosilylation catalyst and additives that is curable at relatively low temperatures and shows good heat stability.

A modified polymethylhydrosiloxane, a terminal modified conjugated diene-vinyl aromatic hydrocarbon copolymer and a synthesis method for which, a rubber composition and a tire are provided. The modified polymethylhydrosiloxane includes a compound represented by a formula (1). ##STR00001##
E is a moiety containing an epoxide group. T is a moiety containing an alkoxysilylalkyl group. A is selected from the group consisting of hydrogen, a moiety containing an alkyl group and a moiety containing an amino group. B is a moiety containing an aryl group. G is a moiety containing an ethyleneoxy group and an alkoxy group. J is a moiety containing an ethyleneoxy group and a hydroxyl group. e=5-45. t=1-4. a+b+g+j is equal to 1 to 595.