The present invention relates to a process for preparing a reactive hotmelt adhesive formulation having a low residual content of monomeric diisocyanate. The present invention further provides a reactive hotmelt adhesive composition obtainable by the process of the invention.

An object of the present invention is to provide an acrylic resin powder suitable for hot melt adhesives which dissolves in polyol components such as polyalkylene glycols faster than conventional ones, as well as a resin composition which can be produced with lower energy than conventional ones. The object is achieved by using an acrylic resin powder comprising: a copolymer which contains a methyl methacrylate unit, wherein a volume average particle size of a primary particle is 0.1 to 10 μm, a volume average particle size of a secondary particle is 20 to 80 μm, a weight average molecular weight is 10,000 to 500,000, and the acrylic resin powder is soluble in polypropylene glycol having a weight average molecular weight of 1000 under stirring at a concentration of 10% by mass at 60° C. for 60 minutes.

Provided is a polyurethane foam having excellent heat resistance and the like. The polyurethane foam is obtained from a material that contains a polyol and a polyisocyanate, in which the polyol contains a polyester polyol, the polyisocyanate contains a diphenylmethane diisocyanate-based isocyanate, it is preferable that the polyester polyol has one or more side chains composed of an alkyl group, and the polyurethane foam may be used as a soundproof material for vehicles.

A method of applying a material comprising a fusible polymer comprises the step of: applying a filament of the at least partly molten material comprising a fusible polymer from a discharge opening of a discharge element to a first substrate.

The fusible polymer has the following properties: a melting point (DSC, differential scanning calorimetry; 2nd heating at heating rate 5° C./min) within a range from ≥35° C. to ≤150° C.; a glass transition temperature (DMA, dynamic-mechanical analysis to DIN EN ISO 6721-1:2011) within a range from ≥−70° C. to ≤110° C.;

wherein the filament, during the application process, has an application temperature of ≥100° C. above the melting point of the fusible polymer for ≤20 minutes.

There are still free NCO groups in the material including the fusible polymer.

The present invention relates to a reactive polyurethane (PUR) hot-melt adhesive, in particular a moisture cross-linking 1K-PUR hot-melt adhesive, wherein the PUR adhesive contains neutralized hollow glass spheres as fillers. The invention also relates to the use of said adhesive for adhesively bonding substrates.

The present invention relates to a hot-melt adhesive composition comprising at least one polyester polyol based on Betulin and at least one NCO-terminated compound as well as a method for the production of a laminated article using the inventive hot-melt adhesive composition.

There is provided a urethane resin that is excellent in adhesive strength, and maintains high adhesive strength even after exposure to high temperature and humidity. A urethane resin obtained by reacting a glycol-modified aromatic hydrocarbon-formaldehyde resin (A) modified with a glycol with a polyisocyanate (B) having two or more free isocyanate groups in a molecule.

A method of applying a material comprising a fusible polymer comprises the step of: applying a filament of the at least partly molten material comprising a fusible polymer from a discharge opening of a discharge element to a first substrate.

The fusible polymer has the following properties: a melting point (DSC, differential scanning calorimetry; 2nd heating at heating rate 5° C./min) within a range from ≥35° C. to ≤150° C.; a glass transition temperature (DMA, dynamic-mechanical analysis to DIN EN ISO 6721-1:2011) within a range from ≥−70° C. to ≤110° C.;
wherein the filament, during the application process, has an application temperature of ≥100° C. above the melting point of the fusible polymer for ≤20 minutes.

There are furthermore blocked NCO groups present in the material comprising the fusible polymer.

A hot melt moisture cure adhesive composition that includes a polyurethane prepolymer that includes the reaction product of diisocyanate, a polyester triol first polyol, a crystalline polyester second polyol, and a third polyol different from the first and second polyols.

The present invention relates to a moisture curable hotmelt adhesive composition comprising at least one polyurethane prepolymer obtained from the reaction of a) at least one polyether; b) at least one (meth)acrylic resin; c) at least one crystalline polyester; d) at least one amorphous polyester; e) at least one isocyanate compound; in a presence of a catalyst, wherein at least one of said polyether, crystalline polyester and amorphous polyester is partially or completely bio-based material.