The present application relates to a method for manufacturing a pressure-sensitive adhesive film. In an embodiment, a method for manufacturing a pressure-sensitive adhesive film having a pressure-sensitive adhesive layer and a base layer includes applying a pressure-sensitive adhesive composition on at least one side of a base layer, where the pressure-sensitive adhesive composition comprises an isocyanate compound, a metal compound and an acrylic polymer; and drying the pressure-sensitive adhesive composition at a temperature of 100° C. or higher to form a pressure-sensitive adhesive layer on the base layer.

This photocurable resin composition contains a polymer cross-linked material (A) and a polymeric material (B), wherein the polymer cross-linked material (A) contains urethane(meth)acrylate, and the polymeric material (B) contains a polyurethane resin that includes a structure derived from polycarbonate polyols and that does not have an acrylic group. This photocurable resin composition has excellent high-temperature adhesion. The urethane(meth)acrylate in the polymer cross-linked material (A) preferably includes a structure derived from polycarbonate polyols.

A wafer processing method includes a wafer providing step of providing the wafer by placing either of a polyolefin sheet or a polyester sheet each of which has a size equal to or larger than that of the wafer, on a flat upper surface of a support table and positioning a front surface of the wafer on an upper surface of the sheet, a sheet thermocompression bonding step of evacuating an enclosing environment in which the wafer is provided through the sheet on the support table, heating the sheet, pressing the wafer to pressure-bond the wafer to the sheet, thereby forming a raised portion by which an outer circumference of the wafer is surrounded, a back surface processing step of processing the back surface of the wafer, and a peeling step of peeling off the wafer from the sheet.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of applying an ultrasonic wave to the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

Curable compositions, cured compositions, articles containing the curable or cured compositions, and methods of making the articles are provided. More particularly, the curable compositions contain a (meth)acrylate-based polymer having pendant (meth)acryloyl groups, at least one monomer having a single ethylenically unsaturated group, a photoinitiator that includes an acyl phosphine oxide, and a thixotropic agent. The curable compositions can be printed or dispensed, if desired, and the cured compositions are pressure-sensitive adhesives.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of cooling the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

Dual cure transfer films include a siloxane-based matrix formed by thermal curing of a siloxane with thermally curable groups, a silsesquioxane with UV-curable groups that is dispersed within the siloxane-based matrix, and a UV photoinitiator. The transfer film is an adhesive and can be cured by UV radiation to form a non-tacky cured layer, where the non-tacky cured layer is optically transparent. In preferred embodiments at least one siloxane comprising thermally curable groups comprises a siloxane with epoxy functional groups; and the at least one silsesquioxane comprising UV-curable groups comprises a (meth)acrylate functional silsesquioxane.

A pressure-sensitive adhesive composition, an optical laminate, a polarizing plate and a display device are provided. The pressure-sensitive adhesive composition includes a block copolymer containing a first block having a glass transition temperature of 50° C. or more and having a cross-linkable functional group, a second block having a glass transition temperature of −10° C. or less, and an epoxysilane compound. The pressure-sensitive adhesive composition according to the present application can provide excellent durability and excellent optical characteristics with respect to the pressure-sensitive adhesive polarizing plate.

A low tack, self-adherent adhesive is obtained by curing a composition containing at least one acrylate-functionalized urethane oligomer, at least one poly(meth)acrylate-functionalized monomer and, optionally, at least one free radical initiator such as a photoinitiator or peroxide, but little or no hydrocarbon tackifying resin. Such adhesives are useful for producing reclosable packaging, wherein strips of adhesive are arranged in an opposed manner such that a package may be repeatedly opened and then resealed.

The present invention relates to a heat-crosslinkable adhesive composition comprising: from 20% to 84% by weight of a composition (A); from 15% to 79% by weight of a compatible tackifying resin (B), from 0.01% to 5% by weight of a crosslinking catalyst (C). The invention also relates to a self-adhesive item obtained by preheating said composition, coating on a support layer, then crosslinking by heating.