A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyester sheet, pushing up each device chip through the polyester sheet, and then picking up each device chip from the polyester sheet.

A wafer processing method includes a polyester sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyester sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyester sheet as applying a pressure to the polyester sheet to thereby unite the wafer and the ring frame through the polyester sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of picking up each device chip from the polyester sheet.

Described are polyurethane-vinyl hybrid polymers, methods of making them and their use. The hybrid polymers are made from an anionic polyurethane and a polymerizable vinyl compound, wherein the polymerizable vinyl compound is selected from methylene malonates, methylene beta-ketoesters and methylene beta-diketones. The hybrid polymers can be used as binder in structural adhesives, as binder in pressure-sensitive adhesives, as binder in laminating adhesives, as binder in contact adhesives, as binder in ink, as binder in paints, as binder in coatings, as binder for fiber bonding, as binder for particle bonding or as binder in high cohesion adhesive tapes.

A wafer processing method includes a polyolefin sheet providing step of positioning a wafer in an inside opening of a ring frame and providing a polyolefin sheet on a back side of the wafer and on a back side of the ring frame, a uniting step of heating the polyolefin sheet as applying a pressure to the polyolefin sheet to thereby unite the wafer and the ring frame through the polyolefin sheet by thermocompression bonding, a dividing step of cutting the wafer by using a cutting apparatus to thereby divide the wafer into individual device chips, and a pickup step of heating the polyolefin sheet, pushing up each device chip through the polyolefin sheet, and then picking up each device chip from the polyolefin sheet.

A cross-linkable composition can be provided in the present application. In one embodiment, the cross-linkable composition can allow a membrane formed of the cross-linkable composition to have an excellent interfacial adhesion with another membrane and prevent the occurrence of a detachment phenomenon or the like.

Provided are an adhesive including a polyisocyanate composition (X) containing a polyisocyanate (A), and a polyol composition (Y) containing a tertiary amine compound (B) having plural hydroxyl groups, a polyol (C), and an aliphatic cyclic amide compound (D), as essential components, a laminated film using the adhesive, and a method for producing a laminated film including a step of separately applying two components, which includes bringing a polyisocyanate composition (X) containing a polyisocyanate (A) that is applied onto one base material into contact with a polyol composition (Y) containing a tertiary amine compound (B) having plural hydroxyl groups, a polyol (C), and an aliphatic cyclic amide compound (D) that is applied onto the other base material, and performing pressure-bonding.

Compositions are disclosed which include between about 0.05 to about 5 or less wt. % of at least one acrylate monomer based on the total weight of the composition. The acrylate monomer reduces the peak cure temperature, thereby accelerating the rate of cure, without sacrificing completeness of the cure or the release performance of the cured product. The addition of the acrylate monomer also enables a reduction in the amount of costly platinum catalyst required to effectively cure a composition. In addition to the acrylate monomer, the compositions also include a silicone base polymer, a crosslinking agent, and platinum catalyst. The cured compositions exhibit properties useful for incorporation into release liners, adhesive articles, medical products and gaskets.

The present application relates to a cross-linkable composition, and for example, to a cross-linkable composition which can form a membrane having an excellent interfacial adhesion with other layers and cause no detachment phenomenon when forming a membrane in a structure of a pressure-sensitive adhesive optical member or the like.

As a pressure-sensitive adhesive polarizing plate, for example, a pressure-sensitive adhesive polarizing plate allowing a pressure-sensitive adhesive layer in the polarizing plate to have an excellent interfacial adhesion with another layer and have no detachment phenomenon can be provided in the present application.

The pressure sensitive adhesive tape for semiconductor processing of the present invention is a pressure sensitive adhesive tape for semiconductor processing, which, in a step of grinding a back face of a semiconductor wafer having a groove formed on a front face thereof or having a modified region formed therein to singulate the semiconductor wafer into semiconductor chips, is stuck on the front face of the semiconductor wafer and used, the pressure sensitive adhesive tape for semiconductor processing including a base, a buffer layer provided on one face of the base, and a pressure sensitive adhesive layer provided on the other face of the base, and having a ratio (D2/D1) of a thickness (D2) of the buffer layer to a thickness (D1) of the base of 0.7 or less and an indentation depth (X) of the front face on the buffer layer side of 2.5 m or less.