The invention relates to a copolymer having polyamide PA blocks and polyether PE blocks, in which PA is of diamine.diacid X.Y type; X, the number of carbons of the diamine, is within the range from 6 to 14, and Y, the number of carbons of the diacid, is within the range from 6 to 18. The invention also relates to the use of the said copolymer in a process of direct adhesion between two TPE materials for increasing the peel strength between these materials.

The invention relates to a copolymer having polyamide PA blocks and polyether PE blocks, in which PA is of diamine.diacid X.Y type; X, the number of carbons of the diamine, is within the range from 6 to 14, and Y, the number of carbons of the diacid, is within the range from 6 to 18. The invention also relates to the use of the said copolymer in a process of direct adhesion between two TPE materials for increasing the peel strength between these materials.

The invention relates to a polyurethane (PU) reactive hot melt adhesive removable at elevated temperature as well as having a high bonding strength at room temperature.

The present invention relates to a process for manufacturing a shoe rubber outsole using a special heat and pressure stable water-based polyurethane dispersion adhesive as well as a process for manufacturing a shoe using the outsole manufactured as described herein and an PUD-based adhesive composition for the described processes.

A method of making a sole for an article of footwear is disclosed. The method includes steps of attaching a double sided acrylic adhesive film to a composite plate. The composite plate is then attached to an outer member of the article of footwear using the acrylic adhesive film.

A method of making a sole for an article of footwear is disclosed. The method includes steps of attaching a double sided acrylic adhesive film to a composite plate. The composite plate is then attached to an outer member of the article of footwear using the acrylic adhesive film.

The invention relates to a polyurethane (PU) reactive hot melt adhesive removable at elevated temperature as well as having a high bonding strength at room temperature.

An adhesive composition for use in a shoe outsole assembly, and methods of forming the same are provided. In one aspect, the adhesive composition has a fabric layer with an adhesive applied to a top surface. In another aspect, the adhesive composition has a fabric layer with a barrier layer applied to a top surface, and an adhesive is applied to the barrier layer opposite to the fabric layer. The shoe outsole formed using the adhesive composition has the fabric material directly bonded with the outsole material such that the outsole material partially penetrates into the fabric. An adhesive is applied to the opposite side of the fabric or to the optional barrier layer which is on the opposite side of the fabric. This adhesive may then be used to bond the outsole to a shoe, such as a shoe upper, shoe midsole, and the like.