A curable fluoropolymer composition includes a crosslinkable fluorine-containing polymer, and a filler selected from surface-reacted calcium carbonate, ultrafine calcium carbonate, or a mixture thereof, wherein the surface-reacted calcium carbonate is a reaction product of natural ground calcium carbonate or precipitated calcium carbonate with carbon dioxide and one or more H.sub.3O.sup.+ ion donors, wherein the carbon dioxide is formed in situ by the H.sub.3O.sup.+ ion donors treatment and/or is supplied from an external source. Furthermore, the disclosure relates to a cured fluoropolymer product formed from said composition, an article including the cured fluoropolymer product, a method of producing a cured fluoropolymer product, and use of said filler for reinforcing a cured fluoropolymer product.

Disclosed herein is a moisture-curable composition. The composition includes a hydrolysable component and a thermally conductive filler package. The thermally conductive filler package may include thermally conductive, electrically insulative filler particles. The thermally conductive, electrically insulative filler particles may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 1 Ω.Math.m (measured according to ASTM D257). At least a portion of the thermally conductive, electrically insulative filler particles may be thermally stable. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a composition disclosed herein. The present invention also is directed to a coating.

The present invention relates to a process for producing a polyamide powder (PP) comprising at least one semicrystalline polyamide (P) and at least one additive (A). The semicrystalline polyamide (P) and the at least one additive (A) are initially compounded with one another in an extruder and subsequently introduced into a solvent (SV) in which the at least one semicrystalline polyamide (P) then crystallizes to obtain the polyamide powder (PP). The present invention further relates to the thus obtainable polyamide powder (PP) and to the use of the polyamide powder (PP) as sintering powder (SP) and also to a process for producing a shaped body by selective laser sintering of a polyamide powder (PP).

Described are articles including treads and/or other tire components that are formed at least in part by rubber compositions having solid agglomerated material comprising disaggregated carbon nanotubes. Such rubber compositions include a diene rubber component and a solid agglomerated material comprising disaggregated carbon nanotubes that consist of a continuous network of carbon nanotubes that contains 1) voids and 2) aggregates of carbon nanotubes having a mean size d.sub.50 of less than 5 μm, the voids and the aggregates together in an amount that is less than 60% of a predetermined surface area, as determined by electron microscopy imagery analysis, the remainder being the disaggregated carbon nanotubes in the continuous network that do not comprise a clearly defined shape.

A medical rubber composition can contain, comprise, consist, or consist essentially of: (a) an isobutylene-isoprene rubber: (b) a diene-based rubber; and a silica having a BET specific surface area not lower than 130 m.sup.2/g. An amount of (a) the isobutylene-isoprene rubber contained in 100 parts by mass of a rubber component composed of (a) the isobutylene-isoprene rubber and (b) the diene-based rubber can be larger than 30 parts by mass and smaller than 55 parts by mass.

Polymer magnet composites including NdFeB in a polycarbonate (PC) binder matrix are processed using processes including batch mixing and twin screw extrusion. One method includes adding PC to a compartment of a batch mixer and mixing the PC while the compartment is at a temperature greater than a flow temperature of the PC, to form a mixed PC material. The method also includes adding a NdFeB magnetic material to the compartment with the mixed PC material in four batches while the compartment is at the temperature greater than the flow temperature of the PC to form a mixed PC and NdFeB magnetic material, wherein each batch is mixed in the compartment for 1 to 3 minutes before the next batch is added. In addition, a total mixing time is 6 to 12 minutes, and the compartment includes an inert atmosphere. Other embodiments are described and claimed.

Disclosed is a composition comprising a molecule comprising an electrophilic functional group, optionally a second molecule comprising a nucleophilic functional group, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m.Math.K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω.Math.m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 50% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Provided is a thermoplastic resin composition which contains three components, i.e., a polyethylene, a polyamide and a compatibilizer and is excellent in impact resistance while realizing a reduction in environmental load, and a modifier capable of imparting impact resistance to a polyolefin (provided that polyethylene is excluded). The composition and the modifier each contain a polyethylene, a polyamide and a compatibilizer. The compatibilizer is a modified elastomer having a reactive group that reacts with the polyamide, and the polyethylene and the polyamide have a bio-based carbon content rate of 80% or more according to ISO 16620-2.

Provided is: a multicomponent curable thermally conductive silicone gel composition which has a high thermal conductivity, has excellent gap-filling ability and repairability, and has superior storage stability; a thermally conductive member comprising the composition; and a heat dissipating structure using the same. The thermally conductive silicone gel composition comprises: (A) an alkenyl group-containing organopolysiloxane; (B) an organohydrogenpolysiloxane; (C) a catalyst for hydrosilylation reaction; (D) a thermally conductive filler; (E) a silane-coupling agent or a hydrolysis condensation product thereof; and (F) a specific organopolysiloxane having a hydrolyzable silyl group at one end thereof. The thermally conductive silicone gel composition includes (I) a liquid composition that includes components (A), (C), (D), (E), and (F), but does not include component (B) and (II) a liquid composition that includes components (B), (D), (E), and (F), but does not include component (C) which are individually stored.

The present disclosure provides an epoxy molding compound composition, a preparation method and use thereof. The epoxy molding compound composition includes the following ingredients in mass percentage: epoxy resin: 4-9 wt %; a curing agent: 4-9 wt %; PN phenolic resin: 1-3 wt %; a curing accelerator: 0.02-0.5 wt %; filler: 70-90 wt %; a coupling agent: 0.2-0.6 wt %; and auxiliary additives: 1-2 wt %. By adding the PN phenolic resin to an epoxy resin system of the epoxy molding compound composition, reducing the mass percentage of the coupling agent and removing a plasticizer, the thermal deformation of the molding compound composition can be effectively reduced, and the stability of a packaged product is improved.