A curable thermosetting composition, comprising a capped poly(arylene ether) copolymer comprising a reactive end group, wherein the capped poly(arylene ether) copolymer is derived from an alkyl, aryl-phenol.

A curable thermosetting composition, comprising a capped poly(arylene ether) copolymer comprising a reactive end group, wherein the capped poly(arylene ether) copolymer is derived from an alkyl, aryl-phenol.

The present invention relates to a hardenable silicone composition including an irradiation-activated system for temporarily inhibiting the hydrosilylation reaction. Said system includes at least one inhibitor selected from among α-acetylenic alcohols, α-α′-acetylenic diesters, conjugated ene-yne compounds, α-acetylenic ketones, acrylonitriles, maleates, fumarates, the mixture thereof, at least one photoinitiator, and tris(trimethylsilyl)silane (TTMSS). The invention also relates to a method for preparing a silicone coating and hard elastomer materials provided comprising said silicone composition.

The present invention relates to a hardenable silicone composition including an irradiation-activated system for temporarily inhibiting the hydrosilylation reaction. Said system includes at least one inhibitor selected from among α-acetylenic alcohols, α-α′-acetylenic diesters, conjugated ene-yne compounds, α-acetylenic ketones, acrylonitriles, maleates, fumarates, the mixture thereof, at least one photoinitiator, and tris(trimethylsilyl)silane (TTMSS). The invention also relates to a method for preparing a silicone coating and hard elastomer materials provided comprising said silicone composition.

A photo-curable composition can include a photo-curable resin and a photoinitiator. The photo-curable composition can typically have a shear viscosity of less than 1 Pa.Math.s at 100° C. at a shear rate of 50 s.sup.−1 and can typically include a first prepolymer, a second prepolymer, and a reactive diluent.

A photo-curable composition can include a photo-curable resin and a photoinitiator. The photo-curable composition can typically have a shear viscosity of less than 1 Pa.Math.s at 100° C. at a shear rate of 50 s.sup.−1 and can typically include a first prepolymer, a second prepolymer, and a reactive diluent.

A method for instillation molding UV epoxy resin includes: the UV epoxy resin preparation step: adding at least two photosensitizers to a single component epoxy resin and uniformly mixing them to obtain the UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent for curing the UV epoxy resin, and the rest photosensitizers are photosensitive viscosity regulating agents for regulating the viscosity of the UV epoxy resin to be suitable for instillation molding; and instillation step: dividing the instillation molding of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulating agents are initiated in each procedure, so that the UV epoxy resin reaches a viscosity suitable for respective instillation procedure and is subsequently instillation molded; curing step: initiating the photosensitive curing agent to finally cure the UV epoxy resin.

A method for instillation molding UV epoxy resin includes: the UV epoxy resin preparation step: adding at least two photosensitizers to a single component epoxy resin and uniformly mixing them to obtain the UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent for curing the UV epoxy resin, and the rest photosensitizers are photosensitive viscosity regulating agents for regulating the viscosity of the UV epoxy resin to be suitable for instillation molding; and instillation step: dividing the instillation molding of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulating agents are initiated in each procedure, so that the UV epoxy resin reaches a viscosity suitable for respective instillation procedure and is subsequently instillation molded; curing step: initiating the photosensitive curing agent to finally cure the UV epoxy resin.

Halogenated cyclic diesters, halogenated polymers derived from the cyclic diesters, and methods for making the halogenated cyclic diesters and related halogenated polymers.

Halogenated cyclic diesters, halogenated polymers derived from the cyclic diesters, and methods for making the halogenated cyclic diesters and related halogenated polymers.