A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

A heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. In addition, an area ratio (Sr) of a total area S of cross-sectional shapes of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1. Further, a thermal resistance ratio of a thermal resistance value when a pressure of 0.4 MPa is applied to a thermal resistance value when a pressure of 1.0 MPa is applied may be 1 or more.

A poly(hydroxyalkanoate) composition having a bimodal molecular weight distribution. The composition includes of a first portion and a second portion of a poly(hydroxyalkanoate). The first portion has a first weight average molecular weight and the second portion has a second weight average molecular weight which is at least 50 percent less than the first weight average molecular weight. The poly(hydroxyalkanoate) is made up of at least 10 mole percent monomer repeat units of 3-hydroxypropionate. A method for making the composition is also disclosed.

A poly(hydroxyalkanoate) composition having a bimodal molecular weight distribution. The composition includes of a first portion and a second portion of a poly(hydroxyalkanoate). The first portion has a first weight average molecular weight and the second portion has a second weight average molecular weight which is at least 50 percent less than the first weight average molecular weight. The poly(hydroxyalkanoate) is made up of at least 10 mole percent monomer repeat units of 3-hydroxypropionate. A method for making the composition is also disclosed.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The present application discloses interlayers comprising novel polyesteramides comprising diols with tunable properties based on the monomers and monomer ratios used to prepare the polyesteramides and varying the reaction conditions. The interlayers have improved properties and can be used in many different applications.

The invention relates to a composition comprising: a) a propylene homopolymer or propylene-ethylene copolymer having an ethylene content of at most 1.5 wt % based on the weight of the propylene-ethylene copolymer, said a propylene homopolymer or propylene-ethylene copolymer having: i) a Mw/Mn in the range of 4.0 to 12, wherein Mw stands for the weight average molecular weight and Mn stands for the number average molecular weight and wherein Mw and Mn are measured according to ASTM D6474-12; ii) an XS in the range from 1.0 to 8.0 wt %, wherein XS stands for the amount of xylene solubles which are measured according to ASTM D 492-10; and iii) a melt flow rate in the range of 1 to 10 dg/minas measured according to ISO1133:2011(2.16 kg/230° C.); b) a first additive, being one or more tocopherols and/or one or more tocotrienols; and c) a second additive, being an organic acid scavenger. The invention moreover relates to a biaxially oriented polypropylene (BOPP) film comprising said composition, to a process for the preparation of a biaxially oriented polypropylene (BOPP) film and to the use of the composition for the preparation of an article, preferably a BOPP film.

The invention relates to a composition comprising: a) a propylene homopolymer or propylene-ethylene copolymer having an ethylene content of at most 1.5 wt % based on the weight of the propylene-ethylene copolymer, said a propylene homopolymer or propylene-ethylene copolymer having: i) a Mw/Mn in the range of 4.0 to 12, wherein Mw stands for the weight average molecular weight and Mn stands for the number average molecular weight and wherein Mw and Mn are measured according to ASTM D6474-12; ii) an XS in the range from 1.0 to 8.0 wt %, wherein XS stands for the amount of xylene solubles which are measured according to ASTM D 492-10; and iii) a melt flow rate in the range of 1 to 10 dg/minas measured according to ISO1133:2011(2.16 kg/230° C.); b) a first additive, being one or more tocopherols and/or one or more tocotrienols; and c) a second additive, being an organic acid scavenger. The invention moreover relates to a biaxially oriented polypropylene (BOPP) film comprising said composition, to a process for the preparation of a biaxially oriented polypropylene (BOPP) film and to the use of the composition for the preparation of an article, preferably a BOPP film.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.

The present invention relates to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby and, particularly, to a method for manufacturing a polyimide-based film and a polyimide-based film manufactured thereby, wherein the polyimide-based film is useful as a cover substrate for a flexible electronic device since flexure characteristics thereof, represented by yield elongation, are excellent.