The present invention is directed to compositions containing polymer matrix, fiber and/or additives which are suitable for load bearing applications for medical devices. The matrix can be formed from a group of polymers which resorb inside the body after implantation. These compositions contain reinforcing fibers that are incorporated into a resorbable polymer matrix to improve properties such as mechanical. The reinforcing fibers can be resorbable, non-resorbable, natural, or metallic. Additives can be incorporated into the matrix material or the fibers or both to provide a secondary effect. These additives can be bioceramics to provide an osteoconductive effect; antimicrobial particles such as silver; coloring agents, and radiopaque additives to make the implants visible under fluoroscopy. The additives may also contribute to improve mechanical properties. The Composite composition with Matrix, Fibers and/or additives can provide enhanced functionality of mechanical, Osteoconductive and tailored degradation characteristics that can result in superior properties conventionally not achievable for Bioresorbable composites.

The present invention is directed to compositions containing polymer matrix, fiber and/or additives which are suitable for load bearing applications for medical devices. The matrix can be formed from a group of polymers which resorb inside the body after implantation. These compositions contain reinforcing fibers that are incorporated into a resorbable polymer matrix to improve properties such as mechanical. The reinforcing fibers can be resorbable, non-resorbable, natural, or metallic. Additives can be incorporated into the matrix material or the fibers or both to provide a secondary effect. These additives can be bioceramics to provide an osteoconductive effect; antimicrobial particles such as silver; coloring agents, and radiopaque additives to make the implants visible under fluoroscopy. The additives may also contribute to improve mechanical properties. The Composite composition with Matrix, Fibers and/or additives can provide enhanced functionality of mechanical, Osteoconductive and tailored degradation characteristics that can result in superior properties conventionally not achievable for Bioresorbable composites.

An object of the present invention is to provide an epoxy resin composition excellent in elastic modulus and strength, and a prepreg and a fiber reinforced composite material with the epoxy resin composition. The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: aromatic diamine [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin

(1): at least a part of the component [C] satisfies that the sum of the polar component and the hydrogen bond component in the Hansen solubility parameters is 10.0 or more.

(2): at least a part of the component [C] satisfies that the Hansen solubility parameter distance L to the component [A] is 20.0 or less.

(3): the ratio H/E between the amount by mole, E, of the epoxy group of the component [A] and the amount by mole, C, of the component [C] satisfying both the condition (1) and the condition (2) is 0.01 or more and 0.20 or less.

(4): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

An object of the present invention is to provide an epoxy resin composition that can be preferably used for prepreg and fiber reinforced composite material applications and is excellent in elastic modulus, strength, and pot life.

The present invention is the epoxy resin composition including the following components [A] to [C] and satisfying the following conditions (1) to (3): [A]: epoxy resin [B]: polyamine curing agent, and [C]: a compound having a boiling point of 130° C. or more and a molecular weight m of 50 or more and 250 or less, the compound having no epoxy group in the molecule and having substantially no curing ability of an epoxy resin, and (1): at least a part of the component [C] has two or more alcoholic hydroxyl groups in the molecule. (2): the ratio C/E of the amount by mole, E, for epoxy groups of the component [A] to the amount by mole, C, of the component [C] satisfying the condition (1) is 0.01 or more and 0.20 or less. (3): the viscosity at 70° C. for 2 hours is 5.0 times or less the initial viscosity at 70° C.

A composition for fiber-reinforced resin that provides a fiber-reinforced resin with sufficient mechanical strength. The composition for fiber-reinforced resin contains at least one resin (A) selected from the group consisting of rosin resins, petroleum resins, terpene resins, and hydrides of cyclic ketone-aldehyde resins, and the resin (A) has a softening point of 80° C. to 180° C.

An epoxy resin mixture which contains an epoxy resin represented by Formula (1) below and an epoxy resin represented by Formula (2) below at a weight ratio of 1:5 to 1:0.2. (In Formula (1), plural R1's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represent a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.) (In Formula (2), plural R2's and R3's each exist independently and represent a hydrogen atom or a C1-10 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

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A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

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In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1):

##STR00001##

In Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

A system for manufacturing a thermoplastic prepreg includes a double belt mechanism that is configured to compress a fiber mat, web, or mesh that is passed through the double belt mechanism, a resin applicator that is configured to apply monomers or oligomers to the fiber mat, web, or mesh, and a curing oven that is configured to effect polymerization of the monomers or oligomers and thereby form the thermoplastic polymer as the fiber mat, web, or mesh is moved through the curing oven. The double belt mechanism compresses the fiber mat, web, or mesh and the applied monomers or oligomers as the fiber mat, web, or mesh is passed through the curing oven so that the monomers or oligomers fully saturate the fiber mat, web, or mesh. Upon polymerization of the monomers or oligomers, the fiber mat, web, or mesh is fully impregnated with the thermoplastic polymer.