An aspect of the present invention relates to a resin composition, which contains a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and a free radical compound, in which the free radical compound has at least one free radical group selected from the group consisting of structures represented by Formulas (1), (2), (3) and (4) in a molecule.

One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.

A method for producing a composite material, includes: immersing a carbon fiber bundle, including continuous carbon fibers, in a dispersion in which carbon nanotubes are dispersed in water, alcohol, or organic solvent; applying a tensile force to the carbon fibers, which are linearly arranged, using flat rollers; moving the carbon fibers linearly, under the tensile force by the flat rollers, at a constant depth inside the dispersion at a traveling speed of 1 to 20 m/min, such that the carbon nanotubes in the dispersion are adhered to respective surfaces of the carbon fibers; and applying a sizing agent to cover at least a part of the respective surfaces.

An object of the present invention is to reduce or eliminate a defect (e.g., a void) by achieving (i) a semipreg and a prepreg each of which allows a reduction in residual volatile component and (ii) methods for producing the semipreg and the prepreg, respectively, and consequently to achieve (iii) a fiber-reinforced composite material which has high heat resistance and superior mechanical strength and a (iv) a method for producing the fiber-reinforced composite material. The present invention attains the above object by providing, for example, a semipreg containing: powders of an imide oligomer; and reinforcement fibers, the imide oligomer being represented by a specific general formula (1).

An aramid fabric having excellent adhesion to a polyurethane matrix resin and excellent tensile strength is produced by the method including the steps of: (i) weaving a basket-structured aramid fabric by using aramid yarns as warp and weft yarns; and then (ii) dipping the woven aramid fabric in a sizing agent solution consisting of an aqueous polyurethane resin as a sizing agent and water, followed by squeezing and drying. In the present disclosure, the sizing agent is applied to the woven aramid fabric, thereby effectively preventing the deterioration in weaving efficiency. Further, the aramid fabric is woven in a basket weave, and thus the compactness of the aramid fabric is lowered and the wetting property of the aramid fabric with the polyurethane matrix resin is improved.

The present invention relates to the field of a protection system based on composite material used in ballistics. The application relates to a two-steps light and heat curable resin composition, a process of forming in a first step a prepreg using said resin and in a second step a protection system comprising the laminated composite of the invention.

A web of impregnated fibrous material(s) including N individual tapes of fibrous material(s) stacked and/or joined in relation to one another, in which said N tapes adhere to each other and can overlap at least partially. The tapes of fibrous material(s) include continuous fibers impregnated with at least one thermoplastic polymer, and optionally a chain extender. The web has a surface, in cross-section perpendicular to the axis of the fibers, S, that is substantially equal to the sum of the surface, in cross-section perpendicular to the axis of the fibers, of each initial individual tape, denoted S.sub.th, S.sub.th being equal to N×l×Ep, wherein l represents the average width of a tape and Ep represents the average thickness of a tape, N being between 2 and 2000, and the average thickness of each individual tape being less than or equal to 150 μm.

A vehicle component that includes at least one fiber preform. The fiber preform includes a substrate, a fiber bundle having one or more types of reinforcing fibers, and a thread. The fiber bundle is arranged on the substrate and attached to the substrate by a plurality of stitches of the thread to form a first preform layer having a principal orientation. The vehicle component includes a core having a geometry with at least one edge and at least one the fiber preforms positioned along the at least one edge, the core and the fiber preform being overmolded in a resin. A process of making the vehicle component includes providing the core having the at least one edge, positioning the at least one fiber preform along the at least one edge, and overmolding the core and the at least one fiber preform in the resin.

[Problem] Provided is a resin composition, resin sheet, prepreg and printed wiring board capable of obtaining excellent low permittivity, low dielectric loss tangent, flexibility and peel strength.

[Solution Means] A resin composition containing (A) a maleimide compound exhibiting a relative permittivity of lower than 2.7, (B) a polyphenylene ether compound represented by general formula (1) below and having a number-average molecular weight of 1000 to 7000, and (C) a block copolymer with a styrene skeleton. In general formula (1), X represents an aryl group, —(Y—O)n.sub.2- represents a polyphenylene ether portion, R.sub.1, R.sub.2 and R.sub.3 each independently represent a hydrogen atom or an alkyl, alkenyl or alkynyl group, n.sub.2 represents an integer of 1 to 100, n.sub.1 represents an integer of 1 to 6 and n.sub.3 represents an integer of 1 to 4.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application, as well as an active ester resin that provides the epoxy resin composition. An active ester resin having a polyaryloxy unit containing a dicyclopentenyl group and represented by the following formula (1), and a polyarylcarbonyl unit. Here, R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, R.sup.2 represents a hydrogen atom, or formula (1a) or formula (1b), and at least one R.sup.2 is formula (1a) or formula (1b); and n represents a number of repetitions of 1 to 5.

##STR00001##