A resin composition includes: a resin as Component (A); and an inorganic filler as Component (B). The Component (B) includes anhydrous magnesium carbonate as Component (b1) and aluminum oxide as Component (b2). Content of the Component (b1) falls within a range from 35% by volume to 65% by volume relative to 100% by volume of the Components (b1) and (b2) combined. Content of the Component (B) falls within a range from 60% by volume to 75% by volume relative to 100% by volume of the resin composition.

This utility invention is to replace some of the parts of current vehicles and robotic machines with intelligent graphene-based fibers and nanocomposites to achieve significantly weight-decreasing and energy-savings. This invention also is related to the formation of new generation vehicles, machine parts including robotics, which include but not limited to all kinds of cars, trailers, trucks, vehicles on roads and in the sky, ships on the ocean, and intelligent robotics for Human, as well as computer parts, bicycles, and sports supplies.

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy resin component, polyethersulfone as a toughening agent, a thermoplastic particle component, a nanoparticle component and a curing agent.

The present disclosure provides a curable resin composition including a thermoset resin, a toughener component containing a multistage polymer and a thermoplastic toughener and a hardener. The curable resin composition may be combined with reinforcing fibers and then cured to form a fiber-reinforced composite article having a high glass transition temperature and excellent mechanical properties. The fiber-reinforced composite article may be used in various applications, such as in transport applications including aerospace, aeronautical, nautical and land vehicles.

A ready to use surface veil and surface film integrated prepreg layer suitable to use in a production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including an outer resin, wherein the outer resin is the curable bottom base resin being 10% more viscous than a resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.

A ready to use surface veil and surface film integrated prepreg layer suitable to use in a production of lightweight structural parts/panels with class A surfaces includes a curable bottom base resin formulation including a curable bottom base resin, at least one first toughening agent, at least one accelerator, at least one curing agent and at least one hardener. The prepreg layer further includes a release paper coated with the curable bottom base resin formulation to obtained curable bottom base resin formulation coated release paper as a first resin film; a reinforcement fabric; an outer resin formulation including an outer resin, wherein the outer resin is the curable bottom base resin being 10% more viscous than a resin, at least one thermoplastic toughening agent, at least one accelerator, at least one curing agent and at least one hardener agent.

A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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A resin composition includes 100 parts by weight of a polyolefin and 20 parts by weight to 150 parts by weight of a homopolymer of Formula (1). The resin composition is useful for making different articles, including a prepreg, a resin film, a laminate or a printed circuit board, which may achieve excellent multi-layer board thermal resistance and thermal resistance after moisture absorption and achieve high glass transition temperature, low dissipation factor, and low Z-axis ratio of thermal expansion.

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A resin composition includes an unsaturated C═C double bond-containing polyphenylene ether resin, a polyolefin and silica; in an X-ray diffraction analysis pattern of the silica as measured by reference to JY/T 009-1996, only one diffraction peak exists in a 2θ ranging from 10° to 30°, and the diffraction peak has a full width at half maximum of 5.0° to 7.7°. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and achieves improvements in at least one of the properties including dissipation factor, resin filling property in open area, hole drilling limit value, and precision of hole position Cpk.

A heat-radiating sheet, in which a rate of reduction (%) ((R1-R2)/R1×100) of a thermal resistance (R2) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf.Math.cm by using a screw after being impregnated in an antifreeze containing 98% by mass or more of ethylene glycol at a temperature of 25° C. for 500 hours relative to a thermal resistance (R1) (° C./W) of the heat-radiating sheet as measured when tightened at a tightening torque of 6 kgf.Math.cm by using a screw is 30% or less. It is possible to provide a heat-radiating sheet having high tolerance against gasoline and engine oil.