A prepreg is provided that has excellent processability and handleability and that can be processed into a cured product with high heat resistance. Also provided is a method to produce such a prepreg in an industrially advantageous way without being restricted by the types and contents of the matrix resin components used. The prepreg includes at least components [A] to [D] as given below and a preliminary reaction product that is a reaction product of the component [B] and the component [C], at least one surface resin in the prepreg having a storage elastic modulus G′ in the range of 1.0×10.sup.3 to 2.0×10.sup.8 Pa as measured at a temperature of 40° C. and an angular frequency in the range of 0.06 to 314 rad/s: [A] carbon fiber, [B] epoxy resin, [C] curing agent, and [D] thermoplastic resin.

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the epoxy resin is partially or fully an epoxy resin represented by the following general formula (1). Each R.sup.1 represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and m represents a number of 0 to 5.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

##STR00001##

To provide an epoxy resin composition that exhibits excellent low-dielectric properties and that is excellent in copper foil peel strength and interlayer cohesion strength in a printed-wiring board application. An epoxy resin composition containing an epoxy resin and a curing agent, wherein the curing agent is partially or fully a polyvalent hydroxy resin represented by the following general formula (1). Each R.sup.1 independently represents a hydrocarbon group having 1 to 8 carbon atoms, each R.sup.2 independently represents a hydrogen atom or a dicyclopentenyl group, and at least one R.sup.2 is a dicyclopentenyl group; and n represents a number of repetitions of 0 to 5.

##STR00001##

The present invention discloses a foldable FRP plate, comprising a plurality of first regions and one or a plurality of second regions which are integrated in one piece; the second region is located between two adjacent first regions, so that the adjacent first regions being folded and unfolded relative to each other with the second region as a rotating shaft; the first regions are plate-like products manufactured by impregnating fiber woven fabric with resin for curing, are rigid and cannot be folded; the second region is flexible fiber woven fabric and has a width being two times a design thickness of the FRP plate. The present invention also discloses a manufacturing method, including laying the fiber woven fabric according to a design thickness and a layer layout; dividing the first regions and the second region according to an origami design method.

The present invention discloses a foldable FRP plate, comprising a plurality of first regions and one or a plurality of second regions which are integrated in one piece; the second region is located between two adjacent first regions, so that the adjacent first regions being folded and unfolded relative to each other with the second region as a rotating shaft; the first regions are plate-like products manufactured by impregnating fiber woven fabric with resin for curing, are rigid and cannot be folded; the second region is flexible fiber woven fabric and has a width being two times a design thickness of the FRP plate. The present invention also discloses a manufacturing method, including laying the fiber woven fabric according to a design thickness and a layer layout; dividing the first regions and the second region according to an origami design method.

An unsaturated polyester resin composition includes a resin component containing an unsaturated polyester and a polymerizable monomer, an aluminum hydroxide, and an expandable graphite. The mixing ratio of the aluminum hydroxide to 100 parts by mass of the resin component is 50 parts by mass or more and 300 parts by mass or less. The mixing ratio of the expandable graphite to 100 parts by mass of the resin component is 3 parts by mass or more and 10 parts by mass or less. The expandable graphite has an average particle size of 150 μm or less.

Provided are a composite material and a preparation method therefor. The composite material comprises: a base layer; a first plant fibre fabric located on the upper surface of the base layer; optionally, a second plant fibre fabric located on the lower surface of the base layer; and resins present in each layer. The composite material has a decorative performance and an improved mechanical performance.

This invention relates to a curative composition and its use in curing epoxy resins and prepregs, adhesives and moulded materials derived therefrom. The curative composition comprises a clathrate comprising a host component and a guest component, the host comprising a carboxylic acid or ester compounds as defined or phenolphthalin and the guest comprising an imidazole or imidazoline component.