C08J5/24

LIQUID PROCESSIBLE DIPHTHALONITRILE MONOMERS AND RESINS
20230212353 · 2023-07-06 ·

Diphthalonitrile compounds of formula I:

##STR00001##

in free or salt or solvate form, wherein: Ar.sup.1 is a C.sub.6-C.sub.10-aryl group; Ar.sup.2 is a C.sub.6-C.sub.10-aryl group; R.sup.1 and R.sup.2 are independently C.sub.3-C.sub.10-alkyl; T is a C.sub.6-C.sub.10-aryl group; and n is 0, 1, 2, 3, 4 or 5, or a mixture thereof; Cured diphthalonitrile thermosets are provided by curing resin blends of such compounds.

Curable epoxy system

A curable epoxy system useful in the production of composites capable of being used in various industries, including, for example, the aerospace industry. In particular, the present disclosure relates to a curable epoxy system comprising (i) an epoxy component selected from bisphenol C diglycidyl ether, one or more derivatives of bisphenol C diglycidyl ether, and combinations thereof, and (ii) 9,9-bis(4-amino-3-chlorophenyl)fluorene.

Laminated parts containing a slip resistant and water resistant outer layer and methods for their production
11548244 · 2023-01-10 · ·

Laminated parts are described that include a core, a fiber layer arranged on each side of the core and impregnated with a polyurethane resin, and an outer layer that at least partially coats at least one of the polyurethane impregnated fiber layers, in which the outer layer is the cured reaction product of a reaction mixture that includes: (1) a polyisocyanate, (2) a polyether polyol having a molecular weight of 800 Da to 25,000 Da and a functionality of 2 to 8, and (3) a fatty acid ester having isocyanate-reactive functionality. Methods of producing such laminated parts are also described.

Resin composition and article made therefrom

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

Resin composition and article made therefrom

A resin composition is useful for preparing an article such as a prepreg, a resin film, a laminate or a printed circuit board. The resin composition includes a benzoxazine resin of Formula (1) and a maleimide resin. The article made from the resin composition has high thermal resistance, low dielectric properties and high dimensional stability and meets the processability requirements of printed circuit boards involving multiple lamination processes and multiple assembly operations. ##STR00001##

Resin composition, prepreg, metal foil with resin, laminate, printed wiring board, and method for producing resin composition

The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 μm or less.

THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE
20230002611 · 2023-01-05 ·

A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

THERMOSETTING RESIN MATERIAL, PREPREG, AND METAL SUBSTRATE
20230002611 · 2023-01-05 ·

A thermosetting resin material, a prepreg, and a metal substrate are provided. The thermosetting resin material includes a resin composition and inorganic fillers. The resin composition includes: 10 wt % to 30 wt % of a polyphenylene ether resin, 40 wt % to 60 wt % of a cyanate resin, and 20 wt % to 40 wt % of a bismaleimide resin. The inorganic fillers undergo a surface modification process to have at least one of an acryl group and an ethylene group.

PREPREG, LAMINATE, AND PRODUCTION METHODS THEREFOR, AS WELL AS PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE

A method for producing a prepreg, includes the steps of (1) an opening step of opening glass fiber bundles to form plural glass fiber filaments, and (2) a step of aligning the plural glass fiber filaments formed in the previous opening step, on a thermosetting resin composition-coated surface of a carrier material so as to make the filaments run nearly parallel to each other in one direction thereon to form a prepreg. A method for producing a laminate, includes a step of preparing two or more prepregs formed in the previous step (2), laminating them in such a manner that, in at least one pair of prepregs, the running direction of the plural glass fiber filaments in one prepreg differs from the running direction of the plural glass fiber filaments in the other prepreg, and heating and pressing them.