Patent classifications
C08J7/02
Structure, wiring board, substrate for wiring board, copper clad laminate, and method for manufacturing the structure
According to an embodiment, a structure is provided. The structure comprises a silicone formed product, water, and a protective member. The silicone formed product contains hydroxyl groups in at least a portion of a surface. The water is in contact with at least the portion of the surface containing the hydroxyl groups. The protective member retains the water.
Method for fabricating nanoporous polymer thin film and corresponding method for fabricating nanoporous thin film
A method for fabricating nanoporous polymer thin film includes steps as follows. A polymer thin film is provided, wherein a polymer solution including a polymer is coated on a substrate to form the polymer thin film. A swelling and annealing process is provided, wherein the polymer thin film is disposed inside a chamber with a vapor of a first solvent, the polymer thin film is swollen and annealed to form a swollen polymer thin film, and the swollen polymer thin film includes the polymer and the first solvent. A freezing process is provided, wherein the swollen polymer thin film is cooled to a temperature less than or equal to a crystallization temperature of the first solvent to crystallize the first solvent. A first solvent removing process is provided, wherein the first solvent is removed with a second solvent, such that a nanoporous polymer thin film is obtained.
Method for fabricating nanoporous polymer thin film and corresponding method for fabricating nanoporous thin film
A method for fabricating nanoporous polymer thin film includes steps as follows. A polymer thin film is provided, wherein a polymer solution including a polymer is coated on a substrate to form the polymer thin film. A swelling and annealing process is provided, wherein the polymer thin film is disposed inside a chamber with a vapor of a first solvent, the polymer thin film is swollen and annealed to form a swollen polymer thin film, and the swollen polymer thin film includes the polymer and the first solvent. A freezing process is provided, wherein the swollen polymer thin film is cooled to a temperature less than or equal to a crystallization temperature of the first solvent to crystallize the first solvent. A first solvent removing process is provided, wherein the first solvent is removed with a second solvent, such that a nanoporous polymer thin film is obtained.
METHODS OF MODIFYING A SUBSTRATE BY ELASTOCAPILLARY DEFORMATION
A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.
METHODS OF MODIFYING A SUBSTRATE BY ELASTOCAPILLARY DEFORMATION
A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.
Methods of modifying a substrate by elastocapillary deformation
A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.
Methods of modifying a substrate by elastocapillary deformation
A method of modifying a deformable substrate that includes depositing a sessile liquid droplet on a first surface of a deformable substrate, the sessile liquid droplet forming a deformed region in the first surface of the deformable substrate, the deformed region having a recess and a perimeter rim, the recess extending toward a second surface of the deformable substrate, and the perimeter rim extending away from the second surface of the deformable substrate and curing the deformable substrate, thereby increasing an elastic modulus of the deformable substrate such that upon removal of the sessile liquid droplet, the deformed region remains in the first surface of the deformable substrate.
WATER-SOLUBLE FILM, PRODUCTION METHOD THEREOF, AND CHEMICAL AGENT PACKAGE
A water-soluble film is provided, which is less susceptible to curling even after long-term storage. The water-soluble film includes a polyvinyl alcohol resin (A) , and has a first surface, which has a crystal Unity index Xa, and a second surface, which is opposite to the first surface and has a crystallinity index Xb, where: XaXb; XaXb is from 0.015 to 0.10; and the crystallinity indexes Xa and Xb are measured through an infrared spectroscopic analysis by an attenuated total reflection method and represented by: ABS.sub.1141/ABS.sub.1093, wherein ABS.sub.1141 and ABS.sub.1093 are absorbances at wavenumbers of 1141 cm.sup.1 and 1093 cm.sup.1, respectively.
Structured nanoporous materials, manufacture of structured nanoporous materials and applications of structured nanoporous materials
A method is disclosed for manufacturing a structured polymeric material. In the method, a body is provided comprising a substantially homogenous precursor polymeric material. An interference pattern of electromagnetic radiation is set up within the body to form a partially cross-linked polymeric material, the interference pattern comprising maxima and minima of intensity of the electromagnetic radiation, the interference pattern thereby causing spatially differential cross linking of the precursor polymeric material to form crosslinked regions having relatively high cross linking density and non-crosslinked regions having relatively low cross linking density, the crosslinked regions and non-crosslinked regions corresponding to the maxima and minima of intensity of the electromagnetic radiation, respectively. The partially cross-linked polymeric material is then contacted with a solvent to cause expansion and crazing of at least some of the non-crosslinked regions to form a structured polymeric material containing pores.
Structured nanoporous materials, manufacture of structured nanoporous materials and applications of structured nanoporous materials
A method is disclosed for manufacturing a structured polymeric material. In the method, a body is provided comprising a substantially homogenous precursor polymeric material. An interference pattern of electromagnetic radiation is set up within the body to form a partially cross-linked polymeric material, the interference pattern comprising maxima and minima of intensity of the electromagnetic radiation, the interference pattern thereby causing spatially differential cross linking of the precursor polymeric material to form crosslinked regions having relatively high cross linking density and non-crosslinked regions having relatively low cross linking density, the crosslinked regions and non-crosslinked regions corresponding to the maxima and minima of intensity of the electromagnetic radiation, respectively. The partially cross-linked polymeric material is then contacted with a solvent to cause expansion and crazing of at least some of the non-crosslinked regions to form a structured polymeric material containing pores.