The present invention relates to a phosphinated poly(2,6-dimethy phenylene oxide)oligomer, specifically an unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomer, and processes for producing the same. A thermoset produced from the unsaturated group-containing phosphinated poly(2,6-dimethy phenylene oxide)oligomers according to the present invention exhibits flame retardancy and has a low dielectric constant and dissipation factor and a high glass transition temperature.

A two-step curable thermally conductive silicone composition includes a silicone component, thermally conductive particles, and a curing component. The silicone composition includes (A) 100 parts by weight of polyorganosiloxane, (B) 100 to 2500 parts by weight of thermally conducive particles with respect to the component A, (C) a platinum group metal catalyst as a curing catalyst for the polyorganosiloxane, and (D) 0.01 to 5 parts by weight of organic peroxide with respect to the component A. The silicone composition has been subjected to primary curing at a primary curing temperature and is capable of undergoing secondary curing at a temperature higher than the primary curing temperature. The silicone composition after the primary curing has a thermal conductivity of 0.2 to 17 W/m.Math.K and an Asker C hardness of 5 to 80.

A wiring harness includes multiple wires having a portion, a tubular hanking material that extends a length over the portion. The hanking material includes an unshrunk diameter and a shrunk diameter and has a frangible portion that is bounded by first and second rows that are separated by a spacing. The first row is provided by first apertures that are spaced a first distance, and the second row is provided by second apertures that are spaced a second distance. A strip of material in the frangible portion extends along the length. The strip is configured to tear the frangible portion from a remaining portion of the hanking material along the first and second rows when pulled. A first ratio of the unshrunk diameter to the spacing is greater than 1.8, and a second ratio of the unshrunk diameter to one of the first and second distances is greater than 15.

Disclosed herein are embodiments of a plasma treatment system and methods for utilizing directed plasma to reduce instances of gas venting and leaking of contents from plastic bottles due to scratches occurring on sealing interfaces of the bottles and closures. In an embodiment, a plasma treatment system for repairing scratches applied to PET bottles comprises one or more plasma nozzles disposed along a bottle filling line and a plasma being issued by the plasma nozzles to repair the scratches. The plasma nozzles are arranged into a configuration that uniformly distributes plasma to all parts of a neck finish comprising the PET bottles. The plasma treatment of the PET bottles is performed prior to capping of the bottles. In an embodiment, the plasma treatment is performed after filling the bottles with contents so as to avoid a risk of scratches from misaligned filling tubes.

The present invention relates to a coated cellulose-based substrate, comprising a cellulose-based substrate, and a coating layer disposed on said cellulose-based substrate, wherein said coating layer comprises regenerated cellulose and wherein said coating layer has been hydrophobized with a hydrophobizing agent. The invention further relates to a method for manufacturing the coated cellulose-based substrate.

A method of producing a hem flange bond wherein the method uses a one-component thermosetting epoxy resin composition including 20-60% by weight of at least one epoxy resin A, a latent curing agent for epoxy resins B, 10-40% by weight of at least one toughness improver D, and 4-12% by weight of a room temperature solid, crystalline polyester polyol PP. This enables compositions that are suitable for spray application and are not expressed from the hem flange in the crimping operation.

A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.

This invention relates to the radiation chemistry and high-energy chemistry technologies for the production, by heat-and-radiation treatment of workpieces, of enhanced-performance polymer materials, in particular, of polytetrafluoroethylene (PTFE) and other sorts of fluoroplastics used in various industries. Specifically, it relates to treating workpieces by high-energy ionizing radiation at a temperature strictly higher than the polymer crystalline phase melting point in an anoxic environment. The treatment is done via a pulsed linear electron accelerator generating ionizing radiation until an absorbed dose of 0-500 kGy is achieved. During the irradiation process, the polymer temperature is reduced by not more than 0.5 C./10 kGy, and subsequent to the ionizing radiation treatment, the polymer is heat treated. Alpha radiation, gamma radiation, electron radiation, irradiation with high-energy protons and neutrons, radiation from natural sources are used for the treatment. By this treatment method, physical and mechanical properties of the material are improved and consistency and programmability of the physical and mechanical characteristics are provided. 7 sub-claims.

To provide a piezoelectric body film that can suppress decrease in the piezoelectric constant d31, a method of producing a piezoelectric body film, and a piezoelectric body device. A piezoelectric body film comprising a fluororesin as a piezoelectric material, the fluororesin containing, as a main constituent unit, a repeating unit derived from vinylidene fluoride, a piezoelectric constant d31 of the piezoelectric body film being 20 pC/N or greater, and an extrapolated onset temperature at start of shrinkage determined by TMA measurement being not lower than 90? C. and not higher than 115? C. The difference between piezoelectric constants d31 measured before and after heating the piezoelectric body film at 100? C. for 24 hours relative to the piezoelectric constant d31 before the heating for 24 hours is 20% or less.

A film having heat sealing properties, a packaging bag using the film and a method of imparting heat sealing properties to the film are provided. The film is made up of a single layer of biaxially stretched polyester or made up of a laminate including the layer of biaxially stretched polyester at a surface. The layer of biaxially stretched polyester includes a non-sealing portion having no heat sealing properties, and a sealing portion having heat sealing properties due to irradiation of laser light and exhibiting lower crystallinity compared to that of the non-sealing portion.