A method for reducing the resistivity of a thermoplastic film containing carbon nanotubes includes connecting an electric power supply to the thermoplastic film containing carbon nanotubes and passing electric current through the thermoplastic film containing carbon nanotubes to heat the thermoplastic film to an elevated temperature and align carbon nanotubes within the thermoplastic film. The thermoplastic film is solid at room temperature.

Processing methods are described for improving the physical properties of elastomeric materials including elastomeric tubing. The methods include heating tubing in a post-cured step for a specified time and at a specified temperature. The methods also include irradiating the tubing with a desired dose of radiation. Embodiments can include treatment of silicon-based elastomers and/or non-silicon-based elastomers. The improved elastomers can be utilized in pumps.

A material susceptible to dielectric heating has a base polymeric thermoplastic material (1) and a dielectric heating susceptor (2, 3) which increases susceptibility to heating by irradiation with electromagnetic, for example RF or microwave, radiation. The dielectric heating susceptor has a polymeric material (2) such as PVDF which is different from the base polymeric material and has a higher dielectric loss factor than the base polymeric material. The dielectric heating susceptor also comprises electrically polarisable entities such as carbon black dispersed within the base polymeric material without forming a conductive network. The two susceptor materials in combination with the base polymer are particularly effective together at improving susceptibility to electromagnetic radiation heating of the whole material.

A resin-impregnated boron nitride body includes a polymer-derived boron nitride and a resin. A process for manufacturing such a resin-impregnated boron nitride body includes: polymerizing a boron nitride molecular precursor into a preceramic polymer shaping the preceramic polymer to form an infusible polymer body; submitting the polymer body to a thermal treatment to obtain a boron nitride body; impregnating the boron nitride body with a resin; and curing the resin.

A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 -cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.

Disclosed is a method of oxidizing a substrate comprising contacting the substrate, an oxidant, and a solid phase comprising a plurality of pendant groups having affinity for a substrate to be oxidised and an oxidation catalyst. Also disclosed is a solid phase and membrane for use in the method. Also disclosed is a method for preparing the solid phase, and system for oxidizing a substrate.

[Problem] To provide a manufacturing method with which a cured resin film can be manufactured at high yield, and which effectively prevents the occurrence of defects such as wrinkles in the cured resin film.

[Solution] Provided is a cured resin film manufacturing method comprising: a first step in which an undried resin film is formed on a support, the undried resin film comprising a heat curable resin composition containing a curable resin and a solvent; a second step in which a curable resin film having a loss of 0.5-7 wt % on heating is formed by drying the undried resin film which has been formed on the support by using a float method to convey the undried resin, which is in the state of having been formed on the support, in a drying device; a third step in which a cured resin film is formed by heat curing the curable resin film; and a fourth step in which the support is detached from the cured resin film.

A process for treating a surface coating of a bulk metal part, comprises the steps of placing, in a cavity, at least one what is called metal part including what is called a surface coating that is able to absorb microwaves at the frequency ?.sub.0, the cavity being surrounded by one or a plurality of first susceptors the dimensions, material and arrangement of which are configured to screen the microwaves at the frequency ?.sub.0, in the vicinity of each the metal part, and in emitting the microwaves at the frequency ?.sub.0 into the cavity.

The invention relates to a self-supporting, biodegradable film comprising a C.sub.10-C.sub.22-acylated derivative of hyaluronic acid according to the general formula (I), where R is H.sup.+ or Na.sup.+, and where R.sup.1 is H or C(O)C.sub.xH.sub.y, where x is an integer within the range from 9 to 21 and y is an integer within the range from 11 to 43 and C.sub.xH.sub.y is a linear or branched, saturated or unsaturated C.sub.9-C.sub.21 chain, wherein in at least one repeating unit one or more of R.sup.1 is C(O)C.sub.xH.sub.y and where n is within the range from 12 to 4000; a method of preparation thereof and use thereof.

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A method for treating an extruded or molded building component, the building component formed of a substantially amorphous thermoplastic having a glass transition temperature above room temperature. The method includes heating the building component from room temperature to a treatment temperature between room temperature and the glass transition temperature, maintaining the building component at the treatment temperature for a treatment time while supporting the building component to prevent sagging, and cooling the building component from the treatment temperature. The building component does not reach the glass transition temperature after reaching the treatment temperature.