The present invention provides a method for producing a molded body, having the step 1 of applying a composition containing an alicyclic urethane (meth)acrylate to a thermoplastic resin substrate to obtain a coated material, the step 2 of irradiating the obtained coated material with an active energy ray to cure the composition, obtaining a laminated material having a cured product layer obtained from the cured composition, and the step 3 of subjecting the obtained laminated material to bending processing to obtain a molded body, wherein the alicyclic urethane (meth)acrylate has a structure having an alicyclic structure represented by the formula (A), and a group having two or more (meth)acryloyl groups represented by the formula (B), and further has a polymerizable double bond equivalent of 100 to 1,000 g/mol.

A method for reducing surface tension of polymer material by decompression effect includes step as follows. A decompression step is performed, wherein a polymer material is placed at a low pressure environment to reduce a surface tension of the polymer material, and a pressure of the low pressure environment is lower than 10.sup.5 Pa.

One embodiment of the present invention is to provide a high-capacity lithium ion secondary battery and a production method thereof. To perform surface modification, a spherical resin is subjected to first heat treatment at a temperature higher than or equal to 500 C. in an inert atmosphere. By the heating, the contraction of a particle, the void formation due to a gas release from an inside of the particle, the crack on a particle surface, and the like are caused so as to form a support for sulfur that is to be mixed later. Obtained spherical particles and sulfur powder are mixed and then stored in a container. The mixture in the container is subjected to second heat treatment at a temperature higher than or equal to 120 C. without being exposed to outside air.

Provided is a layered body including glass and a polyamic acid heat-cured product that is readily releasable from an inorganic substrate after being heated at 250 C. A layered body including an inorganic substrate and a polyamic acid heat-cured product, the layered body being characterized by a weight average molecular weight of 30,000 or greater for the polyamic acid, and a peel strength of 0.3 N/cm or weaker between the polyamic acid heat-cured product layer and the inorganic substrate, after the layered body has been heated at 250 C.

A heat-shrinkable polyester film includes a polyester resin made from a dicarboxylic component including at least one of terephthalic acid and dimethyl terephthalate, and a diol component including ethylene glycol, 2-methyl-1,3-propanediol, and a diol selected from neopentyl glycol, 1,4-cyclohexanedimethanol, and a combination thereof. Based on 100 mol % of the diol component, the ethylene glycol, the diol mixture and the 2-methyl-1,3-propanediol are present in amounts ranging from 74 mol % to 82 mol %, from 18 mol % to 26 mol %, and from 3.5 mol % to 22 mol %, respectively. The heat-shrinkable polyester film has, after immersion in hot water at 95 C. for 10 seconds, a heat shrinkage in a direction transverse to a machine direction (TD) of greater than 48%, a heat shrinkage in the machine direction of less than 5%, an intrinsic viscosity of greater than 0.5 dL/g, and a yield strength in the TD ranging from 7.5 MPa to 13 MPa.

A gas barrier laminate includes a substrate layer containing a resin, an inorganic oxide layer, and a gas barrier coat layer in this order. The gas barrier coat layer is a cured article containing a water-soluble polymer, a first silicon compound of a silicon alkoxide in formula (1) below, and a second silicon compound of a silicon alkoxide in formula (2) below. The ratio of the water-soluble polymer to the water-soluble polymer and the second silicon compound is 55 to 95% by mass, and the ratio of the first silicon compound to the first silicon compound and the second silicon compound is more than 0% by mass and 89% by mass or less. Si(OR.sup.1).sub.4 . . . (1) (R.sup.2Si(OR.sup.3).sub.3).sub.n . . . (2) (in formulas (1) and (2) above, R.sup.1 and R.sup.3 each denote an alkyl group, and R.sup.2 denotes an organic functional group; n represents an integer equal to or greater than 1).

There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.

There is provided a method for producing a porous polyimide film, including a first step of forming a coating film containing a polyimide precursor solution where a polyimide precursor and an organic amine compound are dissolved in an aqueous solvent, and a resin particle incapable of dissolving in the polyimide precursor solution, followed by drying of the coating film to form a coat containing the polyimide precursor and the resin particle, and a second step of heating the coat to imidize the polyimide precursor and form a polyimide film, the second step including a treatment for removing the resin particle.

Provided is a curable silicone composition that can contain a large amount of a functional inorganic filler, provides a cured product with excellent hot-melt, gap-filling, and homogeneity properties characterized by high fluidity at high temperatures, is suitable for transfer molding and other molding or sealing processes, generates little dust, and has excellent handling workability; a manufacturing method with excellent production efficiency and homogeneity; and the like. A granular curable silicone composition comprises: (A) an organopolysiloxane resin containing at least 20 mol % or more T units, (B) a curing agent, and (C) a functional inorganic filler. The amount of component (C) is 400 to 3000 parts by mass relative to 100 parts by mass of components (A) and (B). The composition is a solid at 25 C. and has a melt viscosity of 200 Pa.Math.s or less, and the average particle size thereof is in the range of 0.1 to 10.0 mm.

The present disclosure includes a method for altering one or more properties of a primary material. The method includes reducing the elasticity of a primary material and creating a delivery aperture through an outer layer of the primary material. Once the delivery aperture is created, or as the delivery aperture is created, introducing through the delivery aperture a secondary material into a sublayer of the primary material and applying a closure treatment to the primary material to close the delivery aperture. The secondary material includes one or more properties that are different from the primary material. By introducing the secondary material into the primary material, the secondary material locally changes the properties of the primary material. Examples of the variable properties include color, strength, flexibility, magnetism, and optical.