Patent classifications
C08J7/08
RESIN MOLDED ARTICLE COMPRISING WHOLLY AROMATIC LIQUID CRYSTALLINE POLYESTER RESIN CAPABLE OF REDUCING DIELECTRIC LOSS TANGENT BY HEAT TREATMENT AND ELECTRICAL AND ELECTRONIC COMPONENT
The invention provides a resin molded article containing a wholly aromatic liquid crystalline polyester resin and formed by being subjected to heat treatment, in which the enthalpy change Δ H.sub.1 at the melting point of the first cycle and the enthalpy change Δ H.sub.2 at the melting point of the second cycle of the temperature elevation process measured by a differential scanning calorimeter satisfy Δ H.sub.1/Δ H.sub.2≥2.0, and the dielectric loss tangent measured by the split-post dielectric resonator (SPDR) method at a measurement frequency of 10 GHz is 0.85×10.sup.−3 or less.
LAMINATED FILM
A laminated film has a resin layer on at least one surface of a polyester film, in which the resin layer is on at least one surface layer, the water contact angle of the resin layer is 85°-100°, inclusive, and |H2−H1|≤1.0 (%) is satisfied, H1 (%) being the haze of the laminated film and H2 (%) being the haze of the laminated film after being immersed in a solvent and subjected to a rub test. This laminated film has excellent coating and releasability properties with respect to ceramic slurry.
Composition for resin surface roughening
Provided is a means capable of realizing a surface-roughening method for modifying the surface of a resin molded article to form a surficial layer, such as a coating or plating, or to impart a function derived from the surface configuration. The method comprises adding a resin composition and performing a post-treatment and is thus simpler and easier than conventional methods. The resin composition is a composition for resin surface roughening that contains an aliphatic polycarbonate and an alkali metal salt.
POLYTETRAFLUOROETHYLENE AND STRETCHED BODY
- Taketo KATO ,
- Yohei FUJIMOTO ,
- Kenji ICHIKAWA ,
- Hiroyuki SATO ,
- Ryota USAMI ,
- Yoshinori NANBA ,
- Hirotoshi YOSHIDA ,
- Kengo ITO ,
- Chiaki OKUI ,
- Masamichi SUKEGAWA ,
- Taku YAMANAKA ,
- Yosuke KISHIKAWA ,
- Hirokazu AOYAMA ,
- Satoru YONEDA ,
- Sumi ISHIHARA ,
- Masahiro HIGASHI ,
- Akiyoshi YAMAUCHI ,
- Shinnosuke NITTA ,
- Marina NAKANO
A polytetrafluoroethylene having a breaking strength of 10.0 N or more and a thermal instability index (TII) of 20 or more. Also disclosed is a stretched body including the polytetrafluoroethylene.
High performance coatings for building panels
The present invention is directed to dirt and anti-microbial resistant compositions and articles that include a powder coating composition formed from a precursor including polymeric binder resin, cross-linker, and a blend of liquid carrier and anionic fluorosurfactant. The powder coating may be formed using a liquid-based anionic fluorosurfactant wherein the solids content of the anionic fluorosurfactant within the precursor is from about 13 wt. % to about 28 wt. %.
COATING METHOD FOR PREVENTING DEGASSING OF AEROSPACE PART MADE OF RESIN
A coating method for preventing outgassing from an aerospace component made of a resin is proposed. In the coating method for preventing outgassing from the aerospace component, first, a polymer including a resin is provided. After that, primary outgassing in which the polymer is subjected to hot air drying to evaporate gas therefrom is performed. Next, the surface of the polymer after the primary outgassing is subjected to a cold plasma treatment to introduce hydrophilic functional groups so that it is possible to perform plating on the surface of the polymer. After that, the surface of the polymer after the cold plasma treatment is subjected to a catalytic treatment and an activation treatment for post-processes. Next, a first functional metal layer is formed on the surface of the polymer by means of electroless plating to suppress the release of gas through outgassing.
METHOD FOR PRODUCING MOLDED BODY
The present invention provides a method for producing a molded body, having the step 1 of applying a composition containing an alicyclic urethane (meth)acrylate to a thermoplastic resin substrate to obtain a coated material, the step 2 of irradiating the obtained coated material with an active energy ray to cure the composition, obtaining a laminated material having a cured product layer obtained from the cured composition, and the step 3 of subjecting the obtained laminated material to bending processing to obtain a molded body, wherein the alicyclic urethane (meth)acrylate has a structure having an alicyclic structure represented by the formula (A), and a group having two or more (meth)acryloyl groups represented by the formula (B), and further has a polymerizable double bond equivalent of 100 to 1,000 g/mol.
ANNEALED THERMOPLASTIC MATERIALS
A thermoplastic material can include a thermoplastic polyurethane material having a hard segment content of at least 30 wt % based on a total weight of the thermoplastic polyurethane material. The thermoplastic polyurethane material is pre-annealed to have a single melting peak having a full-width at half maximum value of less than or equal to 15 C. based on a differential scanning calorimetry analysis from 25 C. to 250 C. at a 20 C./min temperature ramp.
Preparation of high conductivity copper films
A copper precursor composition contains: a first copper complex of an imine or a first cyclic amine coordinated to a first copper precursor compound; and, a second copper complex of a primary amine or a second cyclic amine coordinated to a second copper precursor compound. A copper precursor composition contains a copper complex of an imine coordinated to a copper precursor compound. The copper precursor composition is thermally degradable at a temperature lower than a comparable composition containing only primary amine copper complexes under otherwise the same conditions to produce a metallic copper film having a resistivity of about 200 -cm or less. Inks containing the copper precursor composition and a solvent may be deposited on a substrate and sintered to produce a metallic copper film. The substrate with the film thereon is useful in electronic devices.
Gas barrier film and method of manufacturing the same
A method of manufacturing a gas barrier film includes depositing an atomic layer deposition film on a surface of a plastic substrate to form a gas barrier laminate, using atomic layer deposition; depositing a curable resin layer on a support from which the layer is peelable, to form an overcoat laminate; laminating the overcoat laminate to the gas barrier laminate, with the atomic layer deposition film and the curable resin layer facing each other, and transferring the curable resin layer onto the atomic layer deposition film; curing the curable resin layer through application of heat or an active energy beam; and releasing the curable resin layer from the support.