Embodiments described include devices and methods for forming a porous polymer material. Devices disclosed and formed using the methods described a spacer for spinal fusion, craniomaxillofacial (CMF) structures, and other structures for tissue implants.

Embodiments described include devices and methods for forming a porous polymer material. Devices disclosed and formed using the methods described a spacer for spinal fusion, craniomaxillofacial (CMF) structures, and other structures for tissue implants.

The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.

The present invention provides, for example, a silicone porous body having a porous structure with less cracks and a high proportion of void space as well as having a strength. The silicone porous body of the present invention includes silicon compound microporous particles, wherein the silicon compound microporous particles are chemically bonded by catalysis. For example, the abrasion resistance measured with BEMCOT® is in the range from 60% to 100%, and the folding endurance measured by the MIT test is 100 times or more. The silicone porous body can be produced, for example, by forming the precursor of the silicone porous body using sol containing pulverized products of a gelled silicon compound and then chemically bonding the pulverized products contained in the precursor of the silicone porous body. The chemical bond among the pulverized products is preferably a chemical crosslinking bond among the pulverized products, for example.

Low-density thermoplastic expandable microspheres are disclosed. Various low-density structures, in particular, sandwich panels, based on foam prepared from the low-density microspheres, are also disclosed. Process of preparing low-density polymeric microspheres, per se, and the corresponding low-density structures, based on the microsphere foam, are also disclosed.

A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

A polyimide precursor solution contains a polyimide precursor, particles, and a water-based solvent that contains an amine compound (A), an organic solvent (B) other than the amine compound (A) and amide compounds, and water, in which a boiling point of the organic solvent (B) is higher than a boiling point of the amine compound (A), and is 200° C. or higher and 300° C. or lower.

PLA polymers that can be expanded into microporous articles having a node and fibril microstructure are provided. The fibrils contain PLA polymer chains oriented with the fibril axis. Additionally, the PLA polymers have an inherent viscosity greater than about 3.8 dL/g and a calculated molecular weight greater than about 150,000 g/mol. The PLA polymer article may be formed by bulk polymerization where the PLA bulk polymer is made into a preform that is subsequently expanded at temperatures above the glass transition temperature and below the melting point of the PLA polymer. In an alternate embodiment, a PLA polymer powder is lubricated, the lubricated polymer is subjected to pressure and compression to form a preform, and the preform is expanded to form a microporous article. Both the preform and the microporous article are formed at temperatures above the glass transition temperature and below the melting point of the PLA polymer.

Disclosed are porous elements that include sintered polymeric particles. The polymeric particles can be formed of a thermoplastic composition that includes a polyarylene sulfide. The polymeric particles sintered to form the porous elements have a very narrow size distribution. The porous elements can maintain their functionality and morphology even when utilized in high temperature applications.

Disclosed are porous elements that include sintered polymeric particles. The polymeric particles can be formed of a thermoplastic composition that includes a polyarylene sulfide. The polymeric particles sintered to form the porous elements have a very narrow size distribution. The porous elements can maintain their functionality and morphology even when utilized in high temperature applications.