Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for producing the same. In the porous polyurethane polishing pad, it is possible to control the size and distribution of pores, whereby the polishing performance (i.e., polishing rate) of the polishing pad can be adjusted, by way of employing thermally expanded microcapsules as a solid phase foaming agent and an inert gas as a gas phase foaming agent.

A masterbatch for foam molding which contains a base resin and heat-expandable microspheres. The base resin contains EPDM and the masterbatch contains the heat-expandable microspheres in an amount ranging from higher than 300 parts by weight to 750 parts by weight to 100 parts by weight of the base resin and has a Moony viscosity ML 1+4 (100° C.) ranging from 15 to 90. Also disclosed is a method for producing a masterbatch for foam molding, a resin composition containing the masterbatch for foam molding, and a foam-molded product manufactured by molding the resin composition.

A masterbatch for foam molding which contains a base resin and heat-expandable microspheres. The base resin contains EPDM and the masterbatch contains the heat-expandable microspheres in an amount ranging from higher than 300 parts by weight to 750 parts by weight to 100 parts by weight of the base resin and has a Moony viscosity ML 1+4 (100° C.) ranging from 15 to 90. Also disclosed is a method for producing a masterbatch for foam molding, a resin composition containing the masterbatch for foam molding, and a foam-molded product manufactured by molding the resin composition.

This invention relates to an anti-flutter adhesive composition, comprising a) at least one ethylenically unsaturated polymer; b) at least one PVC homopolymer having a K value from 67 to 75; c) at least one PVC copolymer having a K value from 60 to 75; d) at least one epoxy resin; e) at least one epoxy curing agent; f) at least one first organic peroxide having a decomposition temperature from 125 to 180° C.; and g) at least one second organic peroxide having a decomposition temperature less than 125° C. The anti-flutter adhesive composition can be cured across a wide temperature and have excellent shear strength and good appearance after cured.

The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a ratio of a peak intensity based on a C═O bond in the shell to a peak intensity based on the silicon dioxide in the shell (peak intensity based on C═O bond/peak intensity based on silicon dioxide) of 0.25 to 1.0 as determined by IR spectral analysis, the thermally expandable microcapsule having a maximum foaming temperature (Tmax) of 180° C. to 225° C.

The present invention provides a thermally expandable microcapsule having excellent heat resistance and high expansion ratio and enabling production of a light, high-hardness molded article having excellent physical properties (abrasion resistance), and a composition for foam molding containing the thermally expandable microcapsule. Provided is a thermally expandable microcapsule including: a shell containing a polymer; and a volatile expansion agent as a core agent encapsulated by the shell, the shell containing silicon dioxide and a polymer obtained by polymerizing a monomer composition containing a carbonyl group-containing monomer, the thermally expandable microcapsule having a ratio of a peak intensity based on a C═O bond in the shell to a peak intensity based on the silicon dioxide in the shell (peak intensity based on C═O bond/peak intensity based on silicon dioxide) of 0.25 to 1.0 as determined by IR spectral analysis, the thermally expandable microcapsule having a maximum foaming temperature (Tmax) of 180° C. to 225° C.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

Embodiments relate to a porous polyurethane polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polyurethane polishing pad can be adjusted. Thus, it is possible to provide a porous polyurethane polishing pad that has enhanced physical properties such as a proper level of withstand voltage, excellent polishing performance (i.e., polishing rate), and the like.

Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

The present invention relates to a non-crosslinked block copolymer foam composition, characterised in that it is in the form of a polymer matrix comprising closed cells containing gas, said matrix comprising: from 90 to 99.9% by weight of said block copolymer; and from 0.01 to 10% by weight of metal carbonate, for the total weight of the foam composition. The present invention also relates to a foamable composition and a method for manufacturing said foam, as well as the use of the foam in sports shoe soles, balloons or balls, gloves, personal protection equipment, rail soles, automobile parts, construction parts, electrical and electronic equipment parts, audio equipment, sound- and/or heat-proofing, and parts used to damp vibrations.