Provided are rapidly cross-linkable silicone foam compositions, kits, and methods for filling implanted medical devices in situ or in vivo, the implanted medical devices, including for example, body implants and tissue expanders, the compositions including a platinum divinyl disiloxane complex; a low viscosity vinyl terminated polydimethylsiloxane; a low viscosity hydride terminated polydimethylsiloxane; a silicone cross-linker; and a gas and/or gas-filled microcapsules, where the rapidly cross-linkable silicone foam composition has a viscosity of ≤150 cPs for ≥1 min. post-preparation and ≤300 cPs≤5 min. post-preparation, at ambient temperature.

An insulating core material for a refrigerating appliance includes a plurality of insulating glass spheres, wherein a plurality of interstitial spaces are defined between at least a portion of the insulating glass spheres of the plurality of glass spheres. A coating material is applied at least to the outer surface of the insulating glass spheres, wherein the coating material modifies the outer surface to define a retaining outer surface of each insulating glass sphere of the plurality of glass spheres. A secondary insulating material is combined with the plurality of insulating glass spheres, wherein the secondary insulating material is at least partially retained by the retaining outer surfaces of the insulating glass spheres to occupy the plurality of interstitial spaces.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A reinforcing sheet including one or more layers of a reinforcing material, and a thermosetting adhesive associated with the reinforcing material, wherein the thermosetting adhesive includes a curing agent, and an epoxy-modified dimerized fatty acid combined with an epoxy terminated polyurethane interpenetrating network.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A method for dielectrically heating foamable composition to foam and set the composition is described. In particular, radio frequency (RF) heating is used to heat the foamable composition to provide insulation in the manufacture of an article.

A resin composition containing heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and at least one base resin selected from rubbers, olefin resins and thermoplastic elastomers. The thermoplastic resin is a polymer of a polymerizable component containing N-substituted maleimide and a nitrile monomer containing methacrylonitrile. Also disclosed are molded articles manufactured by molding the resin composition.

A resin composition containing heat-expandable microspheres including a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein and at least one base resin selected from rubbers, olefin resins and thermoplastic elastomers. The thermoplastic resin is a polymer of a polymerizable component containing N-substituted maleimide and a nitrile monomer containing methacrylonitrile. Also disclosed are molded articles manufactured by molding the resin composition.

Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.

Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.