A method for producing a syntactic foam for high-pressure environments includes providing a housing having a void volume. The housing may include an inlet and an outlet to the void volume of the housing. The method includes injecting a plurality of microspheres comprising glass into the housing. The plurality of microspheres include a first set of microspheres comprising an average diameter ranging from 5 microns to 150 microns. The method includes agitating the housing to settle the plurality of microspheres within the housing. The method includes injecting a resin from the inlet of the housing to the outlet of the housing to fill voids between the plurality of microspheres to form a resin-microsphere matrix. The resin may have a viscosity less than 100 centipoise. The method may include curing the resin-microsphere matrix in the housing to produce a cured composition.

The present disclosure relates to a super absorbent polymer and a preparation method of the same. More specifically, it relates to a super absorbent polymer having a reduced extractable content without deterioration in absorption performance, and to a preparation method of the super absorbent polymer capable of producing the above-described super absorbent polymer by performing a polymerization reaction in the presence of a foaming agent and a carboxylic acid-based additive having a specific structure.

A polyurethane foam may include an isocyanate polymer component and a polyol component. The polyol component may include a polyol having a molecular weight of at least about 500 kg/mol and not greater than about 6000 kg/mol. The polyurethane foam may have an elongation of at least about 500%. The polyurethane foam may further have a density of at least about 250 g/L and a tensile strength of not greater than about 1000 kPa.

Heat-expandable microspheres which have a blowing agent encapsulated efficiently therein so as to prevent the blowing agent from escaping out of the microspheres during storage at high temperature, a process for producing the same, and applications thereof. The process for producing heat-expandable microspheres containing a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein includes preparing an aqueous suspension in which oil droplets of an oily mixture containing the blowing agent and a polymerizable component are dispersed in an aqueous dispersion medium and fine particles of an inorganic compound and a monomer (A) and/or a monomer (B) described below are contained in the aqueous dispersion medium; and polymerizing the polymerizable component, wherein Monomer (A): Polymerizable unsaturated monomer having a total sulfuric acid value ranging from more than 0% to 35%; and Monomer (B): Polymerizable unsaturated monomer with a total phosphoric acid ranging from more than 0% to 50%.

Heat-expandable microspheres which have a blowing agent encapsulated efficiently therein so as to prevent the blowing agent from escaping out of the microspheres during storage at high temperature, a process for producing the same, and applications thereof. The process for producing heat-expandable microspheres containing a thermoplastic resin shell and a thermally vaporizable blowing agent encapsulated therein includes preparing an aqueous suspension in which oil droplets of an oily mixture containing the blowing agent and a polymerizable component are dispersed in an aqueous dispersion medium and fine particles of an inorganic compound and a monomer (A) and/or a monomer (B) described below are contained in the aqueous dispersion medium; and polymerizing the polymerizable component, wherein Monomer (A): Polymerizable unsaturated monomer having a total sulfuric acid value ranging from more than 0% to 35%; and Monomer (B): Polymerizable unsaturated monomer with a total phosphoric acid ranging from more than 0% to 50%.

The hollow microballoons for CMP polishing pad of the invention are formed of at least one resin selected from the group consisting of a melamine resin, a urea resin and an amide resin and have an average particle size of 1 to 100 μm. According to the invention, there can be provided hollow microballoons for CMP polishing pad, which, when used in CMP polishing pad, exhibit excellent polishing characteristics, and can stably produce CMP polishing pad even in production of CMP polishing pad.

The hollow microballoons for CMP polishing pad of the invention are formed of at least one resin selected from the group consisting of a melamine resin, a urea resin and an amide resin and have an average particle size of 1 to 100 μm. According to the invention, there can be provided hollow microballoons for CMP polishing pad, which, when used in CMP polishing pad, exhibit excellent polishing characteristics, and can stably produce CMP polishing pad even in production of CMP polishing pad.

The present disclosure relates to a preparation method of a super absorbent polymer. More specifically, it relates to a preparation method of a super absorbent polymer with improved permeability and anti-caking efficiency while having a high absorption rate by adding an additive having a specific structure to the hydrogel polymer polymerized in the presence of an encapsulated foaming agent, followed by coarse pulverization.

A thermally expandable sheet according to the present invention includes a stress buffer layer provided on one surface of a base material and having an elastic property, a thermal expansion layer provided on the stress buffer layer and containing a first thermally expandable material that expands according to heat and a first binder, and a cover layer provided on the thermal expansion layer and having an elastic property.

The present disclosure relates to thermoplastic polymeric microspheres comprising a thermoplastic polymer shell surrounding a hollow core, in which the thermoplastic polymer shell comprises a homopolymer or copolymer of a monomer of Formula 1

##STR00001## wherein: each of A1 to A11 are independently selected from H and C1 to C4 alkyl, in which each C1-4 alkyl group can optionally be substituted with one or more substituents selected from halogen, hydroxy and C1-4 alkoxy; X is a linking group selected from —O—, —NR″—, —S—, —OC(O)—, —NR″C(O)—, —SC(O)—, —C(O)O—, —C(O)NR″—, and —C(O)S—; and R″ is H or C1-2 alkyl optionally substituted with one or more substituents selected from halogen and hydroxy.