Expanded beads are those including a mixture of an olefin-based thermoplastic elastomer and a polyethylene-based resin, wherein a melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 2-10 g/10 min; a difference ((MFR(II))−(MFR(I))) between a melt flow rate MFR(II) of the polyethylene-based resin and the melt flow rate MFR(I) of the olefin-based thermoplastic elastomer is 1-35 g/10 min; and a content of the polyethylene-based resin in the mixture is 3-40% by weight.

A method for manufacturing semi-conductive polypropylene resin foamed particles of the present invention comprises the steps of: allowing carbon nanotubes to be adsorbed on surfaces of polypropylene resin composition pellets to manufacture carbon nanotube-adsorbed pellets (CNT-PP); and foaming the carbon nanotube-adsorbed pellets (CNT-PP) to form foamed particles.

A thermosettable precursor of an expanded structural adhesive composition comprising: an epoxy compound; an epoxy curing agent; an expanding agent; and a mineral pigment selected from the group of phosphate metal complexes. In addition, a method of bonding two parts and to uses of the thermosettable precursor of an expanded structural adhesive composition.

The present disclosure relates to TPV compositions suitable for foaming, as well as foamed TPV compositions, methods of making the foregoing, and applications of various foamed TPV compositions. The TPV compositions comprise an at least partially vulcanized rubber component dispersed within a thermoplastic component comprising a thermoplastic resin and a propylene-based elastomer, oil, and optionally one or more additives. According to some aspects, the TPV composition may be made in part by preloading some portion of process oil prior to addition of the curative. TPV compositions provided herein are particularly suitable for foaming with thermo-expandable microsphere foaming agents.

A material comprising an encapsulated component within a shell, a rupture initiator associated with the encapsulated component, and a polymeric matrix material, wherein the encapsulation is adapted to fail upon activation of the rupture initiator allowing the encapsulated component to be liberated to initiate a reaction or increase the reactivity of the material.

The present disclosure relates to a polishing pad, a method for manufacturing the polishing pad, and a method for manufacturing a semiconductor device using the polishing pad. The polishing pad increases the area in direct contact with the semiconductor substrate during the polishing process and can prevent defects occurring on the surface of the semiconductor substrate by forming a plurality of uniform pores in the polishing layer, thereby adjusting the surface roughness characteristics of the polishing surface of the polishing layer. Further, the present disclosure may provide a method for manufacturing a semiconductor device to which the polishing pad is applied.

A foaming resin composition of the present invention contains an aromatic vinyl-based resin and zinc oxide, wherein the size ratio (B/A), in which peak A is a 370 nm to 390 nm region and peak B is a 450 nm to 600 nm region, of zinc oxide is approximately 0.01 to approximately 1 when photoluminescence is measured, and the BET surface area thereof is approximately 1 m.sup.2/g to approximately 10 m.sup.2/g.

Compositions are provided including an uncrosslinked thermoplastic nitrogen-containing matrix material and composite particles distributed in the matrix material. The composite particles each include a chemical blowing agent particle encapsulated within a shell including an uncrosslinked thermoplastic material. The uncrosslinked thermoplastic material exhibits at least a certain minimum complex viscosity at a decomposition temperature of the chemical blowing agent particle. Also described are foam compositions and particles including the foam compositions, such as a sheet or multilayer construction. Composite particles are further provided. Methods of making the foam compositions are additionally described herein. Also, polishing pads, polishing systems, and methods of polishing a substrate are provided.

This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure. The disclosure provides aromatic polyester polyether polyols and compositions comprising such polyols. The disclosed aromatic polyester polyether polyols and compositions including same are the products of the transesterification reaction of polyethylene terephthalate (“PET”) and an ethoxylated triol, namely glycerin or trimethylolpropane, wherein the degree of ethoxylation is from 1 to 9 moles. At least some of the PET used to generate the aromatic polyester polyether polyols is derived from recycled PET. The disclosed aromatic polyester polyether polyols have utility in preparing polyurethane materials, for example.

Methods for manufacturing articles, including articles of footwear, apparel, and sporting equipment are provided. The methods comprise decorating a plurality of foam particles. The decorating can comprise applying a coating on the foam particles, or embossing or debossing the foam particles, or both. The decorating can comprise applying a coating on the foam particles by printing, painting, dyeing, applying a film, or any combination thereof. The plurality of foam particles are affixed utilizing aspects of additive manufacturing methods. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.