C08J2325/02

POLYMERIC SURFACE HAVING REDUCED BIOMOLECULE ADHESION TO THERMOPLASTIC ARTICLES AND METHODS OF PLASMA TREATMENT
20220259394 · 2022-08-18 ·

A substrate is described having a treated contact surface comprising a carbon or silicon compound comprising from 1 to 30 atomic percent oxygen, from 0.1 to 30 atomic percent nitrogen, or both, each as measured by XPS. A method is also provided for treating a surface of a substrate. The method includes treating the surface with plasma comprising one or more non-polymerizing compounds. The treated contact surface has a biomolecule recovery percentage greater than the biomolecule recovery percentage of the surface prior to treatment according to the method.

Method Of Treating Inflammation

The present invention concerns methods of treating systemic, regional, or local inflammation from a patient suffering or at risk of inflammation comprising administration of a therapeutically effective dose of a sorbent that sorbs an inflammatory mediator in said patient. In some preferred embodiments, the sorbent is a biocompatible organic polymer.

WATER BASED DISPERSION TO MAKE COATINGS WITH INCREASED MVTR BARRIER PROPERTIES

The present invention relates to an aqueous dispersion, comprising or consisting of A) at least one cyclic olefin copolymer, B) at least one surfactant; optionally C) at least one adhesion promoter; optionally D) at least one film-forming resin; optionally E) at least one additive; and F) water. Additionally, the invention relates to methods of manufacturing the aqueous dispersion, to an article, which comprises at least one substrate and at least one coating layer obtained from the aqueous dispersion and applied onto the substrate; and to methods of improving MVTR of a substrate.

Method of treating inflammation

The present invention concerns methods of treating systemic, regional, or local inflammation from a patient suffering or at risk of inflammation comprising administration of a therapeutically effective dose of a sorbent that sorbs an inflammatory mediator in said patient. In some preferred embodiments, the sorbent is a biocompatible organic polymer.

PHOTORESIST COMPOSITION AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
20210271164 · 2021-09-02 ·

Manufacturing method includes forming photoresist layer including photoresist composition over substrate. Photoresist composition includes: photoactive compound, polymer, crosslinker. The polymer structure

##STR00001##

A1, A2, A3 independently C1-C30 aryl, alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl, acetyl, acetylalkyl, carboxyl, alky carboxyl, cycloalkyl carboxyl, hydrocarbon ring, heterocyclic, chain, ring, 3-D structure; R1 is C4-C15 chain, cyclic, 3-D structure alkyl, cycloalkyl, hydroxylalkyl, alkoxy, or alkoxyl alkyl; proportion of x, y, and z in polymer is 0≤x/(x+y+z)≤1, 0≤y/(x+y+z)≤1, and 0≤z/(x+y+z)≤1, x, y, and z all not 0 for same polymer. Crosslinker is monomer, oligomer, polymer including structures —B1-OH, —B2-ORa, —B3-NH.sub.2 —B4-NR.sub.2,

##STR00002##

B1, B2, B3, B4, and D each independently C1-C30 aryl, alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl, acetyl, acetylalkyl, carboxyl, alky carboxyl, cycloalkyl carboxyl, hydrocarbon ring, heterocyclic group, chain, ring, 3-D structure; R2 and Ra are C4-C15 chain, cyclic, 3-D structure alkyl, cycloalkyl, hydroxylalkyl, alkoxy, alkoxyl alkyl.

Halogen-free low dielectric resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same

A halogen-free low dielectric resin composition is provided. The halogen-free low dielectric resin composition comprises: (A) a resin system, which includes: (a1) a polyphenylene ether resin with unsaturated functional groups, and (a2) a polyfunctional vinyl aromatic copolymer; and (B) an allyl cyclophosphazene compound represented by the following formula (I): ##STR00001## in formula (I), t is an integer ranging from 2 to 6,
wherein, the polyfunctional vinyl aromatic copolymer (a2) is prepared by copolymerizing one or more divinyl aromatic compounds and one or more monovinyl aromatic compounds.

Method of treating inflammation

The present invention concerns methods of treating systemic, regional, or local inflammation from a patient suffering or at risk of inflammation comprising administration of a therapeutically effective dose of a sorbent that sorbs an inflammatory mediator in said patient. In some preferred embodiments, the sorbent is a biocompatible organic polymer.

Membranes

A membrane comprising an anion exchange layer (AEL) and a cation exchange layer (CEL) wherein the CEL is obtainable by a process comprising curing a curable composition comprising a compound of Formula (I): Formula (I) wherein: X is is of the formula OC.sub.nH.sub.2n+1 or OC.sub.qH2.sub.q1, wherein n has a value of of 1 to 6 and q has a value of 5 or 6; and m has a value of 1 or 2.

##STR00001##

Method of treating inflammation

The present invention concerns methods of administering a therapeutically effective dose of a sorbent for an inflammatory mediator to a patient where the inflammatory mediator is one or more of enzymes, cytokines, prostaglandins, eicosanoids, leukotrienes, kinins, complement, coagulation factors, endotoxins, enterotoxins, lipopolysaccharide, cell fragments, bile salts, fatty acids, phospholipids, interferon and immunomodulatory antibodies, biologics or drugs.

Expandable vinyl aromatic composition containing functionalized ethylene-vinyl acetate copolymer
10920033 · 2021-02-16 · ·

The present invention relates to polymeric compositions that can be used for producing packaging with dynamic cushioning, with a pleasant touch, with reduced abrasive power, in which the expanded particles constituting the packaging adhere well to one another and do not come detached during use. Said compositions comprise: a) from 70% to 90% by weight of a vinyl aromatic polymer and/or copolymer, calculated with respect to (a)+(b); b) from 10% to 30% by weight of an ethylene-vinyl acetate copolymer (EVA) containing a percentage that ranges from 10% to 30% by weight of vinyl acetate, calculated with respect to (a)+(b); c) from 3 to 10 parts by weight of a blowing agent, calculated on 100 parts of component a) added to component b); said copolymer (b) being distributed in the polymer (a) in the form of particles having an average volumetric diameter ranging from 1 nm to 2000 nm. The compositions described and claimed do not include styrene-butadiene or styrene-isoprene block copolymers, hydrogenated or non-hydrogenated; thermoplastic polyurethanes, polystyrene-butadiene grafted polymers or styrene core-shell polymers.