To provide a method capable of producing, by means of mechanical pulverization, a resin powder having a high bulk density and an average particle size of at most 50 m from resin particles containing a fluorocopolymer as the main component and having a melting point of from 260 to 320 C., such as PFA. The method is to obtain a resin powder having an average particle size of from 0.02 to 50 m by subjecting resin particles (A) having an average particle size of at least 100 m to mechanical pulverization treatment. The resin particles (A) is made of a material (X) having a fluorocopolymer (X1) as the main component; and said fluorocopolymer (X1) has a unit (1) based on a monomer containing at least one type of functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and a unit (2) based on tetrafluoroethylene, and has a melting point of from 260 to 320 C.

The present disclosure relates to a passivation layer comprising a photocrosslinked fluoropolymer and a process for forming the layer. Passivation layers comprising the crosslinked fluoropolymer have low dielectric constants, low water absorptivity and are able to be photoimaged so as to provide the very fine features needed for modern electronic equipment.

The present invention pertains to a fluoropolymer hybrid organic/inorganic composite, to a process for manufacturing said fluoropolymer hybrid organic/inorganic composite and films and membranes thereof and to uses of said fluoropolymer hybrid organic/inorganic composite and films and membranes thereof in various applications.

In an example, a process of forming a polymeric material is disclosed. The process may include chemically reacting a polyvinyl chloride (PVC) material with a diamine to form a diamine-modified PVC material. The diamine has a chemical formula (CH.sub.2).sub.x(NH.sub.2).sub.2, where x is not less than 2. The process may also include chemically reacting a halogenated phthalate plasticizer with the diamine-modified PVC material to form a polymeric material having a phthalate plasticizer covalently bonded to a polymer chain.

Provided are a cross-linked fluorine-containing copolymer product having both excellent short-term and long-term heat resistance, and a fluorine-containing copolymer composition that can be used to preferably produce such a cross-linked product. A cross-linked fluorine-containing copolymer product comprising an indole ring, and a fluorine-containing copolymer composition comprising: a fluorine-containing copolymer comprising a constituent unit (A) derived from tetrafluoroethylene, a constituent unit (B) derived from at least either of perfluoro (alkyl vinyl ether) and perfluoro (butenyl vinyl ether), and a constituent unit (C) derived from a fluorine-containing compound having a carbon-carbon double bond and a C(O)CH.sub.2 group; and a compound (D) having a specific structure.

Provided herein are membrane electrode assemblies (MEAs) for CO.sub.x reduction and carbon dioxide reduction reactors (CRRs) that include MEAs.

A mechanically and piezoelectrically anisotropic polymer thin film may be formed by gel casting a solution that includes a crystallizable polymer and a liquid solvent. The solvent may be configured to interact with the polymer to facilitate chain alignment and, in some examples, create a higher crystalline content within the cast thin film. The thin film may also include up to approximately 90 wt. % of an additive and may be characterized by a bimodal molecular weight distribution of a crystallizable polymer where the molecular weight of the additive may be less than the molecular weight of the crystallizable polymer. In some examples, the polymer(s) and the additive(s) may be independently selected from vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, hexafluoropropene, vinyl fluoride, etc. The anisotropic polymer thin film may be characterized by an electromechanical coupling factor (k.sub.31) of at least 0.1.

A thermally conductive board includes a top metal foil, a bottom metal foil, and a thermally conductive layer laminated therebetween. The thermally conductive layer includes an electrically insulation matrix and a thermally conductive filler. The electrically insulation matrix includes a fluoropolymer. The thermally conductive filler includes a glass fiber dispersed in the electrically insulation matrix. The glass fiber has a first dielectric constituent and a second dielectric constituent. The first dielectric constituent is a halogen. The total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05%. The second dielectric constituent is a titanium family element. The total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03%.

A method includes forming a polymer solution having a crystallizable PVDF-family polymer and a liquid solvent, forming a gel from the polymer solution, forming a polymer thin film from the gel by calendering or solid state extrusion, stretching the polymer thin film, and applying an electric field to the polymer thin film to form a poled polymer thin film, where an electromechanical coupling factor (k.sub.31) of the poled polymer thin film is at least approximately 0.1. The polymer thin film may include up to approximately 90 wt. % of an additive and may be characterized by a bimodal molecular weight distribution of a crystallizable polymer where the molecular weight of the additive is less than the molecular weight of the crystallizable polymer. In some examples, the polymer(s) and the additive(s) may be independently selected from vinylidene fluoride, trifluoroethylene, chlorotrifluoroethylene, hexafluoropropene, vinyl fluoride, etc.

The techniques described herein relate to hydrogen peroxide plasma surface modification. In some embodiments, a method includes providing a mixture including hydrogen peroxide vapor from a source, wherein a concentration of the hydrogen peroxide vapor in the mixture is substantially stable over time. The method further includes forming a hydrogen peroxide plasma from the mixture and exposing a material to the hydrogen peroxide plasma in a chamber.