C08J2333/24

FLUORIDE ION COLORIMETRIC SENSING PI FILM, PREPARATION METHOD THEREFOR AND APPLICATION THEREOF
20210395456 · 2021-12-23 ·

A fluoride ion (F.sup.−) colorimetric sensing polyimide (PI) film, a preparation method therefor and application thereof; the preparation method for a .sup.F− colorimetric sensing polyimide film comprises: mixing an aromatic diamine monomer and an aromatic dianhydride monomer in a strong polar aprotic organic solvent, adding a catalyst, vacuumizing at room temperature-introducing argon repeatedly for multiple times, and then reacting same under the protection of argon to obtain a polyimide solution; then preparing a PI fiber; dissolving the PI fiber in the strong polar aprotic organic solvent, thoroughly stirring to dissolve same and then applying same evenly on a clean glass plate, removing the solvent, cooling, then soaking same in hot water for film stripping so as to obtain the .sup.F− colorimetric sensing PI film. The PI film containing fluorene with hydroxy group may be directly cut into sheets for use such that sensor devices can be easily fabricated, and can be used for the detection of .sup.F−s, with a sensitivity reaching a detection limit of 10.sup.−4 mol/L, and a high selectivity.

Process for preparing a biodegradable plastic composition
11198767 · 2021-12-14 · ·

The present invention relates to plastic composition comprising at least one polyester, biological entities having a polyester-degrading activity and at least an anti-acid filler, wherein the biological entities represent less than 11% by weight, based on the total weight of the plastic composition, and uses thereof for manufacturing biodegradable plastic articles.

ELASTOMERIC CHEMICAL BARRIER ARTICLES

Provided among other things is an elastomeric article providing a chemical barrier, the article having a layered structure comprising a sequential laminate of: (a) a latex-based elastomeric polymeric barrier layer; (b) a non-reactive tie adhesive resin layer comprising oxo (—(C═O)—) groups; and (c) a polyamide layer; wherein the layered structure has a first side nearest the latex-based elastomeric polymeric barrier layer and a second side; wherein the layered structure is effective to provide a chemical permeation time in excess of 100 minutes pursuant to EN 16523-1:2015 for benchmark solvents of acetone, ethyl acetate and methanol, when applied to the first side, and in excess of 100 minutes for acetone when applied to the second side; and wherein the elastomeric layer is primarily not polyolefin.

Novel Amide Acid Oligomer Process For Molding Polyimide Composites
20210340344 · 2021-11-04 · ·

An amide acid oligomer (AAO) solution, methods of making the same, powder, AAO solution prepregs, AAO dry prepreg, imide prepregs, and fiber reinforced polyimide composites with high temperature resistance and excellent mechanical properties are disclosed herein. In some embodiments, a method of making an AAO solution includes dissolving an aromatic diamine and an aromatic tetracarboxylic compound in a solvent to form a mixture, wherein the solvent has a boiling point of less than 150° C.; stirring the mixture at a temperature ranging from about 5° C. to about 60° C. for about I hour to about 24 hours to form a reaction solution; adding unsaturated acid anhydride to the reaction solution; and stirring the reaction solution at a temperature ranging from about 5° C. to about 60° C. for about 1 minute to about 180 minutes to form an amide acid oligomer solution, the amide acid oligomer solution having amide acid oligomer in the solvent.

HEAT-CURABLE MALEIMIDE RESIN COMPOSITION FOR RTM, FIBER-REINFORCED COMPOSITE MATERIAL AND RADOME

Provided are a heat-curable maleimide resin composition for RTM that is used to produce a fiber-reinforced composite material such as FRP, and is superior in dielectric properties; and a fiber-reinforced composite material using such composition. The composition contains: (A-1) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, and having a viscosity of not higher than 20 Pa.Math.s; (A-2) a maleimide compound having at least one dimer acid skeleton-derived hydrocarbon group per one molecule, having a viscosity of greater than 20 Pa.Math.s, and exhibiting a fluidity at 25° C.; (B) a radical polymerization initiator; and (C) a polymerization inhibitor, wherein the viscosities of the components (A-1) and (A-2) are measured in accordance with a method described in JIS Z8803:2011, at a measurement temperature of 25° C., and using a Brookfield-type rotary viscometer with a rotation rate of a spindle being set to 5 rpm.

Method for manufacturing polyimide composite film for flexible metal-clad substrate

A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.

Masterbatch composition comprising a high concentration of biological entities
11802185 · 2023-10-31 · ·

The present invention relates to a masterbatch composition comprising high concentration of biological entities having a polymer-degrading activity and uses thereof for manufacturing biodegradable plastic articles.

ELECTRICALLY CONDUCTIVE POLYMER COMPOSITES WITH BIOCHAR FIBERS

A composite material composition includes a polymer matrix and biochar fibers disposed throughout the polymer matrix. The polymer matrix of the composite material composition may be a recycled material and the biochar fibers may made from a natural material.

TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
20220285200 · 2022-09-08 ·

A temporary protective film including a support film and an adhesive layer provided on one surface or both surfaces of the support film. The support film is a polyimide film. The thickness of the adhesive layer is less than 8 μm.

POLYAMIDES AND CORRESPONDING POLYMER COMPOSITIONS, ARTICLES AND METHODS FOR MAKING AND USING
20220289909 · 2022-09-15 ·

Described herein are polyamides (PA) incorporating a cycloaliphatic monomer containing a cyclohexyl group. It was surprisingly discovered that by incorporating the cycloaliphatic monomer containing a cyclohexyl group, the resulting polyamides (PA) had significantly reduced water absorption and significantly increased Tg, while maintaining high Tm, Tc and good mechanical properties, relative to analogous polyamides free of the cycloaliphatic monomer and PA6,T based polyamides copolymerized with either or both of isophthalic acid and adipic acid.