Patent classifications
C
CHEMISTRY; METALLURGY
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C08
ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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C08J
WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
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2335/00
Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Derivatives of such polymers
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C08J2335/06
Copolymers with vinyl aromatic monomers
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C08J2335/06

RESIN COMPOSITION AND ARTICLE MADE THEREFROM
20260035560 · 2026-02-05 ·

A resin composition includes 100 parts by weight of a thermosetting resin, 10 parts by weight to 40 parts by weight of a fluorene-containing compound and 210 parts by weight to 400 parts by weight of silica. The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and at least one or more of the following properties can be improved, including PCT water absorption ratio, dielectric constant, dissipation factor, copper foil peeling strength, thermal conductivity and glass transition temperature.

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