Provided are a resin composition that can form a printed wiring board with a low dielectric constant and dielectric loss tangent and excellent alkali resistance and desmear resistance; and a prepreg, a resin sheet, a metal foil-clad laminate, and a printed wiring board formed using this resin composition. The resin composition contains a styrene-based elastomer (A), a styrene oligomer (B), a maleimide compound (C), and a cyanate ester compound (D).

The present invention provides a block copolymer composition comprising a block copolymer B formed by introducing a functional group capable of forming a non-covalent bond into a block copolymer A including at least one aromatic vinyl polymer block and at least one conjugated diene polymer block, wherein: the block copolymer B includes an ionic group as the functional group capable of forming a non-covalent bond.

Provided is a resin film for an electronic device including: a resin containing a polymer; hygroscopic particles dispersed in the resin and having a primary particle diameter of 200 nm or less; and a dispersant, wherein an absolute value of a difference in refractive index between the resin and the particles is 0.05 or less. The resin is preferably a thermoplastic resin, and more preferably a thermoplastic elastomer. The polymer is preferably one or more types selected from an aromatic vinyl compound-conjugated diene copolymer and a hydrogenated aromatic vinyl compound-conjugated diene copolymer. An electronic device including the resin film for an electronic device is also provided.

This invention is in the field of surface modification. In particular, the invention relates to the surface modification of microfluidic devices to alter surface hydrophobicity characteristics.

A resin composition includes 50 parts by weight of a vinyl-containing polyphenylene ether resin, 1 part by weight to 30 parts by weight of a styrene-butadiene-styrene block copolymer and 0.5 part by weight to 30 parts by weight of a zinc molybdate-covered silica, wherein the zinc molybdate-covered silica has a mass ratio of zinc molybdate to silica of between 1:9 and 2:8. The resin composition may be used to make various articles, such as a prepreg, a resin film, a laminate or a printed circuit board, and at least one of the following properties can be improved, including gel time stability, copper foil peeling strength, difference rate of dissipation factor and conductive anodic filament test.

Components for articles of footwear and athletic equipment are provided including a foam. A variety of foams and foam components and compositions for forming the foams are provided. In some aspects, the foams and components including the foams can have exceptionally high energy return while also having improved durability and softness. In particular, midsoles including the foams are provided for use in an article of footwear. Methods of making the compositions and foams are provided, as well as methods of making an article of footwear including one of the foam components. In some aspects, the foams and foam components can be made by injection molding or injection molding followed by compression molding.

Polymer compositions comprising styrene butadiene block-copolymers (SBC) can be used for shrink-wrap films, a stiff star-shaped SBC block copolymer A having two short branches of a single copolymer block (B/S).sub.Ai and two long branches of the structure S.sub.t-[(B/S).sub.A].sub.n-(B/S).sub.Ai or [(B/S).sub.A].sub.n-(B/S).sub.Ai are used in said polymer composition, and the production of shrink-wrap films and of multilayer films is described.

A method for producing a polymer latex, including an emulsification step of mixing a polymer solution obtained by dissolution of synthetic polyisoprene and/or a styrene-isoprene-styrene block copolymer in an organic solvent, with an aqueous solution including 0.1 to 30 parts by weight of a rosinate based on 100 parts by weight in total of the synthetic polyisoprene and the styrene-isoprene-styrene block copolymer, and emulsifying the resultant in water to thereby obtain an emulsified liquid, a solvent removal step of removing the organic solvent in the emulsified liquid, and a concentration step of concentrating the emulsified liquid from which the organic solvent is removed, and also adjusting the content rate of the rosinate in the emulsified liquid after concentration, in the range of 0.1 to 3 parts by weight based on 100 parts by weight in total of the synthetic polyisoprene and the styrene-isoprene-styrene block copolymer in the emulsified liquid.

Provided is a resin composition including a resin containing a polymer, a hygroscopic particle, and an organic solvent-soluble dispersant. Preferably the ratio of the dispersant relative to 100 parts by weight of the hygroscopic particle is 0.1 part by weight or more and 1000 parts by weight or less, and the absolute value of the difference in refractive index between the resin and the hygroscopic particle is 0.05 or less. Also provided are a resin film formed by molding the resin composition into a film shape, and an organic electroluminescent device including the resin film.

This invention relates to eco-friendly dip formable solutions and dispersions for making dip formed articles. Some embodiments of the invention include coatable, dip formable, or emulsifiable solution composition comprising one or more styrenic block copolymers in cyclic natural terpenes, such as citrus peel extract which can be used to form an article. In some embodiments dip formable solutions and dispersions comprise of styrenated block copolymers and polyolefins. In some embodiments the styrenated block copolymers are saturated, unsaturated, or a blend. In some embodiments, the styrenated block copolymers comprises an oil or a plasticizer. In some embodiments the articles are made from an emulsion. In some embodiments the articles are made from a plastisol.