The invention relates to a process for preparing a gelled, dried composition forming a monolithic aerogel with a heat conductivity of less than or equal to 40 mW.Math.m.sup.1.Math.K.sup.1 and derived from a resin of polyhydroxybenzene(s) and formaldehyde(s), to this aerogel composition and to the use thereof. This process comprises: a) polymerization in an aqueous solvent of said polyhydroxybenzene(s) and formaldehyde(s) in the presence of an acidic or basic catalyst, to obtain a solution based on the resin, b) gelation of the solution obtained in a) to obtain a gel of the resin, and c) drying of the gel to obtain a dried gel.

According to the invention, step a) is performed in the presence of a cationic polyelectrolyte dissolved in this solvent, and the process also comprises a step d) of heat treatment under inert gas of the dried gel obtained in step c) at temperatures of between 150 C. and 500 C. to obtain the non-pyrolyzed aerogel whose heat conductivity is substantially unchanged, even after exposure to a humid atmosphere.

This invention relates to the production of cured polymeric skin materials. In particular, the invention relates to methods and substrates for the production of skin materials, for example, for use in building, furniture, and as architectural components for example in roofing materials such as roofing tiles, or for brick wall effect materials.

To provide a resin molded body having AlN whiskers with excellent thermal conductivity, and a method for producing the same. The resin molded body includes at least, AlN whiskers each having a fibrous AlN single-crystal body having a surface and an oxygen-containing layer covering the surface of the fibrous AlN single-crystal body, and a resin material, wherein a weight ratio of the AlN whiskers is in a range of 3.0 wt % or more and 65.0 wt % or less.

An object is to provide a resin composition having a high permittivity and a low dissipation factor, and having excellent heat resistance and moisture absorption and heat resistance, and suitably used for producing an insulation layer of a printed wiring board, and a prepreg, a resin sheet, a laminate, a metal foil-clad laminate, and a printed wiring board obtainable by using the resin composition. The resin composition of the present invention contains (A) a surface coated titanium oxide in which a mass reduction rate in heating from 30 C. to 300 C. at a heating rate of 10 C./min is 0.5 mass % or less, and (B) a thermosetting compound.

A composition for producing phenolic foam has at least one phenolic resin, at least one blowing agent, at least one catalyst, and at least one polyethersiloxane. A process produces a phenolic foam with a density of from 5 to 500 kg/m3 with a reaction mixture having the composition.

The present disclosure relates to compositions comprising 2,3,3,3-tetrafluoropropene that may be useful as heat transfer compositions, aerosol propellants, foaming agents, blowing agents, solvents, cleaning agents, carrier fluids, displacement drying agents, buffing abrasion agents, polymerization media, expansion agents for polyolefins and polyurethane, gaseous dielectrics, extinguishing agents, and fire suppression agents in liquid or gaseous form. Additionally, the present disclosure relates to compositions comprising 1,1,2,3-tetrachloropropene, 2-chloro-3,3,3-trifluoropropene, or 2-chloro-1,1,1,2-tetrafluoropropane, which may be useful in processes to produce 2,3,3,3-tetrafluoropropene.