The present invention provides an epoxy resin composition containing:

an epoxy resin [A] that is a compound represented by Chemical formula (1) shown below:

##STR00001##

wherein R.sub.1 to R.sub.4 each independently represent one selected from the group consisting of a hydrogen atom, an aliphatic hydrocarbon group, an alicyclic hydrocarbon group, and a halogen atom, and X represents one selected from —CH.sub.2—, —O—, —S—, —CO—, —C(═O)O—, —O—C(═O)—, —NHCO—, —CONH—, and —SO.sub.2—;

a bifunctional epoxy resin [B] having an amine type glycidyl group;

a curing agent [C] containing an aromatic polyamine, and having at least one substituent selected from an aliphatic substituent, an aromatic substituent, and a halogen atom at an ortho position with respect to an amino group; and

a particulate rubber component [D].

An adherable element is disclosed, comprising a decorative element having a support surface, and a pressure activated adhesive system pre-coated on the support surface of the decorative element for adhering the decorative element to a surface, the adhesive remaining uncured until activated by application of a threshold pressure. The adhesive comprises a matrix comprising a hardener and a plurality of microcapsules filled with an adhesive resin, the microcapsules being configured to rupture on application of the threshold pressure, thereby exposing the resin to the matrix and allowing the resin to react with the hardener to form an adhesive bond between the decorative element and the surface. The matrix may further comprise a rheology additive such that the matrix has a higher viscosity than the hardener at room temperature. Methods of making an adherable element, and decorative articles comprising the adherable element are also disclosed.

An epoxy resin represented by the following formula (1), in which in a total amount of an epoxy compound represented by n=1 in the epoxy resin of the above formula, a total content of an epoxy compound represented by the following formula (2) and an epoxy compound represented by the following formula (3) is 1 area % or more and less than 70 area % in HPLC area percentage.

##STR00001##

A resin composition is provided. The resin composition includes the following constituents: (A) an epoxy resin; (B) an amino group-containing hardener; and (C) a compound of formula (I), ##STR00001##
wherein, R.sup.11 to R.sup.16 and A1 to A2 in formula (I) are as defined in the specification, and the amount of the compound (C) of formula (I) is about 10 parts by weight to about 85 parts by weight per 100 parts by weight of the epoxy resin (A).

A thermosetting resin composition and a prepreg are provided. The thermosetting resin composition includes a maleimide resin, a cyanate ester resin, and a crosslinking agent. The crosslinking agent is a silane-modified diallyl bisphenol compound whose structure is represented by Formula (1): ##STR00001## in Formula (1), X is a linear or branched C1 to C6 alkyl, cycloalkyl, or sulfonyl group, R1 is a linear or branched C1 to C6 alkyl or aryl group, R2 is a C1 to C6 alkyl group, R3 is a functional group with a crosslinkable double bond, and n+m is a positive integer from 1 to 8.

The present invention provides recyclable copper clad laminates (CCLs) each including copper coil and a recyclable/degradable fiber composition, and printed circuit boards that are made of or include the CCLs of this invention. Also provided are method for recycling these CCLs and printed circuit boards.

There are provided an aromatic amine resin represented by the following formula (1) wherein a plurality of R.sub.1's each independently represent a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, provided that a case where all R.sub.1's represent each a hydrogen atom is excluded, m represents an integer of 1 to 4, n represents an integer, and the average value (A) of n represents: 1≦A≦5, which can be utilized for a high-reliability semiconductor, a high-performance fiber-reinforced composite material, and others; an epoxy resin composition containing the aromatic amine resin; and an epoxy resin cured product having properties excellent in high heat resistance and low hygroscopicity, which is obtained by curing the epoxy resin composition.

##STR00001##

Pre-impregnated composite material (prepreg) that can be cured/molded to form aerospace composite parts. The prepreg includes carbon reinforcing fibers and an uncured resin matrix. The resin matrix includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

The present invention provides a resin composition comprising: (A) 100 parts by weight of epoxy resin; (B) from 10 to 80 parts by weight of benzoxazine resin; (C) from 10 to 50 parts by weight of dicyclopentadiene phenol resin; and (D) from 0.5 to 5 parts by weight of amine hardener; wherein the resin composition is free of diallyl bisphenol A (DABPA).

Some embodiments are directed to a process for making a syntactic foam. Some other embodiments are directed to a process for manufacturing a buoyancy material including an outer shell and a syntactic foam. Still other embodiments are directed to the syntactic foam (or buoyancy foam) obtainable by this process. Some other embodiments are directed to a process of undersea extraction of oil including: using the syntactic. Still other embodiments are directed to an undersea extracting pipeline including a pipeline, and either the syntactic foam or the buoyancy material.