Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

The present invention provides a resin composition for a printed wiring board comprising a cyanate compound (A) represented by following general formula (1): ##STR00001##
wherein n represents an integer of 1 or more; and an epoxy resin (B).

Embodiments described herein are directed to compositions comprising nitrogen containing SMA oligomers or polymers in combination with the phosphonate oligomers or polymers. These compositions may be combined with other polymer resins to produce polymer compositions having good electrical, thermal, and mechanical properties combined with flame retardancy.

In an embodiment, an adhesive sheet has an expandable adhesive layer 2 on one side or both sides of a base 1, wherein the expandable adhesive layer 2 contains an epoxy resin including a polyfunctional epoxy resin, a phenol resin as a curing agent, an imidazole-based compound as a curing catalyst, and a temperature-sensitive foaming agent. The adhesive sheet has properties in good balance, such as fast curability, heat resistance, and adhesiveness, and also excellent properties such as thermal conductivity attributed to a good filling property.

An article is reinforced by applying to it a thermally curable composition of a resin mixture of 10% to 60% by weight of a diglycidyl ether of bisphenol-A, 5% to 25% by weight of an epoxy novolac, and 5% to 25% by weight of a reinforcement material comprising carbon fibers. Following application, the composition is cured. In some instances, at least a portion of the diglycidyl ether of bisphenol-A and/or the epoxy phenyl novolac resin may be adducted with an elastomer.

[Problem] To provide a manufacturing method with which a cured resin film can be manufactured at high yield, and which effectively prevents the occurrence of defects such as wrinkles in the cured resin film.

[Solution] Provided is a cured resin film manufacturing method comprising: a first step in which an undried resin film is formed on a support, the undried resin film comprising a heat curable resin composition containing a curable resin and a solvent; a second step in which a curable resin film having a loss of 0.5-7 wt % on heating is formed by drying the undried resin film which has been formed on the support by using a float method to convey the undried resin, which is in the state of having been formed on the support, in a drying device; a third step in which a cured resin film is formed by heat curing the curable resin film; and a fourth step in which the support is detached from the cured resin film.

The present invention provides a siloxane-modified cyclotriphosphazene halogen-free flame retardant, and a preparation method and a use thereof. The siloxane-modified cyclotriphosphazene halogen-free flame retardant has the structural formula as shown in Formula I. In the siloxane-modified cyclotriphosphazene halogen-free flame retardant of the present invention, three kinds of structures of siloxane, aryl phosphorus oxygen compound and cyclotriphosphazene are built in one molecular formula, which combines the advantages of three structures, improves the compatibility between the flame retardant and resins, has a high flame retardant efficiency and a better char formation and can greatly increase the flame retardancy and stability of resin cured products.

A semipreg that can be cured/molded to form aerospace composite parts including rocket booster casings. The semipreg includes a fibrous layer and a resin layer located on one side of the fibrous layer. The resin layer includes an epoxy component that is a combination of a hydrocarbon epoxy novolac resin and a trifunctional epoxy resin and optionally a tetrafunctional epoxy resin. The resin matrix includes polyethersulfone as a toughening agent and a thermoplastic particle component.

The present invention relates to rapid-curing resin formulations as well as fiber-reinforced composite materials comprising the same and their use in the manufacture of molded articles, particularly where the manufacturing process requires high throughput and where resin formulations having consistent handling characteristics (e.g., tack and flexibility) would be preferable across normal to elevated laminating environments (as defined by temperatures between 20 C. and 60 C.). The present invention further relates to a manufacturing process for preparing an article, particularly a molded article, from a fiber-reinforced composite material comprising a rapid-curing resin formulation.

A glass cloth obtained by weaving a glass yarn including a plurality of glass filaments, wherein the compositional amount of B.sub.2O.sub.3 is 20% by mass to 30% by mass in the glass filaments and the compositional amount of SiO.sub.2 is 50% by mass to 60% by mass in the glass filaments, and the loss on ignition of the glass cloth is 0.25% by mass to 1.0% by mass.