Disclosed is a resin composition, comprising the following components: (A) 100 parts by weight of an epoxy resin; (B) 10 to 60 parts by weight of a diamino diphenyl ether type benzoxazine resin having a softening point of 40 C. to 140 C.; (C) 10 to 40 parts by weight of a co-hardener; and (D) 10 to 40 parts by weight of a flame retardant which comprises (d1) a high melting point flame retardant with a melting point of greater than 260 C. or (d2) a metal phosphinate flame retardant, wherein the metal is selected from Group IIIA elements. Also disclosed is an article of manufacture obtained from the resin composition and a use thereof. Accordingly, the demands of high frequency application can be met, and a balance of low thermal expansion, high thermal resistance and low warpage in the system can be struck.

A material includes a base resin; a solvent; and a foaming agent and a photosensitizer, and/or a substance that serves as a foaming agent and a photosensitizer.

A prepreg for printed wiring boards that has a low coefficient of thermal expansion in a plane direction, has excellent heat resistance and drilling workability, and, at the same time, can retain a high level of flame retardance includes a base material, a resin composition impregnated into or coated on the base material, and huntite. The resin includes (A) an inorganic filler that is a mixture composed of a hydromagnesite represented by xMgCO.sub.3.Math.yMg(OH).sub.2.Math.zH.sub.2O wherein x:y:z is 4:1:4, 4:1:5, 4:1:6, 4:1:7, 3:1:3, or 3:1:4; (B) an epoxy resin; and (C) a curing agent. The prepreg can be used to prepare a laminated sheet and a metal foil-laminated sheet.

A resin composition is provided. The resin composition comprises an epoxy resin (A) and a first hardener (B) of the following formula (I):

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wherein Ar, R and n are as defined in the specification, and the molar ratio of the epoxy group of the epoxy resin to the active functional group of the first hardener ranges from about 1:0.4 to about 1:1.6.

An epoxy resin composition includes [A] an epoxy resin, [B] dicyandiamide, [C] an aromatic urea and [D] a boric acid ester and satisfies any one of (i) requirements [a] and [b], (ii) requirements [c] and [d] and (iii) requirements [c] and [e]: [a]: the time from when the temperature reaches 100 C. till when the heat flow reaches a peak top is 60 minutes or shorter as determined by a differential scanning calorimetry; [b]: the time from when the temperature reaches 60 C. till when the heat flow reaches a peak top is 25 hours or longer as determined by a differential scanning calorimetry; [c]: the average in all of the epoxy resins is 165 to 265 g/eq inclusive; [d]: in the component [A], [A1] a resin represented by formula (I) and/or a resin represented by formula (II) is contained in an amount of 10 to 50 parts by mass relative to the total amount of all of the epoxy resins; and [e]: in the component [A], [A2] a glycidylamine-type resin having a functionality of 3 or higher is contained in an amount of 10 to 50 parts by mass relative to the total amount of all of the epoxy resins.

Provided in the present invention are a halogen-free epoxy resin composition, prepreg and laminate using the same, the halogen-free epoxy resin composition comprising: (A) a halogen-free epoxy resin; (B) a crosslinking agent; and (C) a phosphorous-containing phenolic resin, the phosphorous-containing phenolic resin being formed by a synthesis of phenol and formaldehyde with dicyclopentadiene phenol, and being substituted by 9,10-dihydro-9-oxa-10-phosphapheanthrene-10-oxide or a derivative thereof. The prepreg and laminate prepared from the halogen-free epoxy resin composition have a high heat resistance, a low dielectric constant, a low dielectric loss factor and a low water absorption rate, and achieve halogen-free flame retardance.

To provide a phenolic resin having a particular structure and used for obtaining an epoxy resin with low viscosity and excellent handleability, the epoxy resin from which a cured product having high heat resistance and high bending properties (bending strength, bending elastic modulus, bending strain, etc.) can be obtained, a curable resin composition containing the epoxy resin, and a cured product, a fiber-reinforced composite material, and a fiber-reinforced resin molded article obtained from the curable resin composition. A phenolic resin is a reaction product of a resorcinol compound and an orthoxylylene skeleton-containing compound and contains a resorcinol skeleton derived from the resorcinol compound and an orthoxylylene skeleton derived from the orthoxylylene skeleton-containing compound.

In various embodiments, the invention provides an in-situ adduct formed by reacting liquid, solid, and/or semi-solid epoxy resins with a di-carboxylic acid functionalized polymer. The adducting process at least doubles the viscosity of the mixture. A hot melt thermosetting surfacing film and composite formed using the adduct are also disclosed. Methods of preparing and using are also disclosed.

A process for making a phosphorus-containing compound is disclosed. The process comprises contacting a compound of formula (A) wherein R.sup.A and R.sup.B are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups or can be combined to form cyclic structures; and R.sup.C is methyl, ethyl, isopropyl, n-butyl, i-butyl, t-butyl, phenyl or benzyl; and a compound of formula (B) wherein R.sup.1-R.sup.4 are selected from optionally substituted aryl, aryloxy, alkyl and alkoxy groups. The phosphorus-containing compound can then be used as a flame retardants for polymers, especially for epoxy, polyurethane, thermosetting resins and thermoplastic polymers. Such flame retardant-containing polymers can be used to make protective coating formulations and ignition-resistant fabricated articles, such as electrical laminates, polyurethane foams, and various molded and/or foamed thermoplastic products.

Methods and systems and components made according to the methods and systems, are disclosed relating to improved curing methods for epoxy resin-containing composite prepreg materials, wherein the composite prepreg materials are exposed to a flow of ammonia-containing compounds to fully cure the composite prepreg materials at substantially ambient temperatures and pressures.