A material includes a base resin; a solvent; and a foaming agent and a photosensitizer, and/or a substance that serves as a foaming agent and a photosensitizer.

A method for processing a thermoset resin mixed with inorganic fibers; said method comprising combining a thermoset resin, an inorganic fiber and water to produce a dispersion.

A masterbatch composition suitable for use as a flame retardant in extruded polymer foams, and process for manufacturing the same, and extruded foams containing same; the composition comprising: (a) 20 to 40 parts by weight base resin comprising styrene homopolymer or copolymer; (b) 1 to 16 parts by weight acid scavenger comprising an epoxy-based compound; (c) 2 to 6 parts by weight antioxidant comprising an alkyl or aryl phosphite; and (d) 45 to 60 parts by weight flame retardant comprising a non-hexabromocyclododecane (HBCD) brominated polymer or copolymer, wherein the amounts of (a), (b), (c), and (d) total 100 parts by weight; and (e) 0.6 to 10 parts by weight of pH moderator, based on 100 parts of (a) base resin plus (e) water soluble pH moderator.

Provided are an epoxy resin composition, a prepreg, a resin sheet, and a carbon fiber-reinforced composite material, which have high heat resistance, a high elastic modulus, low water absorption, and excellent flame resistance. This epoxy resin is a para-cresol novolac epoxy resin represented by General formula (1), in which a content ratio of components represented by n=1 as measured by gel permeation chromatography is less than 10% by area, and a content ratio of components represented by n=2 as measured by gel permeation chromatography is at least 1% by area and less than 40% by area. ##STR00001## (In the formula, plural R's each independently represent a C1-6 alkyl group, n represents a real number of 1 to 10, and G represents a substituted or unsubstituted glycidyl group.)

The present disclosure discloses a resin composition, and a prepreg, a laminate and a printed circuit board containing the same. The resin composition comprises 100 parts by weight of a halogen-free epoxy resin, 11-37 parts by weight of an active ester resin, and 40-66 parts by weight of a compound represented by Formula (I), wherein n is 2-15; Ac represents an acetyl group. The prepreg, laminate and printed circuit board prepared from such resin composition have a low dielectric loss factor, good flame retardancy, and also have high interlaminar adhesion and a low CTE.

##STR00001##

A curable composition comprising: i) a glycidyl ether of a novolac, comprising or consisting of moieties having the formula (I), wherein —R.sub.a is either always hydrogen or always methyl; —B is either always *—CH2-** or always formula (A); —a fraction of 0.8 to 0.99 of the Y moieties are essentially —O-glycidyl, this fraction being designated as x, and the remainder of the Y moieties, this fraction being designated as (1-x), are divalent bridging spacers of the structure *—O—CH.sub.2—CH(OH)—CH.sub.2—O—** connecting two moieties according to above formula (I); and—n is a number in the range of 0.1 to 3.0; and wherein said novolac glycidyl ether has an epoxy equivalent weight FEW in the range of 160 to 270 g/eq. and the average number of epoxy groups per molecule of novolac glycidyl ether (I), designated as f, is in the range of 2.1 to 5.0; ii) dicyandiamide; and iii) an urea derivative of the formula (II). This composition is stable upon storage at room temperature and fire-retardant. It can be used for preparation of prepregs and in core filling, particularly in the aerospace field.

A resin composition for a fiber-reinforced composite material that makes it possible to improve productivity by suppressing deformation at the time of removal from a mold, in particular, in the PCM method, while achieving both rapid curing and storage stability. The resin composition for a fiber-reinforced composite material includes an epoxy resin (A) including a phenol novolac epoxy resin and a bisphenol A epoxy resin; a phenoxy resin (B); dicyandiamide (C); an imidazole-based curing aid (D); and a phenol-based curing accelerator (E) as essential components, wherein the phenol novolac epoxy resin of the epoxy resin (A) constitutes 40 parts by mass to 75 parts by mass, the bisphenol A epoxy resin constitutes 10 parts by mass to 35 parts by mass, and the phenoxy resin (B) constitutes 5 parts by mass to 15 parts by mass in the total of 100 parts by mass of the components (A) to (E).

A resin composition is comprised of an epoxy resin comprised of a solid epoxy resin and a liquid polyurethane toughener that is dissolved in the epoxy resin and, upon curing of the liquid epoxy resin, the liquid polyurethane toughener phase separates into particles having a particle size of 50 nm to 2 micrometers, an epoxy hardener; and an epoxy soluble latent catalyst. The resin composition provides a more homogeneous infusion of the resin into a fibrous material for forming a prepreg and ultimately an epoxy fiber reinforced composition with improved toughness without sacrificing speed of impregnation or uniformity of the epoxy matrix within the composite.

Provided are a prepreg and an epoxy resin composition that can shorten the combustion time of a molded article. The present invention comprises a prepreg which is formed by impregnating a carbon fiber base material with an epoxy resin composition, wherein the epoxy resin composition comprises component (A): an organic phosphinate metal salt, component (B): an epoxy resin having an oxazolidone structure, and component (C): an imidazole compound or an imidazole compound derivative, and may comprise component (D) a urea compound.

Binder compositions that are formaldehyde free and include a latex emulsion, an epoxysilane, an epoxy dispersion, a polyol or a latex emulsion, a styrenic copolymer having carboxylic acid functionality, an epoxysilane or an epoxy dispersion or a mixture of both, a polyol and, optionally, an additive, wherein the composition does not comprise formaldehyde are described.