The metal-clad laminate includes an insulating layer and a metal layer that exists in contact with at least one surface of this insulating layer. The insulating layer includes a cured product of a thermosetting resin composition that contains an epoxy compound having a number-average molecular weight of 1000 or less and at least two epoxy groups per molecule, a polyphenylene ether, a cyanate ester compound, a curing catalyst, and a halogen-based flame retardant. The halogen-based flame retardant is a flame retardant incompatible and dispersed in the thermosetting resin composition. The metal layer includes a metal substrate and a cobalt-containing barrier layer provided on at least a contact surface side of this metal substrate with the insulating layer. In the metal-clad laminate, the contact surface has, as surface roughness, a ten-point average roughness Rz of 2 m or less.

A fiber-reinforced molding material includes: as essential raw materials, a vinyl ester (A) which is a reaction product of an epoxy resin (a1) having an epoxy equivalent in the range of 180 to 500 and a (meth)acrylic acid (a2); an unsaturated monomer (B) having a flash point of 100 C. or higher; a thermoplastic resin (C); a polyisocyanate (D); a polymerization initiator (E); and carbon fibers (F) having a fiber length of 2.5 to 50 mm. The mass ratio ((A)/(B)) of the vinyl ester (A) to the unsaturated monomer (B) is in the range of 40/60 to 85/15. The molar ratio (NCO/OH) of the isocyanate group (NCO) of the polyisocyanate (D) to the hydroxy group (OH) of the vinyl ester (A) is in the range of 0.25 to 0.85.

The invention provides a powder pre-preg comprising as sole resin a vinyl ester resin having a Tg in the range of 5 to +30 C. and a melt viscosity @100 C. in the range of 2 to 75 dPa.Math.s, which can be used in making a composite at a temperature as low as 80 C.

An epoxy composition may comprise a resin composition comprising a diglycidyl ether of bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The resin composition may further comprise at least one diglycidyl ether of bisphenol A and bisphenol F.

Described herein are articles and methods of making articles, including a transparent composite film having a fiber filler embedded in a polymer network and further including a hard coating. The polymer network of the film is a cured, cross-linked matrix. The hard coating is a cross-linked aromatic urethane acrylate oligomer and a photoinitiator and provides a flexible protective layer that maintains good hardness, puncture-resistance and scratch-resistance.

The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

A sheet molding compound according to a first aspect of the present invention comprises: a thickened product of a resin composition comprising a vinyl ester resin, a thickener, a polymerization initiator, a polymerization inhibitor and isobornyl methacrylate; and a reinforcing fiber.

A fiber-reinforced molding material of the present invention includes a matrix resin and a reinforcing fiber, wherein the matrix resin includes a reactant of the following component (A) and the following component (B), and the following component (C), and a spiral flow length measured in accordance with EIMS T901 is 300 mm or longer, component (A): a component having one or more ethylenically unsaturated groups in one molecule and including at least one selected from the group consisting of the following component (A-1) and the following component (A-2); component (A-1): an unsaturated polyester resin having one or more ethylenically unsaturated groups and one or more hydroxyl groups in one molecule; component (A-2): an epoxy (meth)acrylate resin having one or more ethylenically unsaturated groups and one or more hydroxyl groups in one molecule; component (B): an isocyanate compound; component (C): a radical polymerization inhibitor having no hydroxyl group in a molecule.

The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

A prepreg comprising a fibrous material contacting a polymerizable resin, at least 50 wt % of the polymerizable resin comprising at least one polymerizable monomer having at least two carbon-carbon unsaturated functional groups, the monomer being polymerizable by reaction of the unsaturated functional groups to form a cured resin, wherein the resin has a heat of polymerization of less than 230 KJ/kg to provide a maximum increase in temperature of the prepreg of 60 C. during polymerization under adiabatic conditions.