Provided is a fiber-reinforced composite material molded article including a thick portion having a thickness equal to or greater than 10 mm, in which the thick portion has an inner layer which is formed of a cured material of a composite material (A) containing reinforcing fiber and an epoxy resin and a surface layer which is formed of a cured material of a composite material (B) containing reinforcing fiber and a vinyl ester resin.

Methods, compositions of matter and processes for a base-mediated chemical deconstruction of varying amine-cured epoxy resins into constituent monomer alcohol products and amine materials are disclosed herein.

The present invention relates to a molding material, having: (A): a fiber substrate made of carbon fibers 5 mm or longer; (B): at least either an epoxy (meth)acrylate resin or an unsaturated polyester resin; (C): (C-1) inorganic fibrous filler with a cross-sectional area of at least 0.8 m.sup.2, or (C-2) inorganic flaky filler with a cross-sectional area of at least 0.05 m.sup.2, both of which have an aspect ratio of 2.0 or higher and a length of less than 3 mm; and (D): a polyisocyanate compound.

An apparatus for impregnating fiber structures with a matrix material includes a lower part having a bath for receiving the matrix material and a draining unit. The draining unit includes a wiper having a wiping edge, over which the impregnated fiber structure is guided during operation, and a surface inclined in the direction of the bath, by which matrix material draining from the fiber structure can return into the bath. The draining unit includes a cover on which a deflection unit, by which the fiber structure is pressed into the bath when the cover is mounted, is mounted. When the cover is mounted, a gap is formed between the cover and the lower part on the sides by which the fiber structure is guided into the apparatus and emerges from the apparatus. A method for impregnating fiber structures with a matrix material is also disclosed.

An epoxy composition may comprise a bisphenolic resin composition comprising bisphenol AF and at least one of a filler, a fire resistant component, a chain extender, a conductivity modifier, and a dye. The bisphenolic resin composition may further comprise at least one of bisphenol A and bisphenol F.

A fiber-reinforced resin forming material contains at least a matrix resin and bundled aggregates of discontinuous reinforcing fibers, wherein: the bundled aggregates include both reinforcing fiber aggregates A having a shape formed by cutting after having performed a splitting treatment to completely split the strands of continuous reinforcing fibers into a plurality of bundles of strands, and reinforcing fiber aggregates B1 having a shape that includes unsplit parts where splitting treatment was inadequate and/or reinforcing fiber aggregates B2 having a shape not subjected to splitting treatment; and both the ratio of the weight of the reinforcing fiber aggregates B1 with respect to the total weight of reinforcing fibers in the fiber-reinforced resin forming material, and the ratio of the total weight of the reinforcing fiber aggregates B1 and the reinforcing fiber aggregates B2 with respect to the total weight of reinforcing fibers in the fiber-reinforced resin forming material, are 50-95%.

The disclosure relates to compositions for forming films and the use of said films in three-dimension through-silicon-via (3D TSV) packages. In certain aspects, the disclosure relates to compositions comprising one or more resins, one or more imidazoles with latent thermal activity, one or more inorganic fillers, and one or more additives, to B-stage films prepared from the disclosed compositions, and to cured films obtained after cure of the disclosed compositions.

The beneficial effects of the present application are as follows: the modified epoxy resin is doped with the modified epoxy resin in the buffer layer, the modified epoxy resin is reacted with the first barrier layer under UV irradiation, so that the modified epoxy resin is adhered to the first barrier layer to adhere the buffer layer and the first barrier layer and solve the technical problem that the organic layer and the inorganic layer are easily peeled off in the prior art. The present application also provides a packaging method and an electronic device.

A matrix resin composition for fiber reinforced composite materials is described. The resin is thermosetting and achieves a glass transition temperature of at least 177 C. (Tg), obtained by curing under anaerobic conditions at room temperature. The matrix resin will streamline composite fabrication processes by eliminating the need for heating during the cure process. The implications of this development are significant in terms of the ease of use and elimination of procedural steps. While the resin system was developed specifically for vacuum bagging, it is expected to be viable for other composite fabrication methods including resin transfer molding (RTM) and vacuum-assisted resin transfer molding (VARTM). The resin system is viable for use with carbon fiber reinforcements to fabricate laminates at least 0.20 inches thick. The resulting laminintes have low porosity and mechanical properties equivalent to those prepared with common epoxy matrix resins.

The prepreg includes a first resin layer and a second resin layer disposed on both surfaces of the first resin layer. The first resin layer is a half-cured product of a first resin composition that includes a glass cloth impregnated with the first resin composition and contains no hexagonal boron nitride. The second resin layer is a half-cured product of a second resin composition containing hexagonal boron nitride. The glass cloth has a warp and weft weave density of 54 pieces/25 mm or more. The hexagonal boron nitride has an average particle size ranging from 10 m to 30 m. The hexagonal boron nitride is contained in an amount ranging from 20 parts by mass to 40 parts by mass relative to 100 parts by mass of a residual component other than the hexagonal boron nitride in the second resin composition.