A thin silazane coating cured with short-wavelength UV radiation is highly transparent, exhibits good oxygen-barrier properties, and does minimal damage to quantum dots in a quantum dot-containing film.

Process for the preparation of a fiber-reinforced composite material comprising the step of contacting (i) a radically curable resin, (ii) fibers with a total water content of 0.5-20 wt %, based on the total weight of fibers, (iii) at least one transition metal compound selected from manganese, iron, and copper compounds, and (iv) a peroxide.

Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 m-100 m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

A reinforced hydrogel composite including a porous synthetic or naturally derived retracted membrane material having a void volume, and a hydrogel at least partially filling the void volume; wherein the composite has a low strain (<50%) modulus from about 0.01 to about 10 MPa and a toughness from about 10.sup.4 to about 10.sup.7 J.Math.m.sup.3. Methods for making the reinforced hydrogel composite and articles containing the reinforced hydrogel composite are also provided.

Disclosed is a liquid epoxy molding compound and a preparation method thereof; the liquid epoxy molding compound includes the following raw materials by mass fraction: an inorganic silicon filler: 83%-88%, a naphthalene-based epoxy resin: 5%-10%, an anhydride curing agent: 5%-10%, and an accelerator: 0.1%-0.5%, where the inorganic silicon filler with a particle size of less than 50 m-100 m accounts for 99%; the method includes premixing the naphthalene-based epoxy resin, the curing agent, the accelerator, and the inorganic silicon filler to obtain a mixture; and grinding the mixture to a target particle size, and then performing vacuum degassing to obtain the liquid epoxy molding compound. The small-particle silica is introduced to reduce the increase in length of the liquid epoxy molding compound at the unit temperature during the molding stage.

Multi-phase polymer films of quantum dots (QDs) and their use in light emitting devices (LEDs) are disclosed. The QDs are absorbed in a host matrix, which dispersed within an outer polymer phase. The host matrix is hydrophobic and is compatible with the surface of the QDs. The host matrix may also include a scaffolding material that prevents the QDs from agglomerating. The outer polymer is typically more hydrophilic and prevents oxygen from contacting the QDs.

Multi-phase polymer films of quantum dots (QDs) and their use in light emitting devices (LEDs) are disclosed. The QDs are absorbed in a host matrix, which dispersed within an outer polymer phase. The host matrix is hydrophobic and is compatible with the surface of the QDs. The host matrix may also include a scaffolding material that prevents the QDs from agglomerating. The outer polymer is typically more hydrophilic and prevents oxygen from contacting the QDs.

Multi-phase polymer films of quantum dots (QDs) are disclosed. The QDs are absorbed in a host matrix, which dispersed within an outer polymer phase. The host matrix is hydrophobic and is compatible with the surface of the QDs. The host matrix may also include a scaffolding material that prevents the QDs from agglomerating. The outer polymer is typically more hydrophilic and prevents oxygen from contacting the QDs.

Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.

A prepreg epoxy-based carbon and/or glass and/or Kevlar fiber composite for application to a metal substrate, such as an oil and gas pipeline pipe and water pipe and pipeline repair, includes about 5-50% liquid or solid epoxy; about 5-50% epoxy novolac resin; about 5-10% curing agent; about 5-10% accelerator; about 3-15% rubber modified epoxy resin for toughening; and about 30-70% glass and/or carbon fiber fabric. Also included is a method of making the epoxy prepreg composite and the methods of wrapping the epoxy prepreg composite around the pipeline area to be repaired and using a flexible, electric heat blanket or heat belt to cure the epoxy prepreg composite in the field.