A resin composition includes 100 parts by weight of vinyl-containing polyphenylene ether resin; 8 parts by weight to 20 parts by weight of a compound represented by the following formula (1); and 0.5 parts by weight to 2.5 parts by weight of a compound represented by the following formula (2),

##STR00001## wherein each R.sub.1, R.sub.2, R.sub.3 and R.sub.4 respectively is C.sub.1-4 alkyl or H, and each R.sub.5, R.sub.6, R.sub.7, R.sub.8, R.sub.9, R.sub.10, R.sub.11, R.sub.12, R.sub.13, R.sub.14, R.sub.15, R.sub.16, R.sub.17 and R.sub.18 respectively is C.sub.1 alkyl or H. An article manufactured using the aforesaid resin composition is also provided.

A resin composition includes 100 parts by weight of a vinyl group-containing resin and 35 parts by weight to 65 parts by weight of a phosphorus-containing compound of Formula (1). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion.

##STR00001##

A resin composition includes a vinyl group-containing resin and a phosphorus-containing copolymer, wherein the phosphorus-containing copolymer is prepared from a mixture subjected to a copolymerization reaction, and the mixture includes a vinyl group-containing benzocyclobutene of Formula (1) and a phosphorus-containing compound of Formula (2). The resin composition may be used to make various articles, including a resin film, a prepreg, a laminate or a printed circuit board, and one or more of the properties can be improved, including dissipation factor, copper foil peeling strength, flame resistance and X-axis coefficient of thermal expansion.

##STR00001##

The present disclosure provides a resin composition, including a vinyl group-containing resin and a phosphorus-containing copolymer. The phosphorus-containing copolymer is polymerized from a monomer represented by Formula (1) and a monomer represented by Formula (2). Further, the present disclosure also provides an article made from the aforesaid resin composition, including a prepreg, a resin film, a laminate, or a printed circuit board.

##STR00001##