The present invention relates to a thermosetting resin composition for a semiconductor package and a prepreg using the same. Specifically, a thermosetting resin composition for a semiconductor package which exhibits a low curing shrinkage ratio and has a high glass transition temperature and greatly improved flowability by introducing acrylic rubber and mixing two specific inorganic fillers surface-treated with a binder of a specific composition at a certain ratio, and a prepreg using the same, are provided.

A foam material having one glass transition temperature (Tg) and made from an immiscible composition having at least two glass transition temperatures (Tg) by an extrusion process wherein said composition (C) comprises at least one polyarylene (P1) polymer, wherein more than 50% by moles (moles %) of the recurring units of said (P1) polymer are recurring units (R1) consisting of an arylene group, wherein said arylene group is a hydrocarbon divalent group consisting of one core composed of one benzene ring or of a plurality of benzene rings fused together by sharing two or more neighboring ring carbon atoms, said benzene ring being optionally substituted, wherein each of said arylene group is bound to two other arylene groups of neighboring recurring units (R1) through a first CC bond (E1) and a second CC bond (E2), wherein at least 20 moles % of recurring units (R1) are kink-forming arylene units (R1-b), the remainder being rigid rod-forming arylene units (R1-a) different from arylene.sub.R1.sub._.sub.b units, wherein in said aryleneR.sub.1.sub._.sub.a units the bond (E1) and the bond (E2) are co-linear and anti-parallel towards each other, said (P1) polymer being present in composition (C) in an amount of below 75% by weight (wt. %) and above 10 wt. % based on the total wt. % of (P1) polymer and (PPSU) polymer, and (ii) at least one polyphenylsulfone polymer, said (PPSU) polymer being present in composition (C) in an amount of below 90 wt. % and above 25 wt. % of based on the total wt. % of polyarylene (P4) polymer and (PPSU) polymer.

An electrochemical compressor utilizes an anion conducting layer disposed between an anode and a cathode for transporting a working fluid. The working fluid may include carbon dioxide that is dissolved in water and is partially converted to carbonic acid that is equilibrium with bicarbonate anion. An electrical potential across the anode and cathode creates a pH gradient that drives the bicarbonate anion across the anion conducting layer to the cathode, wherein it is reformed into carbon dioxide. Therefore, carbon dioxide is pumped across the anion conducting layer. The compressor may be part of a refrigeration system that pumps the working fluid in a closed loop through a condenser and an evaporator.

In one embodiment, a polymeric sheet, comprising: a foamed layer comprising a polymeric material, wherein the polymeric material has a Tg of greater than or equal to 100? C.; and wherein the sheet has a weight reduction of 10% to 60%, as compared to a solid sheet of the same geometry and size formed from the same polymeric material. The sheet, at the thickness of 1.0 mm, has a smoke density of less than or equal to 200 particles after four minutes of burning according to ASTM E662-06. The sheet is thermoformable.

The present invention relates to anionic exchange polymers including a poly(phenylene) structure. The structure can include any useful cationic moiety. Methods and uses of such structures and polymers are also described herein. In one instance, such polymers are employed to form a solid membrane.

A composite radius filler material is provided. The composite radius filler includes a resin, a first group of fibers dispersed within the resin, and a second group of fibers dispersed within the resin. The first group of fibers has a first length configured to facilitate orientation in a longitudinal direction. The second group of fibers has a second length that is shorter than the first length, with the second group of fibers configured to facilitate random orientation in a transverse direction.

The present disclosure provides alkaline-stable m-terphenyl benzimidazolium hydroxide compounds, in which the C2-position is attached to a phenyl group having various substituents at the ortho positions. Polymers incorporating m-terphenylene repeating groups derived from these alkaline-stable benzimidazolium hydroxide compounds are also presented, along with their inclusion in ionic membranes and in electrochemical devices.

An ion exchange polymer has an ionomer structure containing poly(phenylene) compound integrated with functionalized poly(fluorene). The ion conducting co-polymer includes a poly(fluorene) compound and a poly(phenylene) compound covalently bonded together. The poly(fluorene) compound has a 9H-fluorene structure that is a polycyclic aromatic hydrocarbon having a center ring with five carbon atoms, and a benzene ring on each of opposing sides of said center ring. The poly(phenylene) compound is covalently bonded to each of the pair of benzene rings of the poly(fluorene) compound. A pair of sidechains extends from the center ring of the poly(fluorene) compound to a respective terminal group. The terminal groups are configured on sidechains of the poly(fluorene) compound and can be converted into functional groups such as quaternary ammonium or n-methyl piperidine functional groups. The ion exchange polymer may include a porous scaffold support.

The present invention relates to a porous membrane suitable for use in high pressure filtration method.

Curable compositions for dynamic epoxy-based thermoset adhesives and/or sealants are provided. Methods of applying the compositions to form strong, low-stress, cured adhesive polymer films are also provided. The cured polymer films use crosslinkers that include disulfide and carbon-nitrogen bonds, wherein the disulfide bonds impart dynamic chemistry to the polymer network structure in order to the achieve adaptable thermoset adhesives and sealants.