Patent classifications
C08J2377/10
POLYAMIDE-LONG GLASS FIBER REINFORCED COMPOSITE MATERIAL AND METHOD FOR PRODUCING THE SAME
A polyamide-long glass fiber reinforced composite material and a method for producing the same are respectively provided. The composite material includes an impregnating material and a glass fiber material. The impregnating material includes a polyamide resin, a toughener, and a compatibilizer. The toughener is an elastomer composed of a first polyolefin material and modified by maleic anhydride. The compatibilizer is a resin material composed of a second polyolefin material and modified by the maleic anhydride. A first melt flow index of the toughener is less than a second melt flow index of the compatibilizer. The glass fiber material is impregnated and covered by the impregnating material. The glass fiber material includes a long glass fiber, and a surface of the long glass fiber is modified by at least one of a hydroxyl group and a carboxyl group.
Aromatic polyamide films for transparent flexible substrates
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300? C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
Base film, preparation method thereof, and cover window and display device comprising same
Embodiments relate to a base film that is colorless, transparent, and excellent in mechanical properties and optical properties, particularly with low moisture permeability, a process for preparing the same, and a cover window and a display device comprising the same. The cover window comprises a base film comprising a polyamide-based polymer and having a moisture permeability of 300 g/m.sup.2.Math.day or less; and a functional layer.
Polymer resin composition, and polymer film, resin laminate using the same
The present disclosure relates to a polymer resin composition including a polyamide resin in which an average particle size of individual crystals measured by a small-angle X-ray scattering apparatus is reduced through an alternating segment structure, and at least one selected from the group consisting of a metal salt compound and an end-capping agent compound, and a polymer film and a resin laminate using the same.
THERMOPLASTIC RESIN COMPOSITION, RESIN SHEET, AND LAMINATED SHEET
The present disclosure provides a thermoplastic resin composition and the like to be used for molding a resin sheet, in which the resin sheet is to be used in cross-linking adhesion with rubber. The thermoplastic resin composition includes a thermoplastic resin including a first polyamide (A) having a melting point of from 180? C. to 230? C. and a block copolymer (B) containing a second polyamide and a polyether. A ratio of a weight of the first polyamide (A) to a weight of the block copolymer (B) is from 65/35 to 85/15, and the thermoplastic resin composition has an amino group concentration of 20 mmol/kg or more.
Process for preparing aerogels from polyamides
Polyamide aerogels and methods of making the same are discussed. One example method can include the act of creating a mixture of at least one diamine with at least one diacid chloride in a first solvent. The mixture can comprise a plurality of amine capped polyamide oligomers. Such a method can also include the acts of adding a cross-linking agent to the mixture to create a gel and performing one or more solvent exchanges to remove the first solvent. Additionally, such a method can include the act of subjecting the gel to supercritical drying to polyamide aerogel.
AQUEOUS POLYIMIDE PROCESSES
The present disclosure is directed to methods of forming polyamic acid and polyimide gels in water. The resulting polyamic acid and polyimide gels may be converted to aerogels, which may further be converted to carbon aerogels. Such carbon aerogels have the same physical properties as carbon aerogels prepared from polyimide aerogels obtained according to conventional methods, i.e., organic solvent-based. The disclosed methods are advantageous in reducing or avoiding costs associated with use and disposal of potentially toxic solvents and byproducts. Gel materials prepared according to the disclosed methods are suitable for use in environments involving electrochemical reactions, for example as an electrode material within a lithium-ion battery.
A NONCOVALENT HYBRID COMPRISING CARBON NANOTUBES (CNT) AND AROMATIC COMPOUNDS AND USES THEREOF
Provided herein noncovalent hybrids comprising carbon nanotubes (CNTs) and aromatic compounds, composites based on them, process of preparation and uses thereof; wherein the hybrids possess superior mechanical and electrical properties.
Aromatic Polyamide Films for Solvent Resistant Flexible Substrates
Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/ C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures >300 C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.
RESIN POWDER FOR SOLID FREEFORM FABRICATION, DEVICE FOR SOLID FREEFORM FABRICATION OBJECT, AND METHOD OF MANUFACTURING SOLID FREEFORM FABRICATION OBJECT
A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 m and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1Tmf2)3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1Cd2)3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): C1>C2 and (C1C2)3 percent.