Patent classifications
C08J2377/10
HARDCOAT FILM AND ARTICLE AND IMAGE DISPLAY DEVICE HAVING HARDCOAT FILM
A hardcoat film includes: a substrate; and a hardcoat layer, in which the hardcoat film satisfies the following Formulas (i) and (ii), (i) E′.sub.(0.4)HC×d.sub.HC≥8,000 MPa.Math.μm, (ii) E′.sub.(4)HC×d.sub.HC≤4,000 MPa.Math.μm, E′.sub.(0.4)HC is an elastic modulus of the hardcoat layer obtained in a case where an elongation rate is 0.4%, E′.sub.(4)HC is an elastic modulus of the hardcoat layer obtained in a case where an elongation rate is 4%, and d.sub.HC is a film thickness of the hardcoat layer.
AROMATIC POLYAMIDE FILMS FOR SOLVENT RESISTANT FLEXIBLE SUBSTRATES
A process for manufacturing a display device, an optical device or an illuminating device includes casting a polyamide solution onto a base at temperature below 200° C. to obtain a film, heating the film on the base at temperature sufficient to make the film solvent resistant and obtain a polyamide film, forming on a surface of the polyamide film one of a display element, an optical element and an illumination element to form a display device, an optical device or an illumination device, and de-bonding the base from the display device, the optical device or the illuminating device. The polyamide solution comprises a solvent, an aromatic polyamide dissolved in the solvent, and a multifunctional epoxyde, where the aromatic polyamide comprises at least one functional group that reacts with an epoxy group, the aromatic polyamide comprises a first repeat unit of formula (I) and a second repeat unit of formula (II)
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RESIN POWDER FOR SOLID FREEFORM FABRICATION, DEVICE FOR SOLID FREEFORM FABRICATION OBJECT, AND METHOD OF MANUFACTURING SOLID FREEFORM FABRICATION OBJECT
A resin powder for solid freeform fabrication has a 50 percent cumulative volume particle diameter of from 5 to 100 μm and a ratio (Mv/Mn) of a volume average particle diameter (Mv) to the number average particle diameter (Mn) of 2.50 or less and satisfies at least one of the following conditions (1) to (3): (1): Tmf1>Tmf2 and (Tmf1−Tmf2)≥3 degrees C., both Tmf1 and Tmf2 are measured in differential scanning calorimetry measuring according to ISO 3146, (2): Cd1>Cd2 and (Cd1−Cd2)≥3 percent, both Cd1 and Cd2 are measured in differential scanning calorimetry measuring according to ISO 3146, and (3): Cx1>Cx2 and (Cx1−Cx2)≥3 percent.
Polymer raw material and polymer material
To provide a polymer material having properties that allow the polymer material to replace a polyimide and a polyamide synthesized from a petroleum raw material, said polymer material being synthesized from a raw material derived from natural molecules. [Solution] This polymer material is obtained by polymerizing a polymer raw material comprising a dimer of 4-amino cinnamic acid or a dimer of a 4-amino cinnamic acid derivative, which are natural molecules, wherein the carboxyl group is protected by an alkyl chain. The TGA curve of a polyamide acid (PAA-1) and a polyimide (PI-1) according to the present invention is shown in FIG. 5.
POLYAMIDE RESIN, AND POLYMER FILM, RESIN LAMINATE USING THE SAME
The present invention relates to a polyamide resin in which an average particle size of individual crystals measured by a small-angle X-ray scattering apparatus is 8.0 nm or less, and a UV-cut slope (dT/dλ) measured for a specimen having a thickness of 45 μm or more and 55 μm or less according to ASTM E424 is 0.25 or more in the range of 10% to 80% transmittance, and a polymer film and resin laminate using the same. In addition, the present invention relates to a polyamide resin with characteristic profile in which a small-angle X-ray scattering function obtained by irradiating the polyamide resin with X-rays having an energy of 10 KeV to 20 KeV using a small-angle X-ray scattering apparatus satisfies Equation 1 and Equation 2, and a polymer film and resin laminate using the same.
Aromatic Polyamide Films for Transparent Flexible Substrates
The present invention is directed toward transparent films prepared from soluble aromatic copolyamides with glass transition temperatures greater than 300° C. The copolyamides, which contain pendant carboxylic groups are solution cast into films using N,N-dimethylacetamide (DMAc), N-methyl-2-pyrrolidinone (NMP), or other polar solvents. The films are thermally cured at temperatures near the copolymer glass transition temperature. After curing, the polymer films display transmittances >80% from 400 to 750 nm, have coefficients of thermal expansion of less than 20 ppm, and are solvent resistant. The films are useful as flexible substrates for microelectronic devices.
Graphene-Reinforced Polymer Matrix Composites
A graphene-reinforced polymer matrix composite comprising an essentially uniform distribution in a thermoplastic polymer of about 10% to about 50% of total composite weight of particles selected from graphite microp articles, single-layer graphene nanoparticles, multilayer graphene nanoparticles, and combinations thereof, where at least 50 wt % of the particles consist of single- and/or multi-layer graphene nanoparticles less than 50 nanometers thick along a c-axis direction. The graphene-reinforced polymer matrix is prepared by a method comprising (a) distributing graphite microparticles into a molten thermoplastic polymer phase comprising one or more matrix polymers; and (b) applying a succession of shear strain events to the molten polymer phase so that the matrix polymers exfoliate the graphite successively with each event until at least 50% of the graphite is exfoliated to form a distribution in the molten polymer phase of single- and multi-layer graphene nanoparticles less than 50 nanometers thick along a c-axis direction.
Resin composition, and prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and wiring board each obtained using said resin composition
A resin composition is provided and includes (A) a modified polyphenylene ether compound terminal-modified with a substituent having a carbon-carbon unsaturated double bond, (B) a maleimide compound containing no phenylmaleimide group and having a hydrocarbon group having 10 or more carbon atoms in the molecule thereof, and (C) at least one selected from a maleimide compound containing a phenylmaleimide group and a maleimide compound having an aliphatic hydrocarbon group having 9 or less carbon atoms in the molecule thereof, in which the content ratio of the component (A) to the component (B) is (A):(B)=20:80 to 90:10 in mass ratio.
AQUEOUS POLYIMIDE PROCESSES
The present disclosure is directed to methods of forming polyamic acid and polyimide gels in water. The resulting polyamic acid and polyimide gels may be converted to aerogels, which may further be converted to carbon aerogels. Such carbon aerogels have the same physical properties as carbon aerogels prepared from polyimide aerogels obtained according to conventional methods, i.e., organic solvent-based. The disclosed methods are advantageous in reducing or avoiding costs associated with use and disposal of potentially toxic solvents and byproducts. Gel materials prepared according to the disclosed methods are suitable for use in environments involving electrochemical reactions, for example as an electrode material within a lithium-ion battery.
LAMINATED FILM AND METHOD FOR MANUFACTURING SAME
The objective of the present invention is to provide a stretched polyamide film which is excellent in laminatability, lamination strength, mechanical properties and shock resistance property and which has effects to prevent goods being broken and protect a content from vibration and shock at the time of transportation when used a various packaging materials. The present invention relates to a stretched polyamide film, wherein a main constituent is nylon 6; at least one surface layer meets the following conditions (1) and (2); and the stretched polyamide film meets the following condition (3): (1) a relaxation degree of a surface layer orientation measured by IR spectroscopy is within a range of not less than 0.3 and not more than 0.5; (2) a crystallization degree of a surface layer measured by IR spectroscopy is within a range of not less than 1.0 and not more than 1.4; (3) a heat shrinkage rate (%) in TD direction at 160° C. for 10 minutes is within a range of not less than 0.6 and not more than 4.