The present disclosure relates to a polyamide block copolymer and a polyamide film including the same.

The polyamide block copolymer according to the present disclosure makes it possible to provide a polyamide film exhibiting excellent mechanical properties while being colorless and transparent.

Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/ C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures>300 C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.

Exemplary embodiments provide systems, devices and methods for the fabrication of three-dimensional polymeric fibers having micron, submicron and nanometer dimensions, as well as methods of use of the polymeric fibers.

Polyamide aerogels and methods of making the same are discussed. One example method can include the act of creating a mixture of at least one diamine with at least one diacid chloride in a first solvent. The mixture can comprise a plurality of amine capped polyamide oligomers. Such a method can also include the acts of adding a cross-linking agent to the mixture to create a gel and performing one or more solvent exchanges to remove the first solvent. Additionally, such a method can include the act of subjecting the gel to supercritical drying to polyamide aerogel.

The embodiments relate to a polyamide-based film that is excellent in solvent resistance and optical properties, to a process for preparing the same, and to a cover window and a display device comprising the same. The polyamide-based film comprises a polyamide-based polymer, wherein when the 3D surface roughness of a first side of the film is measured, the volume (natural volume) between the surface and a reference plane placed at the elevation of the highest peak parallel to the surface plane is 100 m.sup.3 to 2,800 m.sup.3.

Composite materials include a steel matrix with reinforcing carbon fiber formed of individual fibers penetrating into the matrix to substantial depth. The fibers typically have defined diameters and large ratios of penetration depth to fiber diameter. Specified methods for forming the composite materials have a unique ability to achieve the large ratios of penetration depth to fiber diameter.

Composite materials include a steel matrix with reinforcing carbon fiber integrated into the matrix. The composite materials have substantially lower density than steel, and are expected to have appreciable strength. Methods for forming composite steel composites includes combining a reinforcing carbon fiber component, such as a woven polymer, with steel nanoparticles and sintering the steel nanoparticles in order to form a steel matrix with reinforcing carbon fiber integrated therein.

Composite materials include a steel matrix with reinforcing carbon fiber integrated into the matrix, and having unreinforced regions suitable for stamping or other deformation. The composite materials have substantially lower density than steel, and are expected to have appreciable strength within regions having the reinforcing carbon fiber, while having greater deformability in unreinforced regions. Methods for forming composite steel composites includes combining at least two laterally spaced apart reinforcing carbon fiber components, such as a carbon fiber weave, with steel nanoparticles and sintering the steel nanoparticles in order to form a steel matrix with reinforcing carbon fiber integrated therein, and unreinforced regions located in the lateral spaces between carbon fiber components.

Films with optical transmittance of >80% between 400 and 750 nm and with coefficient of thermal expansion less than 20 ppm/ C. are prepared from aromatic polyamides that are soluble in polar organic solvents yet have glass transition temperatures >300 C. The films are cross-linked in the solid state by heating at elevated temperatures for short periods of time in the presence of multifunctional epoxides. Surprisingly, the optical and thermal properties of the films do not change significantly during the curing process. The temperature required for the crosslinking process to take place can be reduced by the presence of a few free, pendant carboxyl groups along the polyamide backbones. The films are useful as flexible substrates for electronic displays and photovoltaic devices.

A method for fusing aramid fibers, wherein a) at least one area of an aramid fiber is treated with an ionic liquid so that the aramid is partially dissolved, b) the aramid fiber is contacted via the dissolved area with another aramid fiber area with pressure being applied to the contact area, and subsequently c) the partially dissolved area of the aramid is re-coagulated.